The interface circuit meets all ElA high-speed RS-232E and V.28 specifications and is especially suitable for applications where 616174; 12V is not available. The redesigned transmit circuit increases the data rate and slew rate making it suitable for ISDN and high-speed modems. The transmitter output and receiver input are protected against electrostatic discharge (ESD). They need a +5V power supply and a converter 5V power supply with built in charge pump voltage to generate +10V and -10V supplies. This family of devices offers high-speed RS-232 transmitter/receiver combinations to suit a variety of applications (see selection table). The HIN206E , HIN211E, and HIN213E feature a low-power shutdown mode to save battery-powered energy applications. Additionally, the HIN213E provides two active receivers in shutdown mode for easy "wake up" capability. The driver features true TTL/CMOS input compatibility, slew rate limited output and 300-61527 supply impedance. The receiver can handle inputs up to 6161730V and has a 3k 615271; to 7k'61527; input impedance. The receiver also has hysteresis which greatly improves noise rejection.

feature

PB-Free plus anneal available (“Rohs compliant”) high speed ISDN compliant. Page: 1 Page: 1 Page: 1 Page: 1 Page: 1 Page: 1230kbits/s

ESD Protection for RS-232 I/-O PINS to=6161715KV (-IEC61000)

Meets All RS-232 and V.28 Specifications only require 0.1,f or larger external capacitors Two receivers active in shutdown mode (HIN213) only 5 V Power SupplyOnboard volute double/inverter

Low Power Consumption Pages: 1 Pages: 1 Pages: 1 Pages: 1 Pages: 1 Pages: 1 Pages: 1 Pages: 15MA

Low power off function page: 1 page: 1 page: 1 page: 1 page: 11.1.a

Three-State TTL/CMOS receiver outputs multiple drivers

6161710V output converted to +5V input -300, 61527; Power-off source impedance output current limit - TTL/CMOS compatible multiple receivers = 6161730V input voltage range Input impedance; input impedance 0.5V hysteresis for enhanced noise suppression

application

Any system requiring high-speed RS-232 communication port computer - portable, MINFRAME, LAPTOP peripheral printers and terminal meters, UPS modems, ISDN terminal adapters

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Lead-free PDIPs can only be used for through-hole wave solder processing. They are not suitable for reflow process applications.

notes:

1. Intersil lead-free + annealed products feature a special lead-free material set; molding compound/mold connection material and 100% matte tinplate termination finish, RoHS compliant, and compatible with SnPb and lead-free soldering operations. Intersil's lead-free products are MSL classified at lead-free peak reflow temperatures that meet or exceed the lead-free requirements of IPC/JEDEC J STD-020.

2. Please refer to TB347 for reel specifications.

Note:

3. θJA is measured in free air with components mounted on the evaluation PC board.

Electrical specification test conditions: VCC=+5V～±10%, (VCC=+5V～±5%HIN207E); C1-C4=0.1℉; TA=operating temperature range

Electrical specification test conditions: VCC=+5V～±10%, (VCC=+5V～±5%HIN207E); C1-C4=0.1℉; TA=operating temperature range (continued)

notes:

4. Guaranteed by design.

5. Reach level 4.

Detailed description

The HIN2XXE series transmitters/receivers for high-speed RS-232 are powered by a single +5V power supply, have low power consumption, and meet all ElARS232C and V.28 specifications. The circuit is divided into three parts: charge pump, transmitter and receiver. The equivalent circuit of the charging pump is shown in the figure. The priming pump consists of two parts: a voltage multiplier and a voltage inverter. Each section is driven by a two-phase internally generated clock to generate +10V and -10V. The nominal clock frequency is 125 kHz. During the first phase of the clock, capacitor C1 charges VCC. In the second stage, the voltage on C1 is added to VCC, producing a signal on C3 equal to twice VCC. In the second phase, C2 is also charged to 2VCC, and then in the first phase, it inverts with respect to ground to produce a signal on C4 equal to -2VCC. The charge pump accepts input voltages up to 5.5V. The impedance (V+) of the output voltage doubling section is about 200 μm, and the output impedance of the voltage inverter section (V) is about 450 Ω. A typical application uses 0.1µF capacitors for C1-C4, but the value is not critical. Increasing the value of C1 and C2 will reduce the output impedance of the voltage doubler inverter, increasing the value of the reservoir capacitor, C3C4, reducing the ripple on the V+ and V- supplies. During shutdown mode (HIN206E, HIN211E, and HIN213E) the charge pump is turned off, V+ is pulled to VCC and Vis is pulled to GND, reducing supply current to less than 10µA. Transmitter outputs are disabled and receiver outputs (except HIN213E, R4 and R5) are placed in a high impedance state.

transmitter

The transmitter is a TTL/CMOS compatible inverter converting the input to an RS-232 output. The input logic threshold is approximately 26% of VCC, or 1.3V when VCC=5V. A 1 at the logic input results in a voltage between -5V and V-at the output and a logic 0 results in a voltage between +5V and (V+-0.6V). Each transmitter input has an internal 400k pull-up resistor so that any unused input can remain unconnected with its output still low. The output voltage swing complies with the RS-232C specification, and the minimum value is ±5V. The worst case is: all transmitters drive 3k minimum load impedance, VCC=4.5V, and the maximum allowable operating temperature. The transmitter has an internal limit to output slew rate less than 30V/(s). The output is short-circuit protected and can be dropped indefinitely. Power-off output impedance is at least 300 2V at the output, and VCC=0V.

receiver

The receiver input accepts voltages up to ±30V while presenting a 3k to 7k input impedance (VCC=0V) even when powered down. The receiver's typical input threshold is 1.3V, within the ±3V range, called the transition region, and falls under the RS-232 specification. The receiver output is 0V to VCC. When the input is greater than 2.4V, when the input is floating or driven between +0.8V and -30V. The receiver features 0.5V hysteresis (except during shutdown) to improve noise rejection. The receiver enable line EN (EN on HIN213E), when not plugged in, disables the receiver outputs, placing them in high impedance mode. The receiver outputs are also in high-impedance state mode when in shutdown (except for HIN213E R4 and R5).

HIN213E stop running

HIN213E has two receivers R4 and R5 which remain active in shutdown mode. The receiver propagation delay is typically 0.5µs during normal operation. During shutdown, the propagation delay may increase slightly. When entering the shutdown mode, the receiver R4 and R5SD=VIL are invalid within 80μs. Exit mode on exit, all receiver outputs will be inactive until the charge pump circuit reaches normal operating voltage. This is typically less than 2ms when using a 0.1µF capacitor.

application information

HIN2XE can be used for all RS-232 data terminals and communication links. It is especially useful in applications where a ±12V power supply is not provided by conventional RS-232 interface circuits. The application shows a typical interface configuration. A simple duplex RS-232 port with CTS/RTS handshake is shown in Figure 7. Fixed output signals such as DTR (Data Terminal Ready) and DSR (Data Signaling Rate Select) are driven through a 5kΩ resistor to connect to V+. In applications requiring four RS-232 inputs and outputs (Figure 8), note that each circuit requires two charge pump capacitors (C1 and C2), but can share the reservoir capacitors (C3 and C4). The shared benefit of the storage capacitor is the elimination of both capacitors and the reduction of the charge pump source impedance effectively increases the transmitter output swing.

Mold characteristics

Metallization: Type: Aluminum

Thickness: 10k

Ground Passivation: Substrate Potential

Type: Nitride on Silox

Nitride thickness: 8k

Silo thickness: 7k

Transistor count: 185

Process: CMOS Metal Gate

notes:

1. Control size: inches. If English and metric dimensions, imperial dimensions control.

2. Dimensions and tolerances conform to ANSI Y14.5M-1982.

3. Symbols Publication No. 95 is defined in Section 2.2 "List of MO Series Symbols".

4. Dimensions A, A1 and L are measured with the unit in JEDEC seat gauge GS-3.

5. D, D1 and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 in. (0.25 mm).

6. Measure with a wire perpendicular to the reference plane.

7.eB and eC are measured at the end of the lead, the lead is not restrained. eC must be zero or greater.

8.B1 maximum dimension does not include DAMBAR bumps. Dambar protrusions shall not exceed 0.010 inches (0.25 mm).

9. N is the maximum number of terminal positions.

10. Corner leads (1, N, N/2 and N/2+1) for E8.3, E16.3, E18.3, E28.3, B1 dimension for E42.6 is 0.030-0.045 inches (0.76- 1.14 mm).

E16.3 (JEDEC MS-001-BB Issue D) 16-lead dual in-line plastic packaging

notes:

1. Symbols Publication number 95 is defined in Section 2.2 "List of MO Series Symbols".

2. Dimensions and tolerances conform to ANSI Y14.5M-1982.

3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusions and gate burrs must not exceed 0.15mm (0.006 inches) per side.

4. Dimension "E" does not include read and write gaps or protrusions. Intelli flashes and protrusions must not exceed 0.25 mm (0.010 in) per side.

5. The chamfer on the body is optional. If not present, a visible index feature is shown that must lie within the cross-hatched area.

6. "L" is the length of the terminal soldered to the substrate.

7. "N" is the number of end positions.

8. The displayed terminal numbers are for reference only.

9. Wire width "B", measured ≥ 0.36mm (0.014") seat plane shall not exceed a maximum of 0.61mm. (0.024 inches).

10. Control size: mm. Converted inch sizes are not necessarily accurate.

M16.15 (JEDEC MS-012-AC Rev. C) 16 Conductor Narrow Body Small Outline Plastic Packaging

notes:

1. These package dimensions are in JEDEC MO-153-AB, Rev. E.

2. Dimensions and tolerances conform to ANSI Y14.5M-1982.

3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusions, and gate burrs must not exceed 0.15mm (0.006 inches) per side.

4. Dimension "E1" does not include read and write gaps or protrusions. Gap flashes and protrusions must not exceed 0.15mm (0.006 inches) per side.

5. The chamfer on the body is optional. If it does not exist the index function must be located within the cross-hatched area.

6. "L" is the length of the terminal soldered to the substrate.

7. "N" is the number of end positions.

8. The displayed terminal numbers are for reference only.

9. Dimension "b" does not include bar protrusion. The total allowable dampar protrusion shall exceed 0.08mm (0.003 inches) of dimension "B" at maximum material condition. The distance between the minimum space protrusions and adjacent wires is 0.07mm (0.0027 inches).

10. Control size: mm. Converted inch sizes are not necessarily accurate. (The unit of angle is degrees)

M16.173 caliber

16 Lead Thin Shrink Small Outline Plastic Packaging