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"EU Directive 2011/65 //"EU Directive" ("Z") version Application in a PB-Free or SNPB reflew environment ((Z versions) Surface mount and perforated versions Universal mode and differential mode Filtering small size and low profile 25.4 mm x 25.4 mm x 12.2 mm (1 x 1 x 0.48 in) FLTR75V5 Module same footprint Cost effective open frame design Wide operating temperature range (-40°C to +85°C) to meet voltage isolation requirements ETSI 300-132-2 and complies with and is licensed Basic Insulation Rate Ul*60950-1 recognized, CSA+ C22 .2 No.60950-1-03 certified, and vde^ 0805 :2001-12 License EC Mark Meets 73/Guidelines EST ISO** 9001 and ISO 14001 Certified Manufacturing Facility

application

Distributed Power Architecture

Intermediate bus voltage application

Telecommunications equipment

wireless base station

corporate network

Industrial equipment

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Surface Mount Interconnect (-SR)

Information officer

The FLT007A0Z, FLT007A0-SRZ filter modules are designed to operate at ambient temperatures of -40C-85.C with input voltages up to 75Vdc and output currents up to 7A. The filter block is optimized to work with the dc/dc converter block, significantly reducing conducted differential and common mode noise back to the power supply. This filter module allows designers to meet the requirements of the electromagnetic interference standard CISPR 22 (EN55022) and FCC Class B, inserting a series connection between the power supply and the dc/dc converter module. These. Modules are designed and manufactured as surface mount (SR version) or through-hole mount printed circuit boards.

Absolute Maximum Ratings

Stresses in excess of the Absolute Maximum Ratings can cause permanent damage to the device. These are absolute stress ratings only, and the functional operation of the device under these or any other conditions does not imply values beyond those given in the operating section of the data sheet. Exposure to absolute maximum ratings for extended periods of time can adversely affect device reliability.

Electrical Specifications

Specifications apply to all operating input voltages, resistive loads and temperature conditions unless otherwise noted.

NOTE: This power module does not have an internal fuse. Input line fuses must always be used. This power module can be used in a variety of applications, from simple stand-alone operation to an integrated part of a complex power supply architecture. For maximum flexibility, internal fuses are not included, however, for maximum safety and system protection, input line fuses are always used. Safety agencies require a fast-acting fuse with a maximum rating of 10 A (see Safety Considerations). Based on the surge energy and maximum DC input current provided in this data sheet, lower ratings of the same type of fuse with A can be used. See the fuse manufacturer's data sheet for more information.

Application Guide

Conducted noise differential mode or common mode noise currents may appear on the input power lines. The differential mode noise is measured between the two input lines, mainly on the low frequency end of the spectrum. This noise appears at the fundamental switch as the noise frequency and its harmonics. Common mode noise is mainly broadband noise above 10 MHz measured between the input line and ground. The high frequency characteristics of common mode noise are mainly due to the high speed switching of the power supply to switch train components. Either or both types of noise may be included in the specification, as well as a combination of the two. Differential mode noise is best used by line-to-line capacitors (X capacitors) and series inductance, by the leakage inductance of inductors or common mode chokes. In addition to differential filtering provided by the filter module, it is recommended that electrolytic capacitors be located on the side of the filter at the converter to provide additional attenuation of the low-frequency differential noise source impedance of the converter, preventing input filter oscillations and load transients from inducing input voltage dips.

Open frame DC/DC converter modules and older metal-cased DC/DC converter modules require slightly different filtering arrangements. This FLT007A0Z series module targets the newer open frame module series, but can also be used with older metal case modules. There are two modules that are common-mode filtered primarily in terms of screening recommendations, as described below. The filter open-frame DC/DC converter module is used to filter the open-frame DC/DC converter module. The recommended circuit is shown in the figure. After adding to the input electrolytic filter capacitor C1 (recommended value is at least 100uF and power above 100W is about 1uF/W, common mode filter capacitors C2 and C3 should be connected between input and output as demonstrated. Common mode capacitors apply Values C2 and C3 between 1000pF and 0.1PF are usually shown in the DC/DC converter data sheet. These capacitors are required for the required isolation voltage between the input and output side of the DC/DC converter module. This module's The recommended power supply layout shows where two common mode capacitors are placed as shown.

picture. The schematic diagram shows the recommended connection of the FLT007A0Z filter block module with open frame DC/DC converter.

picture. A diagram showing the recommended layout of the FLT007A0Z filter module for an open DC/DC converter module.

Filtered Metal Housing DC/DC Converter Modules For metal housing DC/DC converter module pins with housings, different filter arrangements and layouts are recommended. The figure shows the schematic recommended circuit diagram. The main difference from open frame modules is that the isolated shield plane under the module is connected to the input and output connections of the module through capacitors C2 to C5 connections. Shields and module enclosures act as Faraday shields to help reduce EMI. The corresponding layout of this metal housing module is shown in the figure.

picture. .Schematic diagram FLT007A0Z recommended connection filter module module with metal casing DC/DC converter.

picture. A diagram showing the recommended layout of the FLT007A0Z filter module metal case DC/DC converter module.

Example data showing results using the FLT007A0Z block diagram shows the use of the block with the FLT007A0Z filter. The QBE025A0B1 module operates at an input voltage of 43.2V and an output voltage of 6.2A with an input current of 6.2A, and the load at a is close to the level module of the 7A capability of the FLT 007A0Z filter. A 10nF ceramic capacitor is connected between Vin(-) and Vo(-) and a 4700pF ceramic capacitor between VIN (Vin) and VIN (Vo). The results show that the filter module can meet the EN55022 Class B limits with sufficient margins.

picture. The experimental results show that the FLT007A0Z is used to measure conducted EMI with the module of the QBE025A0B1 DC/DC converter.

Thermal factor

Power modules operate in a variety of temperature environments; however, adequate cooling should always be provided to help ensure reliable operation. Factors considered include ambient temperature, airflow, module power consumption, and the need to increase reliability. A reduction in operating temperature of the module will improve reliability. The thermal data here is based on physical measurements made in a wind tunnel. The test setup is shown in Figure 10. Note that the airflow is parallel to the long axis of the module as shown.

picture. Thermal test device. Hot reference point for specification as shown. For reliable operation this temperature should not exceed 125°C. The output power of the module should not exceed the rated output current of the module. Please refer to the application note "Thermal "Open Frame Board Mounted Power Module Characterization Process" for a detailed discussion including thermal aspects of the maximum device temperature.

picture. Temperature measurement location.

Post-weld cleaning and drying

Precautions

Post-solder cleaning is usually the final circuit board assembly process prior to circuit board testing. Improper cleaning and drying can affect the reliability of the power module and the testability of the finished circuit board assembly. For proper soldering, cleaning and drying procedures, refer to Lineage Power Strip Mounting Power Modules: Soldering and Cleaning

Application Instructions.

Through Hole Lead-Free Soldering Inquiry RoHS-compliant through-hole products use SAC (Sn/Ag/Cu) lead-free solder with RoHS compliant components. They are designed to be processed by single-wave or dual-wave soldering machines. This pin has a RoHS compliant finish and is compatible with lead-free and lead-free wave soldering processes. The maximum preheat rate of 3QC/S is proposed. This wave warm-up process should ensure that the temperature of the power module board remains below 210 cm3. The recommended pot temperature is 260qC for lead solder and 270qC maximum for lead-free solder pots. Not all RoHS compliant through-hole products can be processed with a lead-free reflow soldering process through the hole sticker. If additional information is required, please consult your pedigree strength for more details please consult. Surface Mount Information Pick and place the FLT007A0-SRZ SMT module using an open frame structure and automated assembly process. Modules are installed with labels designed to provide a large surface area for pick and place operations. The label meets all surface mount processing requirements, as well as safety standards, and can withstand reflow temperatures up to 300 degrees C. The label also has product information such as product code, serial number, production quantity and location. Nozzle recommended module weight has been determined by using open frame construction. Even so, these modules are relatively large in mass compared to traditional SMT components. Variables such as nozzle size, nozzle type, vacuum pressure and nozzle & placement speed should be considered to optimize this process. The recommended minimum nozzle diameter for reliable operation is 5mm. Maximum nozzle outer diameter, which can be safely mounted at permissible component spacing, up to 8 mm.

Tin-Lead Soldering

The FLT007A0-SRZ power module is a lead-free module and can be soldered in a lead-free soldering process or a conventional tin/lead (tin/lead) process. Customers are advised to review the datasheet for custom solder reflow profiles for each application board assembly. The following instructions must be followed to solder these parts in the following cases. Failure to follow these regulatory instructions may result in damage to the module and may compromise long-term reliability. In conventional tin/lead (Sn/Pb) soldering processes the peak reflow temperature is limited to less than 235 degrees C. Typically, eutectic solder melts at 183 degrees C. Co., wet the ground, and then blot the device connection. Sufficient time must be allowed for fusion plating to ensure a reliable solder joint. There are several types of SMT reflow soldering techniques currently used in the industry. These surface mount power modules can be reliably soldered by natural forced convection, IR radiation (infrared), or a combination of convection/infrared. For reliable solder reflow profiles the joint temperature should be established by precise measurement of the module CP.

picture. 205o above time limit curve C reflow soldering is used for tin-lead (Sn/Pb) process.

Lead Free Soldering

The FLT007A0-SRZ SMT modules are lead-free (Pbfree) and RoHS compliant, and are both forward and backward compatible with soldering processes in both Pb-free and SnPb-free. Failure to follow the instructions below may result in and may be detrimental to long-term reliability.

Lead-free reflow profile

The power system shall comply with J-STD-020 version. Class C (Moisture/Reflow Sensitivity Classification of Unsealed Solid State Surface Mount Devices Lead-Free Solder Profiles and MSL Classification Procedures. This standard provides recommended package-based volumes and thicknesses (Table 4-2). This recommended lead-free solder paste is Sn/Ag/Cu (SAC). Recommended linear reflow profile using Sn/Ag/Cu solder as shown. 15. MSL rating FLT007A0-SRZ SMT module has MSL rating Total 1 page. Storage and Handling Recommended Storage Environment and Handling of Moisture Sensitive Surface Mount Procedures Packaging see J-STD-033 Rev. A (Handling, Packaging, Shipping, and Use of Sensitive Surface Mount Equipment for Moisture/Reflow Soldering). Moisture Barrier MSL requires bags with desiccant ( MBB) rating 2 or higher. These sealed packages should not be broken prior to use. Once the original packaging is damaged, product floor life at <=30°C and 60% relative humidity varies according to MSL rating (see J- STD-033A). The shelf life of dry pack SMT packaging is at least 12 months from the date of bag closure, when stored under the following conditions: <40°C, <90% relative humidity.

picture. The recommended linear reflow profile uses Sn/Ag/Cu solder.

Mechanical dimensions are in millimeters and [inches]. Tolerance: xx mm r 0.5 mm[x.xx in. r 0.02 inches (unless otherwise stated) x, xx mm r 0.25 mm [x.xxx inches r 0.010 inches

Can be + or - polarity, but pins 1 and 4 must be the same.

Pins 2 and 5 should be of opposite polarity to pins 1 and 4.

Recommended land layout dimensions are in mm and [inches]. Tolerance: xx mm r 0.5 mm[x.xx in. r 0.02 in (unless otherwise stated) x, xx mm r 0.25 mm [x.xxx in r 0.010 in]

Can be + or - polarity, but pins 1 and 4 must be the same.

Pins 2 and 5 should be of opposite polarity to pins 1 and 4