ASML disclosed at the IEDM 2019 conference that as of 2019, a total of 4.5 million wafers have been processed using EUV equipment. The company's latest NXE:3400C system can produce 170 wafers per hour.
Of the 4.5 million cumulative wafers run through ASML's EUV tools from 2011 to late 2018, the vast majority (2.5 million) occurred only in 2018, roughly doubling each year since 0.6 million in early 2016 . There are 12 million wafers per year, although it should be noted that wafers may undergo dozens of lithographic exposures during their fabrication.

The number of wafers processed by EUV is likely to increase in 2019 as both Samsung and TSMC have started production on their 7nm and N7+ processes. EUV-based chips include the Samsung Exynos 9825 , the Kirin 990 5G, and next year, Qualcomm's 5G Snapdragon chipset and AMD's Zen3. Intel will adopt 7nm EUV in 2021.

As of the second quarter of 2018, the installed base of NXE:3400B systems reached 38, nearly four times the number in 2017. This shows that EUV adoption is growing and customers are confident in the technology. ASML secured 23 EUV orders in Q3 2019 (and said it will deliver about 35 systems in 2020), including multiple DRAM systems. All of these orders are for the new NXE:3400C system, which will also begin shipping in the third quarter.

NXE: 3400C update

While EUV's latency is even longer than Intel's 10nm process, ASML highlighted its progress in EUV throughput as a major factor limiting its economic viability. It has grown more than 17 times in five years. The latest NXE: 3400C can produce 170 wafers per hour. However, commercial deployments may have lower throughput based on exposure dose and system downtime.

NXE: Another improvement on the 3400C is its modular container, which improves serviceability, resulting in a significant reduction in mean time to repair (MTTR), which improves availability metrics, which according to AnandTech have reached 75 % to 85%.

Throughput and availability metrics show EUV's steady progress in terms of commercial viability over the past year.

NXE:3400C will launch in 2023 EXE: 5000 series with 0.55 Numerical Aperture (NA) (0.33NA for former), 67% higher resolution and more 0.33 higher effective wafer yield compared to multi-patterned EUV NA system.