illustrate

The HSDL-9001 is a low-cost, low-cost, analog output environment photodiode in a low-cost miniature quad-lead (QFN) lead-free surface mount package. It consists of a photodiode that emits vortices that peak at 550 nanometers in the human body. As a result, it provides excellent responsiveness, close to responsiveness. It provides an alternative design to the HSDL-9000 digital output Infinite Ambient Light Sensor Light Detection Threshold Control. Both are HSDL-9000. The HSDL-9001 is ideal for applications where ambient light measurement is used to control display backlighting. Mobile applications such as cell phones and PDAs that draw high current from the display backlight will benefit from incorporating the HSDL-9000 and HSDL-9001 into their designs to reduce power consumption significantly.

feature

Excellent responsiveness, peaking in the human body Photometric curve at 550nm Close response to the human eye Micro QFN surface mount components

Height 0.60 mm

Width 2.00 mm

Depth 1.50 mm

Infinite ambient light detection threshold control

Guaranteed temperature performance

-40oC to 85oC

VCC supply 2.7 to 3.6 V

Lead-free and RoHS compliant

application

Detects ambient light to control display backlighting

Mobile devices: mobile phones, PDAs

Computing devices: laptops, web pages

Consumer Devices: TVs, Camcorders, Digital Cameras

Daylight and artificial light exposure devices

Electrical and Optical Specifications

Specifications (min and max) are maintained at recommended operating conditions unless otherwise noted. not specified

Test conditions may be anywhere within its operating range.

All typical values (typ) are at 25°C with VCC at 3.0 V unless otherwise noted.

notes:

1. The illuminance of CIE standard light source (incandescent lamp).

2. Fluorescent lamps are used as light sources. However, in mass production, white LEDs were replaced.

Reflow profile is nominal

Temperature profile of the convection reflow process. The temperature distribution is divided into four processing zones with different temporal temperature change rates. See the table above for time and price.

measure temperature

Board connections at the components to be printed. In process zone P1, the PC board and I/O pins are heated to a temperature of 160°C to activate the flux in the solder paste. The air temperature rise rate R1 is limited to 4°C / The second is the -9001 input/output pin for heating uniform PC board and HSDL.

Process area P2 should be

Sufficient duration (60 to –120 seconds) to dry the solder paste. The temperature rises slightly below the liquidus of the solder joint, typically 200 degrees Celsius (392 degrees Fahrenheit). Process area P3 is a solder reflow area. The temperature in the P3 zone is rapidly raised above the solder liquidus to 255°C (491°F) for best results. The dwell time above the liquidus point of the solder should be between 20 and 60 seconds. It usually takes 20 seconds to ensure that the solder balls are soldered into liquid solder with a good solder forming connection. Beyond the dwell time of 60 seconds, the intermetallic solder grows excessively within the connection, resulting in the formation of weak and unreliable connections. This temperature is then quickly reduced to the solid state temperature of the solder, typically 200°C (392°F), to allow the solder at the connection to freeze solid.

Process zone P4 is the cooling zone

After the solder freezes. Cool rate R5, from 25°C (77°F) the solder should not exceed -6°C maximum per second. This limitation is to allow the PC board and transceiver's cellular I/O pins to change size evenly, keeping the stress down to the minimum HSDL-9001 standard.

Appendix A: SMT Assembly Application Instructions

1.0 Pads, masks, and metal plate openings

1.2 The recommended metal solder stencil opening is recommended to be only 0.152 mm (0.006 inch) thick for solder paste printing with stencils. This is to ensure adequate volume of printed solder paste and no shorts. The opening of the guard plate is subject to the type of land.

1.3 The land adjacent to the adjacent land prohibition and solder mask areas is the unit pattern of maximum occupied space relative to the land. There should be no other SMD component areas. The minimum solder mask width required to avoid soldering bridges adjacent pads is 0.2 mm.

Note: Wet/liquid photoimageable solder mask/mask recommended.

Optical window size to ensure that the windows of the HSDL-9001 are not properly designed in size and window design. There is a minimum size limit window, which is placed in front of the photodiode

Does not affect the response of the angular HSDL-9001. The minimum size recommended will ensure at least a ±35° light receiving cone. If a smaller window is required, light tubes or light guides can be used. A light pipe or light guide is a cylindrical transparent plastic that makes use of total internal reflection to focus light.

The thickness of the windows should be kept to a minimum probably because approximately 8% of the power per optical window is due to reflection (4% per side) and an additional energy loss in the plastic material.

The picture illustrates these two window types we recommend, which can be flat or flat with light tubes.