illustrate

The HSDL-3612 is a low-profile model infrared transceiver module that provides an interface between logic, airborne infrared signals, and a serial half-duplex infrared data link. The module complies with IrDA Data Physical Layer Specification 1.4 and IEC825 Class 1 Eye Safety.

application

Digital Imaging – Digital Cameras – Photo Imaging Printers Data Communications – Notebook Computers – Desktop Computers – Win CE Handheld Products – Personal Digital Assistants (PDAs) – Printers – Fax Machines, Copiers

– Screen Projectors – Automated Computers – Dongles – Set Top Boxes Telecom Products – Cell Phones – Pagers Small Industrial and Medical Instruments – General Purpose Data Collection Equipment – Patient and Medication Data Collection Equipment

feature

Full compliance with IrDA 1.0 physical layer specification – 9.6 kb/s to 115.2 kb/s operation Typical link distance >1.5 m IEC825 Class 1 eye-safe low power operating range – 2.7 V to 5.25 V Small module size – 4.0 x 12.2 x 5.1mm (HxWxD) Full Shutdown – TXD, RXD, PIN Diodes Low Shutdown Current – 10 nA Typical Dimmable Power Management – Adjustable LED Drive Current Maintains Link Integrity Integrated EMI Shielding – Excellent Noise Immunity Edge Detection Input – Prevents LED from getting longer boot time with various super I/O and controller devices designed to accommodate loss of light makeup window Only two external components required

HSDL-3612 contains - high speed and high efficiency 870nm light emitting diode, silicon pin diode and integrated circuit. The integrated circuit contains the LED driver and receiver providing a single output (RXD) for all supported data rates. The HSDL-3612 can be completely shut down for very low power consumption. In shutdown mode, the cipher diodes will not work and therefore - current even in very bright ambient light conditions. The HSDL-3612 also includes adjustable optical power. With two programming pins; Mode 0 and Mode 1, the optical power output can be turned down when the desired nominal link distance is one-third or two-thirds of a full IrDA link. The HSDL-3612 front view option (HSDL-3612-007/-037) and top view packaging option (HSDL-3612-008/-038) to integrate a protective cover to help ensure low EMI emissions and immunity to EMI fields High noise immunity and therefore increased reliability.

notes:

1. In-band El≤115.2kb/s.

2. A logic low is an impulse response. The duration of this condition depends on the intensity of the event.

3. In order to maintain low shutdown current, TXD needs to be driven high or low instead of being left floating.

notes:

4.CX1 must be placed within 0.7cm of HSDL-3612 for best noise immunity.

5. In the "HSDL-3612 Functional Block Diagram" on page 1, it is assumed that Vled and V CC share the same supply voltage and filter capacitor. If the two pins are powered by different supplies, CX2 is for Vled and CX1 for V CC. In environments with noisy power supplies, including CX2 on the V CC line can enhance power rejection performance.

Electrical and Optical Specifications

Specifications retain recommended operating conditions unless otherwise stated. Unspecified test conditions are within their operating range. All typical values are at 25°C and 3.3 V unless otherwise noted.

Electrical and Optical Specifications

Specifications retain recommended operating conditions unless otherwise stated. Unspecified test conditions are within their operating range. All typical values are at 25°C and 3.3 V unless otherwise noted.

notes:

7. A logic low is the impulse response. The duration of this condition depends on the pattern and intensity of the incident intensity.

8. The in-band optical signal is a pulse/sequence, and its peak wavelength lp is defined as 850≤lp≤900 nm, and the pulse characteristic is in line with the IrDA serial infrared physical layer link specification.

9. For in-band signals ≤ 115.2 kb/s, where 3.6 μW/cm 2 ≤ EI ≤ 500 mW/cm 2 .

10. The wake-up time is the time between the transition from the off state to the active state and the time the receiver is active and ready to receive an infrared signal.

A reflow profile is a straight line - a linear representation of the noun a temperature profile for a convection reflow soldering process. The temperature distribution is divided into four processing zones with different temporal temperature change rates. This time rate is detailed above the table. The temperature is measured at the assembly to the printed circuit board connection. In process zone P1, the PC board and the HSDL-3612 honeycomb I/O pins are heated to a temperature of 125°C to activate the flux in the solder paste. The rate of temperature gradient rise, R1, is limited to 4°C per hour. The second is to heat evenly the PC board and the HSDL-3612 cellular I/O pins. Process area P2 should be of sufficient duration (>60 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder, typically 170°C (338°F).

Process area P3 is a solder reflow area. The temperature rises rapidly above the solder liquidus in the P3 zone to achieve optimum temperature results of 230°C (446°F). The dwell time above the liquidus point of the solder should be between 15 and 90 seconds. It usually takes 15 seconds to ensure that the solder balls are soldered into liquid solder with a good solder forming connection. Beyond the dwell time of 90 seconds, the intermetallic solder grows excessively within the connection, resulting in the formation of weak and unreliable connections. This temperature is then quickly reduced to the solid state temperature of the solder, typically 170°C (338°F), to allow the solder at the connection to freeze solid. The process area P4 is the cold area where the solder freezes and drops. The cooling rate R5, 25°C (77°F) from the liquidus point of the solder should not exceed - at most 3°C per second. This limitation is necessary for the PC board and the HSDL-3612 to change the cellular I/O pin size uniformly and place minimal stress on the HSDL-3612 transceiver.

To ensure IrDA compliance, some restrictions on height and width of windows exist. Minimum dimensions ensure compliance with IrDA taper angles without vignette. The maximum size minimizes the effect of stray light. The smallest dimension corresponds to 30 and the largest dimension corresponds to 60 degrees. In the image below, X is the width of the window, Y is the height of the window, and Z is from HSDL-3612 to Appendix C: Optical Port HSDL-3612 Dimensions: Behind the Window. The distance from the center of the LED lens to the photodiode lens, K, is 7.08mm. Calculate the window size as follows

X = K + 2*(Z+D)*tanA

Y = 2*(Z+D)*tanA

The above equation assumes that the thickness of the window is the same as the module with the window behind (Z). If they are comparable, Z' replaces Z in the above equation. Z' is defined as Z'=Z+t/n

where "t" is the window and "n" is the refractive index window material index. The depth of the LED image is 8 mm within the HSDL-3612, D. "A" is the desired half angle of view. For Adidas compliance, the minimum is 150 and the maximum is 30. Assuming the windows are negligible, the equation results in the following table and graph:

Window Material Almost any plastic material will be used as a window material. Polycarbonate is recommended. The surface finish of the plastic should be smooth without any texture. Infrared filters may be used to make windows that look dark to the eyes, but the total optical loss of the window should be 10% or less for optimal optical performance. Light loss should be measured at 875 nm. The shape of the window The window should be flat from an optical point of view. This ensures that the window does not change the radiating mode or the receiving mode of the photodiode. If the window must be curved for mechanical or industrial design reasons, do the same curve for the back radius of the window as for the front. But this won't completely remove the effect of the front surface of the lens, it will greatly reduce it. The amount of radiation pattern varies depending on the material chosen for the window, the radius of the front and the curve behind the back and the distance from the back surface to the transceiver. Once these items are known, the lens design can be such that it can remove the effect of the front curve curve. The image below shows the surface window pair radiation pattern. In all cases, the center thickness window is 1.5mm, the window is made of polycarbonate plastic, and the distance from the transceiver to the back window is 3mm.