The FLTR75V05 filter module is designed to reduce common mode and differential mode noise on the input or output lines. The high frequency switching power supply module has a maximum current rating of 5 A. It provides high insertion loss across the frequency range specified by the US Federal Communications Commission (FCC) and the International Special Committee on Radio Interference Conducted Emissions. The module is 25.4mm long, 25.4mm wide, 10.2mm wide and 10.2mm high (1.0" x 1.0" x 0.4") and is naturally mounted on a PC board in a convection or forced air environment.

Introduction: High density power modules are typically designed for high switching operation with reduced internal filter components. EMI filters inside small modules are often insufficient to meet stringent international EMI requirements. Many high-density electronic packaging techniques can add noise to a module's input and output lines. For example, turning off switching elements close to the input pins increases internal noise coupling; and planar transformers, designed to handle high power levels, increase common-mode current levels in low-profile packages with inter-winding capacitance. Additionally, the metal substrate used to facilitate heat transfer in the powertrain adds components to the external heat sink common-mode noise due to large component and metal substrate capacitance between switches. Many international agencies specify limits on conducted and radiated emitting electronic products. Including including CISPR, FCC, VCCI, and the new CE specification. Most agency conducted noise limits apply only to the induced noise current in the AC power line in the finished product. The European Telecommunications Standards Directive (ETSI) is an exception, and the application of CE to DC power supplies requires cable lengths exceeding 3 meters.

Although agencies do not require this to be a standard, some system designers apply conducted emissions requirements to components within a product to reduce internal interference to the subsystem and reduce the difficulty of meeting overall system requirements. To meet these requirements, filtering of external power modules is usually mandatory. When placed with the recommended external components, the Lineage Power Filter Module will significantly reduce conducted differential and common mode noise back to the power supply. CISPR and FCC meet Class B requirements Use filter as instructed Compliant with RoHS Directive 2011 /65/EU Compliant with lead-free or SNPB reflow environment Small dimensions: 25.4 mm x 25.4 mm x 10.2 mm (1.0 in x 1.0 inch x 0.4 inch) Optimized for high frequency switching Line Distributed Power Architecture Telecommunications Datacom CAN/CSA C22.2 Absolute Maximum Ratings Stresses beyond the Absolute Maximum Ratings can cause permanent damage to the equipment. These are absolute pressure ratings only. Functional operation of the device under these or any other conditions is not meant to exceed the conditions given in the operation of the data sheet section. Exposure to Absolute Maximum Ratings for extended periods of time can adversely affect device reliability

Electrical Specifications Specifications apply to all operating input voltage and temperature conditions unless otherwise noted

Application: Conducted noise power lines at the input can be differential mode or common mode noise currents. Differential mode noise is measured between the two input lines, and the end of the spectrum is found mainly in the low frequency band. This noise appears in the form of noise at the switching frequency and its harmonics. The common mode noise measured between the input line and ground is mainly broadband noise 10 MHz. High frequency characteristic common mode noise is primarily due to switching powertrain components. Or both types of noise may be included in the specification, as well as combining one of the two. Approved measurement techniques are also often described. Differential mode noise is best used by line-to-line capacitors (x capacitors) and series inductance, by discrete inductance or leakage inductance common mode chokes. In addition to differential filtering by the filter module, it is recommended that electrolytic capacitors be located on the converter side of the filter to provide additional attenuation of differential noise at low frequencies and the source impedance of the converter, preventing input filter oscillations and load transients from inducing input voltage dips. Common mode noise is best attenuated from the power module input to the power module output through capacitors from each input line to the shield plane (Y-cap) and common mode chokes. It is recommended to use ceramic to add capacitors around each input and power module output pins to the shield plane below the module. The shield plane should be connected to the chassis pins.

The ground pin of the filter module is connected to the Y-shaped cover inside the module. This pin should be tied to the ground point of the module on a quiet chassis away from the power supply. The ground of the filter module should not be tied to the case of the power supply because this is a noisy node that will inject noise into the filter and increase the input common mode noise. If you don't have a quiet ground point, it's best to leave the filter module ground pins unconnected. Each power system design will vary and experimentation may be necessary to achieve the optimal configuration. The figure shows a typical schematic diagram of a filtered power supply module and recommended external components. Figure is a proposed layout. Multiple power modules can be connected to a single filter module as long as the input current does not exceed 5 A. Figure shows a recommended schematic for dual power supply modules connected to a single filter. It is not advisable to add input and output capacitors in the application, do not use C3 and C4 as shown in the diagram do not use C3, C4, C8 and C9 as shown. In -48 V applications, the shield plane and power module case must be connected to the signal, remove C1 and remove C1 and C6 in case pins that connect the shield plane and the vi+ plane. In +48 V applications, the shield plane and power module case must be connected to the signal, remove C2-in. Remove C2 and C7 in the diagram, connect the shield plane and the case pins on the vi(–) plane.

The application (continued) shows some experimental results for different lineages by using filter modules along with recommended external components as shown in Figure 5 and Figure 6. Considered noise is highly dependent on layout, grounding, cable orientation and loading characteristics and will vary with the application. Thermal factor case temperature must be kept below 100°C. The case temperature (tc) should be measured at the location shown. Therefore, the airflow at the filter must be sufficient for current and ambient temperature.

Other Considerations It is critical for good EMI performance that the input lines are not contaminated and noisy after passing through the filter. Therefore, filtered input traces should be kept away from noise sources such as power modules and switching logic lines. If the input voltage sense traces must pass from the power module to the quiet side of the filter module, they should leave the quiet input lines on them. The input traces should be kept as far away from the output power traces as possible. The fundamental switching frequency noise spikes can be reduced slightly by adding some tiny fragments of high frequency capacitors to the input lines of the filter module. Adding other components to the input filter to improve performance usually pays off very little and may add noise to the input line. Adding a Y-cap module on the input side of the filter couples the ground plane directly into the input line, often degrading performance. Adding additional X and Y cap filters to the power module side module creates a low impedance loop for high frequency currents that may degrade performance. Adding additional common-mode or differential-mode filtering to the power module output leads reduces power module output noise, and often also reduces input noise coupling noise from the output leads to the input leads. Common mode output filtering is provided if the load is connected to chassis ground. IF common mode filtering increases the power module output, ensuring that the remote sense leads the voltage before the sense output common mode filter. Do not use the side of the remote control output common mode filter on the load.

If the input noise performance is unsatisfactory with a filter as described above, the best remedy is to modify the layout grounding scheme. It is often helpful to build power model cards, use copper tape and vector cards, and try various layout and grounding methods for printed circuit boards. Post-Solder Cleaning and Drying Considerations Post-solder cleaning is usually an assembly process prior to final circuit board testing. Inadequate cleaning and drying can affect the reliability and testability of the power module in the completed circuit board assembly. For proper soldering, cleaning, and drying procedures, see Lineage Power Strip Mounting Power Modules: Soldering and Cleaning Application Notes. Through-Hole Lead-Free Soldering Information RoHS-compliant through-hole products use SAC (SN/ag/cu) lead-free solder and RoHS compliant components. They are designed to pass single or double wave soldering machines. The pins are RoHS compliant and compatible with lead and lead free wave finish soldering processes. A maximum preheat rate of 30C /S is recommended. The wave preheating process should be such that the temperature of the power module board is kept below 2100C. For lead solder, the recommended pot temperature is 2600 degrees Celsius, while lead-free solder pots are 2700 degrees Celsius. Not all RoHS-compliant through-hole products are manufactured using a lead-paste or lead-free reflow process.