100 v20-ic/" title="FLTR100V20 Product Specifications, Documentation and Sourcing Information" target="_blank">FLTR100V20 filter modules are designed to reduce differential mode noise on the conducted common mode input or high frequency switching output line power. The modules have A maximum current rating of 20A . It offers high insertion loss in the U.S. regulated frequency range. Federal Communications Commission (fcc) and International Special Issue Radio Interference Commission for conducted emissions. Module is 50.8 mm long, 40.6 mm wide, and 12.7 mm high (2). 1.6". x 0.50") and base on a pc board with natural convection or forced air environment. Introduction High density power modules are typically designed for high switching operation with reduced internal filter components. EMI filters inside small modules are often insufficient Meets stringent international EMI requirements. Many high-density electronic packaging techniques can add noise to the module's input and output lines. For example, closing switching elements with input pins increases internal noise coupling; and planar transformers, designed to handle high power The level of inter-winding capacitance increases the common mode current level in the low profile package. Additionally, the metal substrate is used to facilitate heat transfer in the power train. The component adds to the external heat sink common mode noise due to the large component and metal substrate between the switch capacitance and the metal substrate. Many International agencies specify limits for conducted and radiated emitting electronic products. These include CISPR, FCC, VCCI, and the new CE regulations. Most agency conducted noise limits apply only to the induced noise current in the AC power line in the finished product. The European Telecommunications Standards Directive (ETSI) is an exception, and the application of CE to DC power requires cable lengths in excess of 3 meters. Although the agency does not require this standard, some system designers apply conducted emissions that require components within the product to reduce internal interference in the subsystem and reduce Difficulty meeting overall system requirements. To meet these requirements, filtering of external power modules is usually required. The filter module is a filter optimized for use with F and J series power modules. When used with recommended external components and layout, IT Will greatly reduce differential mode and common mode noise back into the power supply. CISPR and FCC Class B requirements can be described in the following sections through the use of filters. Common mode and differential mode power supplies DC input filtering output lines Communication equipment Computer equipment RoHS compliant 2011/65/EU Compatible with lead-free or snpb reflow environment Small size: 50.8 mm x 40.6 mm x 12.7 mm (2 in.). 1.6 in. x 0.50 in. Optimized for high frequency use DC-DC power module printed circuit board available Installation and operating box temperature range: –40°C to +100°C CAN/CSA C22 .2 No. 60950-1-07/UL*60950-1, Second Edition, Date: March 27, 2007; VDE0805 (EN60950) Licensing CE marking in accordance with 73/23/EEC

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Conducted noise power lines at the input can be differential mode or common mode noise currents. Differential mode noise is measured between the two input lines, and the end of the spectrum is found mainly in the low frequency band. This noise appears in the form of noise at the switching frequency and its harmonics. The common mode noise measured between the input line and ground is mainly broadband noise 10 MHz. Common-mode noise of high frequency characteristics is primarily due to high-speed switching powertrain components. Or both types of noise may be included in the specification, as well as a combination of both. Approved measurement techniques are also often described. Differential mode noise is best used by line-to-line capacitors (x capacitors) and series inductance, by discrete inductance or leakage inductance common mode chokes. In addition to differential filtering by the filter module, it is recommended that electrolytic capacitors be located on the converter side of the filter to provide additional attenuation of differential noise at low frequencies and the source impedance of the converter. This prevents input filter oscillations and load transients from inducing input voltage dips. Common mode noise is best attenuated from the power module input to the power module output through capacitors from each input line (Y-cap) common mode choke to the shield plane. It is recommended to add ceramic capacitors around each input and power module output pins to the shield plane below the module. The shield plane should be connected to the chassis pins. The ground pin of the filter module is connected to the Y-shaped cover inside the module. This pin should be tied to the ground point of the module on a quiet chassis away from the power supply. The ground of the filter module should not be tied to the case of the power supply because this is a noisy node that will inject noise into the filter and increase the input common mode noise. If you don't have a quiet ground point, it's best to leave the filter module ground pins unconnected. Each power system design will vary and experimentation may be necessary to achieve the optimal configuration. A typical schematic diagram of a power module with filters and recommended external components is shown. is a proposed layout. Multiple power modules can be connected to a single filter module as long as the input current does not exceed 20 A. Shows the recommended schematic for dual power supply modules connected to a single filter. In the application where the input and output capacitors are not needed, do not use C3 and C4 as shown, do not use C3, C4, C8 and C9 as shown. In -48 V applications, shield plane and power module case must be connected to signal, remove C1, remove C1 and C6 in, connect shield plane and case pin of vi+ plane. In +48 V applications, the shield plane and power module case must be connected to the signal, remove C2-in, remove C2 and C7 in, connect the shield plane and the case pins on the vi(–) plane.

The thermal factor must keep the temperature of the box below 100°C. Therefore the airflow at the current and ambient temperature filters must be sufficient. Example: Given: Io, max=18A; Ta, max=40°C therefore _t, max allowable=60°C Determine the required airflow (Fig. 1): V=1.0 m/s (200 lfm) others CAUTION It is critical for good EMI performance that the input lines are not contaminated with noise after passing through the filter. Therefore, filtered input traces should be kept away from noise sources such as power modules and switching logic lines. If the input voltage sense traces must pass from the power module to the quiet side of the filter module, they should leave the quiet input lines on them. The input traces should be kept as far away from the output power traces as possible. The fundamental switching frequency noise spikes can be reduced slightly by adding some tiny fragments of high frequency capacitors to the input lines of the filter module. Adding other components to the input filter to improve performance usually pays off very little and may add noise to the input line. Adding a Y-cap module on the input side of the filter couples the ground plane directly into the input line, often degrading performance. Adding additional X and Y capitalization to the power module side of the filter module creates a low impedance loop high frequency current flow that may degrade performance. Adding additional common-mode or power-differential-mode filtering to the module output leads reduces power module output noise, and often reduces input noise to reduce noise coupling the output leads to the input leads. Common mode output filtering is provided if the load is connected to chassis ground. If common mode filtering is added to the power module output, ensure that the remote sense leads the voltage before the sense output common mode filter. Do not use the side of the remote control output common mode filter on the load. If the input noise performance is unsatisfactory after using the filter as previously mentioned, the best remedy for the module is to modify the layout and grounding scheme. It is often useful to make models of power cards, use copper tape and vector cards, and try various layout and grounding methods for printed circuit boards.

Post-Solder Cleaning and Drying Considerations Post-solder cleaning is usually an assembly process prior to final circuit board testing. Inadequate cleaning and drying can affect the reliability and testability of the power module in the completed circuit board assembly. For proper soldering, cleaning, and drying procedures, see Lineage Power Strip Mounting Power Modules: Soldering and Cleaning Application Notes. Through-Hole Lead-Free Soldering Information RoHS-compliant through-hole products use sac (sn/ag/cu) lead-free solder with RoHS compliant components. They are designed to pass through single-wave or dual-wave soldering machines. The pins have a RoHS compliant finish, with PB and lead-free wave soldering processes. The maximum preheating speed is recommended to be 30c/s. The wave preheating process should be such that the temperature of the power module board is kept below 2100C. For lead solder, the recommended pot temperature is 2600 degrees Celsius, while lead-free solder pots are 2700 degrees Celsius. Not all RoHS-compliant through-hole products are manufactured using a lead-paste or lead-free reflow process. If more information is required, please consult a Tyco Electronics Power Systems representative for more details.