illustrate

The HSDL-3211 is a new generation of low-profile antiaircraft guns providing a pass-through logic and IR signal interface - air, serial, half-duplex IR data link. The module is fully compliant with the IrDA physical layer specification version 1.4 low power consumption, from 9.6kbit/s to 1.152mbit/s (MIR) and complies with the IEC 825 class 1 eye safety standard. The HSDL-3211 can be completely shut down for very low power consumption. In off-mid mode, the PIN diode will be inactive, so even in bright ambient light. It is also designed to interface to input/output logic circuits down to 1.8V. These features are ideal for mobile devices that require low power consumption.

feature

Fully compliant with IrDA 1.4 physical layer low power specification - from 9.6kbit/s to 1.152mbit/s (MIR)

Micro packaging

– Height: 2.5 mm

– Width: 8.0 mm

– Depth: 3.0 mm

No data rate switching required

Typical link distance >50 cm Guaranteed temperature performance, -25 oC to 85 oC – key parameters guaranteed over temperature and supply voltage

Low Power Consumption – Low Shutdown Current (1 nA Typical) – Completely Shut Down TXD, RXD and Pin Diodes Typically >100 mV pp supply ripple Excellent EMI performance Vcc supply 2.4 to 3.6 volts with as low as 1.8V I/O Logic Circuit Interface Lead Free Package LED Card In High Protection Designed to Adjust Light Loss of Makeup Window IEC 825 Class 1 Eye Safety

application

Mobile Communications – Cell Phones – Smart Phones – Pagers

Data Communications – Handheld Computer Products – Personal Digital Assistants – Portable Printers

Digital Imaging – Digital Cameras – Photo Imaging Printers

electronic wallet

Small Industrial and Medical Instruments – General Purpose Data Collection Equipment – Patient and Medication Data Collection Equipment

notes:

1. Connect to a 2.4 to 5.5 volt regulator valve through an external series resistor R1. See the table below for recommended series resistor values.

2. Internally connected to the LED driver. Leave this pin unconnected.

3. This pin is used to transmit serial data when the SD pin is low. If this pin is held high for more than 50ms, the LED turns off. Do not float this pin.

4. This pin is capable of driving standard CMOS or TTL loads. No external pull-ups or pull-down resistors are required. When the transceiver is in shutdown mode, the pins are tri-stated. The receiver output echoes the transmitted signal.

5. If this pin is high, the transceiver is in shutdown mode. Do not float this pin.

6. Regulated, 2.4 to 3.6 volts.

7. Connect to ASIC logic controller Vcc voltage or supply voltage. The voltage at this pin must be equal to or less than the supply voltage.

8. Connect to system ground.

9. Connect to system ground through a low inductance trace. For best performance, do not connect directly to transceiver pin GND

10.CX1 must be placed within 0.7cm of HSDL-3211 for best noise immunity.

11. In environments with noisy power supplies, as shown in Figure 1, including CX2 can enhance power supply ripple rejection.

Absolute Maximum Ratings

Applicable when the thermal resistance to ambient is less than or equal to 50°C/W.

Note:

12. The in-band optical signal is a pulse/sequence, and its peak wavelength λp is defined as 850≤λp≤900 nm, and the pulse characteristic is in line with the IrDA series infrared physical layer link specification v1.4.

Electrical and Optical Specifications

Specifications (min and max) are maintained at recommended operating conditions unless otherwise noted. Unspecified test conditions may be anywhere within its operating range. All typical values (typ) are at 25°C with Vcc set to 3.0 and VIOVcc set to 1.8V unless otherwise noted.

notes:

13. For in-band signals from 9.6 kbit/s to 115.2 kbit/s, where 9 μW/cm 2 ≤ EI ≤ 500 mW/cm 2 .

14. For in-band signals from 0.576 mbit/s to 1.152 mbit/s, where 22.5 μW/cm 2 ≤ EI ≤ 500 mw/cm 2 .

15. Delay time refers to the time from the last TxD optical output pulse to the time the receiver returns to full sensitivity.

16. Receiver wake-up time is from Vcc power up or SD pin high-to-low transition to valid RXD output.

17. The maximum optical pulse width is the maximum time the LED remains lit when TXD is continuously high. This is to prevent the LED from being turned on for a long time to protect eye safety.

The reflow profile is a straight line - the noun line represents the temperature profile of the convection - reflow process. This temperature distribution is divided into 4 processing zones, each processing zone has a different rate of temperature change over time. The time rates are detailed in the table above. Measure the temperature at the board connection at the component to be printed. In processing area P1, the PC board and HSDL-3211 honeycomb pins are heated to 160°C to activate the solder paste. The temperature ramp rate R1 is limited to 4°C per second for PC board and HSDL-3211 cellular. Process zone P2 should be of sufficient duration (60 to 120 seconds) to dry the solder paste. The temperature rises slightly below the liquidus of the solder joint, typically 200°C (392°F). Process area P3 is a solder reflow area. The temperature in the P3 zone is rapidly raised above the solder liquidus to 255°C (491°F) for best results. The dwell time above the liquidus point of the solder should be between 20 and 60 seconds. It usually takes 20 seconds to ensure that the solder balls are soldered into liquid solder with a good solder forming connection. Beyond the dwell time of 60 seconds, growth within the intermetallic solder connection can become excessive and, as a result, form a weak and unreliable connection. This temperature is then quickly reduced to the solid temperature of the solder, typically 200°C (392°F) to allow the solder to freeze to the solid during the connection. Process zone P4 is the cooling zone after the solder freezes. Cool down the rate R5, the solder temperature reaching 25°C (77°F) from the liquidus point should not exceed the 6°C maximum per second. This limitation is to allow the PC board and the HSDL-3211 cell to change size evenly, minimizing stress on the HSDL-3211 transceiver.

The recommended metal solder stencil opening is only 0.152 mm (0.006 inch) or 0.127 mm (0.005 inch) thick solder paste stencil printing. This is to ensure adequate volume of printed solder paste and no shorts. See the table below on the drawing for the combined aperture of the metal formwork and the thickness of the metal formwork that should be used. Guard cutouts are in a 2.7 mm x 1.25 mm (by land) pattern.

Land adjacent to adjacent land prohibition and solder mask areas is the unit that occupies the largest space relative to the land pattern. There should be no other SMD components within this area. The minimum solder mask width required to avoid soldering bridging adjacent pads is 0.2 mm. It is recommended that the two datum intersections be in the middle - unit pad length alignment. Note: Wet/Liquid Photo - Imageable Solder Mask/Mask Recommended.

Appendix B: Printed Circuit Board Layout Recommendations The following PCB layout guidelines - for good PSRR and EM immunity yield good electrical performance. Precautions:

1. The ground plane should be continuous under the part, but should not extend to the shield trace.

2. The shield traces are wide and low inductance traced back to the system ground. CX1, CX2, and optional filter capacitors are provided if a clean power supply is used.

3.Vled can be connected to unfiltered or unfiltered-related power supply. If VledVcc is provided with the same power, it does not need to be used as well as the connection of CX1 to CX2 should be in the current limiting resistor R1. In noisy environments, including capacitor CX2 can enhance the rejection of supply. CX1 is generally a ceramic capacitor with low inductance providing a wide frequency response CX2 and CX3 are tantalum bulk capacitors with a fast frequency response. This using a tantalum capacitor is more important on the Vled line, which has a lot of current. CX4 is an optional ceramic capacitor, similar to CX1, for the IOVcc line.

4. A multi-level meeting should be accustomed to providing enough space for the aircraft. Use the layers below - below and near the transceiver

The area below the module is on the second floor, and all directions around the 3 cm module are defined as the critical point plane area. horizon

The connection board layer between the Vcc module and the sandwich ground and the ground. See the image below for an example of a four-layer board. The area should be maximized. See Application Note AN1114 or Avago IrDA Data Links for detailed design guidelines. The layout below is based on a 2-layer printed circuit board.

illustrate

HSDL-3211, low cost small size infrared transformer-ceiver, designed to solve the mobile computing market PDA, and small embedded digital mobile products such as cameras and cell phones. It is fully compliant with the IrDA 1.4 low 9.6kb/s power specification to 1.152 Mb/s, and supports HP-SIR and TV remote control modes. The HSDL-3211 design includes the following only

Features: Small number of passive components. Low power shutdown mode consumption requirements. Input/Output Logic Interface Circuits Down to 1.8V Selection of Resistor R1 Resistor R1 should be selected to provide an appropriate range of peak pulsed LED current Vcc as shown in the table below. Interface with recommended I/O chip HSDL-3211 TXD data input buffer to allow CMOS drive level. No peaking circuits or capacitors required. Data rates from 9.6kb/s to 1.152mb/s are available from the RXD pin. The block diagram below shows how the infrared interface works with the cell phone and PDA platform.

Link distance testing is done using a typical HSDL-3211 unit with SMC FDC37C669 and FDC37N769 Super I/O Controller. Infrared link distance up to 75cm for the sir and mir to go all out.

Optical Port Dimensions HSDL-3211 To ensure IrDA compliance, some heights and widths of windows exist. This ensures that the minimum size conforms to the IrDA taper angle without vignetting. Maxi - Maximum size minimizes the effects of stray light. Mini - maximum size corresponds to cone 30° and maximum angle size corresponds to cone angle 60°. In the image below, X is the width of the window, Y is the height of the window, and Z is the HSDL-3211 to the back of the window. The distance from the center of the LED lens to the photodiode lens, K, is 5.1 mm. Calculate the window size as follows

Follow: X=K+2*(Z+D)*Tana Y=2*(Z+D)*Tana The above equation assumes that the thickness of the window is the same as the module with the window behind (Z). If they are comparable, Z' replaces Z in the above equation. Z' is defined as Z'=Z+t/n where "t" is the window and "n" is the refractive index window material index. The depth of the LED image in the HSDL-3211, D, is 3.17 mm. "A" is the desired half angle of view. For Adidas compliance, min 15' max 30°. Assyria - the thickness of the adjustment window is negligible, and the equation results are shown in the table and figure.

window material

Almost any plastic material will be used as window material. Polycarbonate is recommended. The surface finish of the plastic should be smooth without any texture. Infrared filters may be used to make windows that look dark to the eyes, but the total optical loss of the window is preferably 10% or less of optical performance. Optical loss should be measured at 875nm. Recommended plastic cosmetic window materials are available from GE Plastics. The shape of the window The window should be flat from an optical point of view. This ensures that the window does not change the radiating mode or the receiving mode of the photodiode. If the window must be curved for mechanical or industrial design reasons, do the same curve for the back radius of the window as for the front. But this won't completely remove the effect of the front surface of the lens, it will greatly reduce it. The amount of variation radiation pattern depends on - the dent on the material selected for the window, the radius of the front and rear curves, and from the back surface to the transceiver. Once these items are known, the lens design can remove the effect of the front curve curve. The image below shows the surface window pair radiation pattern. In all cases, the center thickness window is 1.5mm, the window is made of polycarbonate plastic, and the distance from the transceiver to the back window is 3mm.