The BA10339, BA10339F and BA10339FV all consist of four comparators in one package. Open collector output allows wired OR connection. These products have a wide range of operating supply voltages, from single-supply operation to 36V , and dual-supply operation to ± 18V . Available packages include 14-lead DIP (BA10339), 14-lead SOP (BA10339F) and 14-lead SSOP-B (BA10339FV).

The general purpose BA8391G/BA10393F/BA10339xx and the high reliability BA2903xxxx/BA2901xxx integrate one, two or four independent high gain voltage comparators. Operating supply voltage range is BA8391G/BA1039

3F/BA2903xxxx/BA2901xxx are wide (2V to 36V). And can be used in various applications because the current consumption is small. BA2903Wxx are low input offset voltage products. (Max 2mV)

feature

Can be powered by a single power supply

Wide operating supply voltage

Standard pin assignment

Input and output are ground sense

open collector

Wide temperature range

application

General purpose

Current monitor

battery monitor

Multiple Vibrators

Selection guide map

maximum operating temperature

Simplified schematic

Simplified schematic (one channel only)

Electrical Characteristics Description

Described below is a description of the relevant electrical terminology used in this data sheet. Items and symbols used are also shown. Please note that item names and symbols and their meanings may differ from other manufacturers' documentation or other general documents.

1. Absolute Maximum Ratings

Absolute Maximum Ratings items represent conditions that must not be exceeded. Applying a voltage exceeding the absolute maximum rating or using an environment exceeding the absolute maximum rating may result in deterioration of characteristics.

(1) Power supply voltage (VCC/VEE)

Indicates the maximum voltage that can be applied between the positive power supply terminal and the negative power supply terminal without deteriorating or destroying the characteristics of the internal circuit.

(2) Differential input voltage (VID)

Indicates the maximum voltage that can be applied between the non-inverting and inverting terminals without damaging the IC.

(3) Input common mode voltage range (VICM)

Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deteriorating or destroying electrical characteristics. The maximum rating of the input common-mode voltage range does not guarantee proper operation of the IC. For normal operation, use the IC within the input common mode voltage range characteristics.

(4) Power consumption (Pd)

Indicates the power an IC can dissipate when mounted on a specific circuit board at an ambient temperature of 25°C (normal temperature). For packaged products, Pd is determined by the temperature allowed by the IC

Package (maximum junction temperature) and thermal resistance of the package.

2. Electrical Characteristics

(1) Input offset voltage (VIO)

Indicates the voltage difference between the non-inverting terminal and the inverting terminal. It can be translated into the input voltage difference required to set the output voltage to 0 V.

(2) Input offset current (IIO)

Indicates the difference in input bias current between the non-inverting and inverting terminals.

(3) Input bias current (IB)

Indicates the current flowing into or out of the input terminal. It defines the non-inverting and inverting terminals by the average value of the input bias current.

(4) Input common mode voltage range (VICM)

Indicates the input voltage range over which the IC operates normally.

(5) Large signal voltage gain (AV)

Indicates the amplification (gain) of the output voltage and the voltage difference between the non-inverting terminal and the inverting terminal. Usually the amplification (gain) of the referenced DC voltage. Av = (output voltage)/(differential input voltage)

(6) Supply current (ICC)

Indicates the current flowing within the IC under specified no-load conditions.

(7) Output sink current (ISINK)

Indicates the maximum current that can be output under specific output conditions.

(8) Output saturation voltage, low-level output voltage (VOL)

Indicates the voltage range that can be output under specific output conditions.

(9) Output leakage current, high-level output current (ILEAK)

Represents the current flowing into the IC under specified input and output conditions.

(10) Response time (tRE)

Response time represents the delay time between the input and output signals determined by the time difference from fifty percent of the swing of the input signal to fifty percent of the swing of the output signal.

Test circuit 1 (one channel only)

Switching Conditions for Test Circuit 2

Test circuit 2 (one channel only)

Response time

Power consumption

Power dissipation (total loss) means the power that the IC can dissipate at TA = 25°C (normal temperature). The IC is heating up when it consumes power and the temperature of the IC die becomes higher than the ambient temperature. The acceptable temperature of this IC chip depends on circuit configuration, manufacturing process and limited power of consumables. The power dissipation is determined by the allowable temperature of the IC die (maximum junction temperature) and the thermal resistance of the package (the ability to dissipate heat). The maximum junction temperature is usually equal to the maximum value over the storage temperature range. The heat generated by the dissipated power of the IC radiates from the molding resin or the lead frame of the package. The parameter that expresses this heat dissipation capability (exothermic hardness) is called thermal resistance, which is represented by the symbol θja°C/W. The temperature of the IC within the package can be estimated through this thermal resistance.

Instructions

1. Reverse connection of power supply

Connecting the power supply with reversed polarity will damage the IC. Connect the power supply taking precautions to prevent reverse polarity, such as installing an external diode termination between the power supply and the IC power supply.

2. Power cord

Design the PCB layout pattern to provide low impedance ground and power lines. Separate the ground and the lines supplying the digital and analog blocks to prevent ground noise and the supply lines for the digital blocks from being affected by the analog blocks. Also, connect capacitors to ground on all power pins. Consider the effect of temperature and aging on capacitance values when using electrolytic capacitors.

3. Ground voltage

Even under transient conditions, make sure that at no time is the voltage on the pin lower than the voltage on the ground pin.

4. Ground wire mode

When using small signal and high current ground traces, the two ground traces should be routed separately, but connected to a single ground at the reference point of the application board to avoid ground caused by fluctuations in small signals and high currents. Also make sure that the ground traces of external components do not cause variations in the ground voltage. The ground wire must be as short and thick as possible to reduce line impedance.

5. Heat dissipation considerations

If the power rating is exceeded, it may cause the chip temperature to rise and chip performance to deteriorate. If this absolute maximum rating is exceeded, increase the board size and copper area to prevent exceeding the Pd rating.

6. Recommended operating conditions

These conditions represent the range within which the expected characteristics of the IC can be approximately obtained. Electrical characteristics are guaranteed under the conditions of each parameter.

7. Inrush current

When power is first applied to the IC, the internal logic may be unstable and inrush current may flow instantaneously due to internal power supply sequencing and delays, especially if the IC has multiple power supplies. Therefore, pay special attention to power coupling capacitors, power traces, ground trace widths, and trace connections.

8. Operation under strong electromagnetic field

Operating the IC in the presence of strong electromagnetic fields may cause the IC to malfunction.

9. Test on the application board

When testing an IC on an application board, it is possible to connect capacitors directly to the low-impedance output pins of the IC to stress. Always fully discharge capacitors after each process or step. Power to the IC should be fully shut down before being connected during inspection or removed from the test setup. To prevent damage from electrostatic discharge, ground the IC during assembly and store it during shipping using similar precautions.

10. Short circuit between pins and installation errors

When mounting the IC on the PCB, make sure the orientation and position are correct. Incorrect installation may damage the IC. Avoid shorting nearby pins to each other, especially to ground. Pin shorts can be due to many reasons such as metal particles, water droplets (in very wet environments) and unintentional solder bridges deposited between pins during assembly to name a few.