The CC1100E features a Sub-GHz high performance radio transceiver designed for very low power RF applications. It is intended for the Industrial, Scientific and Medical (ISM) and Short Range Device (SRD) frequency bands at 470-510 MHz and 950-960 MHz. The CC1100E is particularly suitable for wireless applications targeting Japan ARIB STD-T96 and China Short Range Equipment Regulations 470-510 MHz. The CC1100E RF transceiver integrates a highly configurable baseband modem. The modem supports various modulation formats and has a configurable data rate of up to 500 baud. The CC1100E offers extensive hardware support for packet processing, data buffering, burst transfers, clear channel assessment, link quality indication and wake-up radio. The main operating parameters and the 64-byte transmit/receive FIFO of the CC1100E can be controlled via the SPI interface. In a typical system, the CC1100E will be used with a microcontroller and some additional passive components.

application

Ultra-low-power wireless applications

Operating Bands in 470/950 MHz ISM/SRD

wireless sensor network

Home and Building Automation

Pin Configuration Diagram

Circuit Description Diagram

A simplified block diagram of the CC1100E is shown above. The CC1100E has a low-IF receiver. This received RF signal is amplified by a low noise amplifier (LNA) and down-converted in quadrature (I and Q) to an intermediate frequency (IF). At IF, the I/Q signal is digitized by the ADC. Automatic Gain Control (AGC), fine channel filtering and demodulation are performed to perform bit/packet synchronization digitally. The transmitter portion of the CC1100E is based on direct synthesis of RF frequencies. The frequency synthesizer includes a fully on-chip LC VCO and 90-degree phase shifter downconversion mixers in receive mode for generating the I and Q LO signals. The crystal will be connected to XOSC_Q1 and XOSC_Q2. The crystal oscillator generates the reference frequency for the synthesizer, as well as the clock for the ADC and digital sections. A 4-wire SPI serial interface is used for configuration and data buffer access. Digital baseband includes support for channel configuration, packet processing and data buffering.

The application circuit requires only a few external components using the CC1100E. The recommended application circuit for CC1100E is shown in Figure 1 and Figure 2. External components.

Typical Application and Evaluation Circuit 470 MHz (excluding power supply decoupling)

Typical Application and Evaluation Circuit 950 MHz (excluding power supply decoupling)

PCB Layout Recommendations

The top layer should be used for signal routing, and the open area should be filled with several vias to ground with metallization. The area under the chip is used for grounding

And should be connected to a ground plane with multiple vias on the bottom layer, with good thermal performance and low enough inductance ground.

In the CC1100E EM reference design [(3) and 0), 5 vias are placed on exposed internal connection pads. These vias should be

"Tent" (covered with solder mask) on the component side of the PCB to avoid migration of the solder through the vias during the solder reflow process. Solder paste coverage should not be 100%. If so, a gas-filling reflow process may occur that may cause defects (sputtering, solder balls). Use "tent" vias to reduce solder paste coverage underneath.

See the images below for the top solder mask and top stick mask. Each decoupling capacitor should be placed as close as possible to the power pins. Decoupling each decoupling capacitor should be connected to the power line (or power supply through a separate via. The best route is from the power line (or power plane) to the decoupling capacitor Then to the CC1100E supply pins. Supply filtering is very important. Each decoupling capacitor ground pad should be connected separately to a ground plane hole. Direct connections between adjacent supply pins will increase noise coupling and should be avoided unless absolutely necessary. In the ground plane Routed under the chip or balun/RF matching circuit, or ground vias of the chip and

Ground vias for decoupling capacitors should be avoided. This improves grounding and ensures the shortest possible current return path. Ideally, external components should be as small as possible (0402 recommended) and surface mount devices are highly recommended. Please note that components may have different characteristics than specified sizes. Precautions should be used when placing the microcontroller in order to avoid noise interfering with the RF circuit. A CC1100E DK development kit with full functionality to assemble the CC1100E EM evaluation module is available. It is strongly recommended to do this next to the reference layout for best performance.

Configuration overview

The CC1100E can be configured for many different optimal performance applications. Configuring the SPI interface is done using configure. For more information, see the description of the SPI interface below. The following key parameters can be programmed:

Power-down/power-up mode

Crystal oscillator power up/down

receive/transmit mode

RF channel selection

data rate

modulation format

RX channel filter bandwidth

RF output power

Use separate 64 bytes for data buffering

Receive and transmit FIFO

Packet Radio Hardware Support

Forward Error Correction (FEC)

staggered

Data whitening

Wake on Radio (WOR)