Features
ccd signal processing correlated double sampling (cds) - programmable black level clamp programmable gain amplifier (pga) - 6dB to 42dB gain range 10-bit digital data output - up to 36MHz conversion rate - no missing codes 76dB signal Noise Ratio Portable Operation - Low Voltage: 2.7 V to 3.6 V - Low Power: 130 mW (typ), 3.0 V - Standby Mode: 6 mW
describe
The vsp2232 is a complete digital camera mixed-signal processing chip that provides signal conditioning and analog-to-digital conversion for the output of the CCD array. The main ccd channel provides correlated double sampling (cds) to extract video information from pixels, with digitally controlled -6-db to 42 db gain for different lighting conditions, and black level clamp for accurate black level reference .
Also performs input signal clamping and offset correction of the input cds. Stable gain control is linear in decibels. Also, after a gain change, the black level recovers quickly.
The VSP2232 Y is compatible with the VSP2262Y (12-bit 20 MHz) single-chip product.
The VSP2232Y is available in a 48-pin LQFP package and is powered by a single 3-V/3.3-V supply.

(1) The market status value is defined as follows: Activity: Product equipment recommended for new designs. lifebuy:ti has announced that the device will be discontinued and the lifetime purchase period is in effect. NRND: Not recommended for new designs. Devices are in production to support existing customers, but TI does not recommend using this part in new designs. Preview: The device has been released, but not yet in production. The sample may or may not have it. Obsolete: TI has discontinued production of this device.
(2) Eco-Plan - Planned eco-friendly classification: Lead Free (RoHS), Lead Free (RoHS Exempt) or Green (RoHS and No SB/BR) Pending: No lead free/green transition plan defined. Lead-Free (RoHS): The Ti term "lead-free" or "lead-free" refers to semiconductor products that are compatible with current RoHS requirements for all 6 substances, including the requirement that lead in a uniform material does not exceed 0.1% by weight. If designed for high temperature soldering, titanium-lead-free products are suitable for specified lead-free processes. Lead Free (RoHS Exempt): This assembly is RoHS exempt for 1) lead-based flip-chip solder joints used between the die and the package or 2) lead-based die adhesives used between the die and the lead frame. As defined above, this component is considered lead-free (RoHS compliant). Green (RoHS and Sb/Br free): Ti defines "green" as lead free (RoHS compliant), free from bromine (Br) and antimony (Sb) based flame retardants (Br or Sb in a homogeneous material by weight not more than 0.1%)
(3) MSL, peak temperature. - Moisture sensitivity rating according to jedec industry standard classification and peak solder temperature.
(4) There may be additional markings on the equipment related to identification, lot tracking code information, or environmental categories.
(5) Multiple device marks will be in brackets. Only one device token enclosed in parentheses and separated by "~" will appear on a device. If a line is indented, it is a continuation of the previous line, and the combination of these two lines represents the entire device mark for that device.
(6) Lead/Ball Finishes - Orderable equipment may have multiple material finish options. Finishing options are separated by vertical ruled lines. If the finish exceeds the maximum column width, the lead/ball finish can wrap to two lines.
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