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2022-09-24 17:43:29
XC3SD3400A-L5CSG484I
XC3SD3400A-L5CSG484I
Table of contents
1. Description 2. Product picture 3. Specification parameters 4. Environment and export classification 5. Features 6. CAD model 7. PDF data 8. Product manufacturer introduction Inventory: 303
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describe
Product number
XC3SD3400A-4CSG484I
describe
IC FPGA 309 I/O 484CSBGA
Classification
Integrated Circuits (ICs), Embedded FPGAs (Field Programmable Gate Arrays)
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Manufacturer
Xilinx Corporation
series
Spartan?-3A DSP
partial state
active
Voltage - Power
1.14V~1.26V
Operating temperature
-40°C~100°C(TJ)
bag/box
484-FBGA, CSPBGA
Supplier Equipment Package
484-CSPBGA(19x19)
base part number
XC3SD3400A
Table of contents
1. Description 2. Product picture 3. Specification parameters 4. Environment and export classification 5. Features 6. CAD model 7. PDF data 8. Product manufacturer introduction Inventory: 303
Buy this product from Kynix
add to Shopping Cart
describe
Product number
XC3SD3400A-4CSG484I
describe
IC FPGA 309 I/O 484CSBGA
Classification
Integrated Circuits (ICs), Embedded FPGAs (Field Programmable Gate Arrays)
Manufacturer
Xilinx Corporation
series
Spartan?-3A DSP
partial state
active
Voltage - Power
1.14V~1.26V
Operating temperature
-40°C~100°C(TJ)
bag/box
484-FBGA, CSPBGA
Supplier Equipment Package
484-CSPBGA(19x19)
base part number
XC3SD3400A
Product Image
XC3SD3400A-4CSG484I
XC3SD3400A-4CSG484I
Specifications
Programmable Logic Type
Field Programmable Gate Array
REACH compliant
Yes
Compliant with EU RoHS standard
Yes
state
active
clock frequency - max
250.0MHz
JESD-30 code
S-PBGA-B484
JESD-609 code
E1
total RAM bits
2322432
Number of CLBs
5968.0
Equivalent number of gates
3400000.0
Enter quantity
309.0
number of logical units
53712.0
Number of outputs
249.0
number of terminals
484
organize
5968 CLBS, 3400000 GATES
Peak reflow temperature (℃)
260
power supply
1.2, 2.5/3.3
Eligibility Status
Failed
Subcategory
Field Programmable Gate Array
voltage
1.2V
Supply Voltage - Min.
1.14V
Supply Voltage - Maximum
1.26V
installation type
surface mount
technology
CMOS
terminal complete
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal form
ball
Terminal spacing
0.8mm
end position
bottom
Time @ Peak Reflow Temperature - Max
thirty
Packaging body material
Plastic/Epoxy
package code
BGA
Package Equivalent Code
BGA484, 22X22, 32
packaging shape
square
packaging style
grid array
Manufacturer's Packaging Instructions
Lead Free, CSBGA-484
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