MPLAB-Ice conversion sockets usually consist of two parts: DIP adapter socket and SOIC/SSOP header. The DIP adapter socket is designed to plug into the emulator system's DIP device adapter at one end and the header at the other end. Then solder the header to the target application
A QFP adapter is a single part soldered directly to the target application that fits into a QFP device adapter.
Why use conversion sockets in product design?
There are two very significant advantages to using an adapter socket:
1. Shorten product development cycles, and
2. Reduced design, layout and prototype testing costs.
A typical product design cycle has two important phases: the prototyping phase and the product design phase. Traditionally, these stages are different simply because the prototype uses a different package type of microcontroller. However, with the availability of transition sockets, the prototyping design can be the same as the production design, as the transition socket can be used to bridge the packaging differences of the microcontroller.
What are the currently available conversion sockets?
Microchip Technology currently offers the following conversion sockets for our emulator systems:
PDIP – 28 leads, 0.300 " male to 0.600 " female
SOIC – 8, 14, 18, 20 and 28 leads
SSOP – 20 and 28 lead
QFP – 44-, 64- and 80 lead
MPLAB®-Ice How can I get the most out of transition socket use?
Care should be taken with component placement to provide adequate clearance between the transition socket interface and the PCB package. This is especially true for any tall components such as connector heads, radial components or voltage regulators. Refer to Transition Socket Mechanical Drawings for dimensions.
Advice and Recommendations for Converting Socket Applications Care should be taken with component placement when mating adapter sockets with SOIC/SSOP headers. If visual alignment is difficult in your application, C-shaped end brackets have been included to assist with head-to-adapter socket alignment. Snap the bracket to the SOIC/SSOP header.
Via locations around the surface mount technology (SMT) layout area should be checked. The VIA immediately adjacent to the end of the SMT pad may inadvertently touch the header leads. Vias should be placed along the centerline of the SMT pads to reduce the possibility of pin-to-pin shorts when soldering.
The SOIC header is designed for SOIC body widths of 0.300 inches and the adapter wires should be cut to fit SOIC body widths of 0.150 inches and 0.208 inches.
PDIP conversion sockets are 0.300" male to 0.600" female adapter sockets.
Microchip provides the following PDIP conversion sockets: xlt28xp: one 28-wire PDIP adapter socket and two
28 Lead-gold confrontation layout dimensions are shown in the drawings in this section.

XLT28 XP
28-gauge lead, 0.300" male to 0.600" female adapter socket
SOIC conversion socket
SOIC conversion socket and related hardware are shown in the figure

SOIC conversion socket
SOIC conversion sockets have two components.
1. Connect to the adapter slot of the PDIP device adapter.
2. SOIC header to be soldered to the target application.
Microchip offers the following SOIC conversion sockets:
XLT 08SO: One adapter socket and three 8-wire SOIC headers
XLT14SO: One adapter socket and three 14-lead SOIC headers
XLT18SO: One adapter socket and three 18-lead SOIC headers
XLT2 0SO1: One adapter socket and three 20-lead SOIC headers
XLT 28SO: One adapter socket and three 28-lead SOIC header layout dimensions are shown in the drawings in this section.

Note: SOIC header is designed for SOIC body width
0.300 inches. Adapter leads should be cut to fit
0.150" and 0.208" SOIC body widths.
XLT 08SO 8-Lead Dip 0.050-inch Adapter Socket

SSOP Adapter SSOP Adapter
SSOP conversion sockets are similar to SOIC conversion sockets. The ssop conversion socket has two parts: 1. Connects to the adapter slot of the PDIP device adapter. 2. The ssop header that is soldered to the target application.
Microchip offers the following SSOP conversion sockets: xlt20ss: one adapter socket and three 20-lead SSOP headers xlt20ss1: one adapter socket and three 20-lead SSOP headers xlt28ss: one adapter socket and three 28-lead SSOP headers xlt28ss2: one adapter socket and three 28-lead SSOP headers A 28-lead SSOP header (for pic16c55/57).

Note: xlt64pt1 for pic16c92x is not symmetric. Note the orientation of pin 1 before soldering to the target system.
top view

Layout dimensions and clearances for tall parts

TQFP Transition Socket Soldering Tip Before soldering, consider keeping the disconnected lugs in place during the soldering process. Use a tip that is temperature controlled between 300 to 325°C ( 570 to 615°F); if possible, use a Pace Mini-Wave tip or an equivalent tip design. Plan to weld one (1/4) side first, then the other side, then the remaining two. The movement of the tip should be in the direction of the leads (back and forward), not across the leads; dragging the tip over the leads may damage the leads. Use plenty of flux to help the solder flow. If the detached tabs are removed after soldering (using a toothpick or equivalent), any solder joint bridging between the leads can be repaired by just lightly touching the solder joint to the solder joint. Keep in mind that 64-pin and 80-pin TQFP headers are very delicate and can be damaged!

XLT44PT 44 Lead Adapter Socket - Top View

Dimensions are in inches unless otherwise specified

44 Lead Conversion Socket - Side View

XLT64PT1, XLT64PT2, XLT80PT 64/80 Lead Transition Receptacles - Top View

Dimensions are in inches unless otherwise specified. The picture shows 64 leads. This image shows a breakaway label attached to the lead. The breakaway tab should be removed before applying power.

64/80 Lead Conversion Socket - Side View

Dimensions are in inches unless otherwise specified. The picture shows 64 leads. The breakaway tab should be removed before applying power.