CMOS Compatible Input Thermal Shutdown, Short-Circuit Load Protection, Under- and Over-Voltage Shutdown, Loss-to-Ground Protection, Very Low Standby Current, Compliant with 61000-4-4 IEC Test, Up to 4kV 3 technology designed monolithic device to drive any type of load with one side grounded. An active VCC pin voltage clamp protects the device from low energy spikes. Active current limiting combined with thermal shutdown and automatic restart protects the device from overload. When the ground pin is disconnected, the unit automatically shuts down. The device is particularly suitable for industrial applications in compliance with the IEC 61131-2 international standard for programmable controllers.

Connection Diagram (Top View)

Current and Voltage Conventions

Switching time waveform

waveform

Peak Short Circuit Current Test Circuit

Avalanche Energy Test Circuit

Application diagram

Reverse polarity protection proposes a scheme to protect integrated circuits from reverse polarity. This schematic works for any type of load connected to the IC's output. The RGND resistance value can be selected according to the following conditions: 1. RGND≤600 mV/(at maximum on state). 2. RGND±(-VCC)/(-IGND)-IGND is the DC reverse ground pin current and can be found in the Absolute Maximum Ratings section of the device datasheet. Under reverse polarity conditions, the power dissipation associated with RGNG is: PD=(-VCC)2/RGND This resistor can be shared by multiple different ICs. In this case, the value of equation (1) is the sum of the maximum on-state currents of the different devices. Note that if the microprocessor ground and device ground are separated, the voltage drop across RGND (given by max*RGND in the ON state) creates a difference between the generated input level and the IC input signal level. With multiple high-side switches sharing the same RGND, this voltage drop will vary with the number of devices.

Packaging Machinery Data To meet environmental requirements, ST offers these devices in the ECOPACK® software package. These packages feature lead-free secondary interconnects. According to the JEDEC standard JESD97, the class of secondary interconnects is marked on the packaging and inner box labels. Maximum ratings relative to soldering conditions are also noted on the inner box label. ECOPACK is ST quotient