Datasheet Description
ws1103 is a cdma (code division multiple access) power amplifier module designed for mobile phones with 824-849mhz bandwidth.
The WS1103 utilizes Coolpam circuit technology to provide state-of-the-art reliability, temperature stability and robustness.
Coolpam's digital mode control reduces current consumption, thereby extending talk time on mobile devices.
ws1103 meets strict cdma linearity requirements, and the output power is greater than or equal to 28dbm. The 3mm x 3mm form factor 8-pin surface mount package is self-contained and contains 50 ohm input and output matching networks.
Functional block diagram

Characterized Good Linearity Low Quiescent Current High Efficiency
PAE at 28 dBm: 41.2%
PAE at 16 dBm: 17.7%
8-pin surface mount components
3mm x 3mm x 1.0mm Internal 50 Ohm Matching Network for RF Input and Output RoHS Compliant
application

digital CDMA cellular

Handheld peripheral circuit notes:
The recommended voltage for VREF is 2.85 V.
Place C1 near the VREF pin.
Place C3 and C4 close to pin 1 (VCC1) and pin 8 (VCC2). These capacitors can affect RF performance.
Use a 50 W transmission line between the PAM and the duplexer, keeping it as short as possible to reduce conduction losses.
The π-type circuit topology is suitable for matching circuits between power amplifiers and duplexers.
Peripheral circuits

Calibration Procedure The calibration procedure is shown in Figure 11. Cold PAM requires two calibration tables, high mode and low mode, due to the difference in gain in each mode. For the continuous output power at the mode transition point, the input power should be adjusted according to the gain step during the mode transition.
Offset value (difference between rising point and falling point)
The offset value, which is the difference between the rising point (output power at PA mode transition from low to high mode) and the falling point (output power at PA mode transition from high to low mode), should be taken to prevent system oscillations . A lag of 3 to 5 dB is recommended.
Average current and talk time

The probability distribution function shows that for longer talk times it is the efficiency in the low or mid power range that matters, not the efficiency in the full power range. The no-load current of ws1103 is 13ma, and the working current is 65ma at 16dbm. This low current consumption power amplifier extends talk time by no less than 30 minutes than other power amplifiers.

Plastic reel format (all dimensions in mm)
Handling and storage

Electrostatic discharge Electrostatic discharge occurs naturally in the environment. As the voltage potential increases, an outlet for neutralization or discharge is sought. If the discharge path obtained is through the semiconductor device, destructive damage can be caused.
ESD countermeasures should be developed and used to control potential ESD damage during handling in the factory environment at each production site. MSL (Moisture Sensitivity)
Surface mount packages in plastic packages are very sensitive to damage from absorbed moisture and temperature.
Avago Technologies follows Jedec Standard J-STD 020B. Each component and package type is classified into an electrostatic discharge classification based on moisture sensitivities obtained by soaking known dry packages at different temperatures, relative humidity, and times. After soaking, the parts were subjected to three consecutive simulated reflows.
The maximum limit for exposure time outside the baggage is determined by the classification test described below, which corresponds to the msl classification level 6 to 1 according to the jedec standard ipc/jedec j-std-020b and j-std-033.

WS1103 is MSL3. Therefore, according to J-STD-033 P.11, the maximum manufacturer exposure time (MET) for this part is 168 hours. After this time, the parts need to be taken off the reel, the tape removed, and re-baked. The MSL classification reflow temperature target for the WS1103 is 260°C+0/-5°C. Typical SMT curve at 260+0/-5°C.

Solder Paste Stencil Hole Tape and Reel Information

Typical SMT reflow profile at 260+0/-5°C max.

Storage Conditions After unpacking, the device must be soldered to the PCB within the 168 hours listed in J-STD-020B P.11 under factory conditions <30°C and 60% relative humidity. Baking If both conditions (storage condition and out-of-bag condition) are met, there is no need to rebake the part. If at least one of the above conditions is not met, baking must be done. Baking conditions were 125°C for 12 hours J-STD-033 page 8. Note that safety tape and roll materials generally cannot be baked at these temperatures. If the out-of-bag exposure time is exceeded, the part must be baked at low temperature for a longer time, or the part must be unwound, unwound, re-baked, and put back on the tape and roll. (See the moisture-sensitive warning label on each shipping bag for information on baking).
Board Rework Component Removal, Rework, and Reinstallation If components are to be removed from the board, localized heating is recommended, with a maximum body temperature of no more than 200°C for any surface mount components on the board. This method will minimize moisture-related component damage. If any part temperature exceeds 200°C, the board must be dried per 4-2 prior to rework and/or part disassembly. Component temperatures should be measured at the top center of the package. Any SMD package that has not exceeded its floor life can be exposed to maximum body temperature up to its specified maximum reflow temperature.
Troubleshooting Failure to comply with the above requirements may result in moisture/reflow damage that prevents or completely prevents the determination of the original failure mechanism.
Baking of Filled Boards Some SMD packages and board materials cannot withstand prolonged baking at 125°C. For example, some FR-4 materials cannot withstand a 24-hour bake at 125°C. Batteries and electrolytic capacitors are also temperature sensitive. Select the bake temperature from Table 4-1 of J-STD 033, taking into account the temperature limitations of the components and the board; then determine the appropriate bake duration based on the components to be removed. See IPC-7711 and IPC-7721 for additional considerations.
Derating due to factory environmental conditions Factory floor lifetime exposure of SMD packages removed from dry bags is a function of environmental conditions. A safe but conservative approach is to expose the SMD package to the maximum time limits for each moisture sensitivity level shown in Table 7. However, this method will not work if the factory humidity or temperature is greater than the test conditions of 30°C/60%RH. The solution to this problem is to reduce the exposure time based on knowledge of moisture diffusion in the component packaging material (ref jesd22-a120). Based on the nominal plastic thickness of each unit, the recommended equivalent total floor life exposure for a range of humidity and temperature can be estimated.
Equivalent derated floor life in the humidity range of 20-90% relative humidity at three temperatures of 20°C, 25°C and 30°C.
This table applies to SMDs molded with phenolic, biphenyl, or multifunctional epoxy molding compounds. The following assumptions are used in the calculation of Table 8:
1. Diffusion activation energy = 0.35eV (minimum known value).
2. For ≤60%RH, use diffusion coefficient=0.121exp(-0.35ev/kt)mm2/s
(This uses the smallest known diffusivity at 30°C).
3. For relative humidity greater than 60%, use diffusion coefficient = 1.320exp (-0.35ev/kt) mm2/s
(use the maximum known diffusivity at 30°C).