Model XC2VP30-5FFG676I Brand XILINX

descriptive value

Device Logic Unit 30, 816

Device Logic Unit 30, 816

System programmability is

Lead Finish Tin/Silver/Copper

Maximum processing temperature 245

Maximum number of user I/Os 556

Maximum operating voltage 1.575 V

Minimum operating voltage 1.425 V

Mounting Surface Mount

MSL Level 4

Number of registers 27,392

Operating temperature 0 to 85°C

Number of needles 896

Product dimensions 31 x 31 x 2.8 mm

RAM bit 2 506 752 bit

Reprogrammable Support1

Screening Level Commercial

Speed class 5

Supplier Packaging FCBGA

Typical operating voltage 1.5000 V

The fierce battle between Xilinx and Altera in the advanced process, after Xilinx announced the introduction of the new generation of Ultrascale FPGA products into mass production with TSMC's 20nm, the battle situation began to produce subtle changes. Obviously, after deducting the favor of both ARM camps, Altera chose Intel as its foundry partner, and Xilinx chose TSMC. Judging from the public information recently announced by both parties, it is certain that both parties have invested quite an astonishing amount. R&D resources and funds, such as 16nm FinFET or 14nm tri-gate transistor are extremely advanced processes. Once a fatal error occurs, the existing market situation may completely collapse, and the lagging party will immediately To be ahead, if you want to regain 10%, you must wait until the next generation of the market enters the budding stage to have the opportunity to be ahead in one fell swoop.

Tang Liren, senior vice president of Xilinx and president of the Asia-Pacific region, once pointed out that Xilinx had made mistakes in a certain process node, so that it was at a disadvantage in market competition.

Indeed, compared with many foundries, Intel's manufacturing process is indeed much ahead, but it has been used in its own processors in the past, and rarely used for other purposes. Today, in order to maintain the growth momentum of the company, Intel has taken action and started to grab the wafer foundry pie, which has somewhat forced the foundry leader to make defensive actions and continue to invest R&D funds in advanced manufacturing processes.

According to a report by Nikkei BP, TSMC's 28nm process classification can be roughly divided into: HP, HPM, HPL, and LP, etc., to meet the diverse needs of the market. When it came to 20nm, there were only The next process is available. In other words, from mobile devices to communication base stations, the process must be integrated into a variety of applications. The advantage of this approach is that it is easier to achieve the advantage of economies of scale. The popularity of 20nm technology is even faster. It may be faster than 28nm. Judging from TSMC's existing first-line customer base, it is not too difficult to achieve such a goal. However, based on the years of experience of Chairman Zhang Zhongmou, since both 20nm and 16nm FinFETs are predetermined process blueprints, it is necessary to improve their yields to ensure that the produced chips can meet the needs of customers.

However, Nikkei BP news agency reported that TSMC recently announced at the "Open Innovation Platform (OIP, Open Innovation Platform) Ecosystem Forum" held in California, USA, that it will conduct small-scale mass production of 16nm FinFET by the end of 2013. If you add that Xilinx's 20nm product line will also enter mass production this year, it is not difficult to imagine that TSMC does excel in the mass production speed of advanced processes.

Some EDA (electronic design automation) practitioners once pointed out that TSMC's style is much more stable than other competitors, which is why the company is invincible. Now, TSMC is not only steady and steady , the efficiency is also admirable. This is actually in line with Xilinx's multi-process node supply market strategy. It is not difficult to see how close the cooperation between the two companies is.

But from an objective point of view, Xilinx will hand over all advanced products to TSMC for mass production. I believe that there will be quite high risks. If there is a problem, even UMC or Samsung may not be able to meet Xilinx's product needs. How to deal with it is probably a big worry. But will TSMC make it happen? The author believes that both Zhang Zhongmou and this company have put all their efforts on a single process. From another perspective, TSMC must make it successful, otherwise this company will have no way out. Similarly, Altera and Intel, I believe, are looking at this matter with the same mood.

Company: Yuhang Military Semiconductor Co., Ltd. website; http://www.yhjgic.com

Contact: Mr. Liu

Business Phone; 400-801-6772

Enterprise QQ;_ 2852760362

Tel: 0755-82557010

Welcome to inquire!

Address: Shenzhen Branch Office Room 2003, Bantian People's Government Sub-district Office, No. 5 Huancheng South Road, Longgang District, Shenzhen

Aerospace and military industry XILINX first-level agent spot distributor, price advantage original authentic!

Hello! Welcome to Yuhang Military Industry Group, Yuhang Military Industry is currently a well-known electronic component distributor in China, specializing in, Memory,

FPGA/CPLD diodes, optocouplers, single-chip microcomputers, processors, power chips, amplifiers, MOS tubes, and a series of original channels for superior products, the price exceeds that of peer agents!