Offers a wide range of supply voltages over the specified temperature range:
0C to 70C . …3V to 16V°°
–40 degrees Celsius to 85 degrees Celsius. …4V to 16V°°
–55 degrees Celsius to 125 degrees Celsius. …4V to 16V°°
Single-Supply Operation Common-Mode Input Voltage Range Extends Below Negative Rail (C Suffix, I Suffix Type)
The output voltage range includes negative voltage rails with high input impedance. … 1012 TIP #
ESD Protection Circuit Small Outline Package Option Also Available in Tape and Reel Latch Immunity Design Description
The TLC272 and TLC277 precision dual op amps combine a wide range of input offset voltage ratings with low offset voltage drift, high input impedance, low noise, and speeds approaching general-purpose bimodal devices.
These devices utilize TI's lithium silicotungstate metal oxide semiconductor technology, which provides offset voltage stability far beyond that of conventional metal gate processes.
Extremely high input impedance, low bias current, and high slew rate make these cost-effective devices ideal for applications previously reserved for BIFET and NFET products. Four offset voltage grades (C suffix and I suffix types) are available, from the low-cost TLC272 (10 mV) to the high-precision TLC277 ( 500 μV). These advantages, combined with good common-mode rejection and supply voltage rejection, make these devices a good choice for new state-of-the-art designs and upgrades to existing designs.

In general, many of the functions associated with bipolar technology can be used with Lincmos op amps without the power loss of bipolar technology. General applications, such as sensor interfaces, analog computing, amplifier modules, active filters, and signal buffering, are easy to design with the TLC272 and TLC277. These devices also exhibit low-voltage single-supply operation, making them ideal for remote and inaccessible battery-powered applications. The common-mode input voltage range includes the negative rail.
Wide range of packaging options, including low profile and high density system application chip carrier versions.
The inputs and outputs of the device are designed to withstand -100 mA inrush current without maintaining latch-up.
The TLC272 and TLC277 contain internal antistatic protection circuitry that is tested to MIL-STD-883C Method 3015.2 to prevent functional failure at voltages up to 2000 V; however, care should be taken when handling these devices due to exposure to static electricity The performance of device parameters may be degraded under discharge.
C suffix devices are characterized by an operating temperature of 0°C to 70°C. The I suffix devices are characterized by an operating temperature of -40°C to 85°C. The M suffix units feature an operating temperature of -55°C to 125°C.
Equivalent Schematic (per amplifier)

TLC272Y Chip Information This chip, when properly assembled, exhibits similar characteristics to the TLC272C. Thermocompression or ultrasonic soldering can be used on doped aluminum pads. Chips can be mounted with conductive epoxy or gold-silicon preforms.

Absolute Maximum Ratings Over Operating Free Air Temperature Range (unless otherwise noted) γ
Supply voltage, V. …………18V DD
Differential Input Voltage, V. ………±VDD ID input voltage range, V (any input). …–0.3 V to VDD input current, I
….±5 mA output current, I (per output)
...total current is ±30 mA to V. ……45mA i i oDD
Total ground current. ………….45 mA short-circuit current duration at (or below) 25°C).
….Unlimited continuous total dissipation. ……See Dissipation Rating Table Operating Free Air Temperature, T:C suffix. ………0°C to 70°C-my suffix. …–40°C to 85°C
M suffix. …………–55°C to 125°C
Storage temperature range. ……………….–65°C to 150°C
Case temperature 60 seconds: FK packaging. …………0.260°C Wire Temperature: 1.6 mm (1/16 inch) from case for 10 seconds: D, P, or PW package. ...260°C
Lead temperature is 1.6 mm (1/16 inch), 60 seconds from case: JG packaging. ……300°C
8224 ; Stresses exceeding the Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and do not imply functional operation of the device under these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
Note: 1. Except for differential voltages, all voltage values are related to network ground.
2. The differential voltage is at In+ with respect to In-.
3. The output may be shorted to either supply. Temperature and/or supply voltage must be limited to ensure maximum dissipation ratings are not exceeded (see application chapter).

Single-supply and split-supply test circuits

Since the TLC272 and TLC277 are optimized for single-supply operation, the circuit configuration used for the various tests is often a little inconvenient because in many cases the input signal must be offset from ground. This inconvenience can be avoided by using separate power supplies and output load test equipment connected to the negative rail. A comparison of the single-supply and split-supply test circuits is shown below. The use of either circuit will produce the same result.

Input Bias Current Due to the high input impedance of the TLC272 and TLC277 op amps, attempting to measure input bias current will result in erroneous readings. The bias current at normal room temperature is usually less than 1 Pa, which is easily exceeded by leakage on the test socket. To avoid measurement errors, two suggestions are made
1. Isolate equipment from other potential sources of leakage. Use grounded shielding around and between device inputs or leakage into the inputs is shunted away.
2. Compensate for leakage from the test socket by actually performing an input bias current test (using a picoammeter) with no device in the test socket. The actual input bias current can then be calculated by subtracting the open socket leakage reading from the reading obtained by the device in the test socket.
One caveat: Many automatic testers and some benchtop op amp testers use servo loop techniques with a resistor in series with the device input to measure the input bias current (measure the voltage drop across the series resistor, and calculate the bias current). This method requires the device to be plugged into a test receptacle for proper readings; therefore, open receptacle readings are not feasible using this method.
Isolation metal around device inputs (JG and P packages)
Low-level output voltage In order to obtain lower supply voltage operation, some compromises must be made in the input stage. This tradeoff results in the device's low-level output being dependent on both the common-mode input voltage level and the differential input voltage level. These two conditions should be observed when attempting to correlate low-level output readings with those referenced in the electrical specifications. If other conditions are to be used, please refer to this datasheet Typical Characteristics Input Offset Voltage Temperature Coefficient Incorrect readings are usually caused by attempting to measure the temperature coefficient of the input offset voltage. This parameter is actually a calculation using input offset voltage measurements taken at two different temperatures. When one (or both) temperatures are below freezing, moisture builds up on both the device and the test socket. Moisture can cause leakage and contact resistance, resulting in erroneous input offset voltage readings. The previously mentioned isolation techniques have no effect on leaks, as the moisture also coats the isolation metal itself, thus rendering it ineffective. It is recommended that these measurements be made at temperatures above freezing to minimize errors.
Parameter Measurement Information Full Power Response Full power response, that is, the frequency at which the op amp slew rate limits the output voltage swing, is usually specified in two ways: full linear response and full peak response. Fully linear response is usually measured by monitoring the level of distortion at the output while increasing the frequency of the sinusoidal input signal until a maximum frequency is found above which the output contains significant distortion. Full peak response is defined as the maximum output frequency without regard to distortion beyond which full peak-to-peak output swing cannot be maintained.
Since there is no industry-wide acceptable value for significant distortion, the full peak response is specified in this data sheet and measured using the circuit in Figure 1. The initial setup consists of using a sine input to determine the maximum peak-to-peak output of the device (the amplitude of the sine wave increases until clipping occurs). Then replace the sine wave with a square wave of the same amplitude. Then increase the frequency until the maximum peak-to-peak output can no longer be maintained. A square wave is used to more precisely determine the point of maximum peak-to-peak output.

Single-Supply Operation While the TLC272 and TLC277 work well with dual power supplies (also known as balanced or split power supplies), their designs are optimized for single-supply operation. The design includes an input common-mode voltage range that includes ground and an output voltage range that is pulled down to ground. The supply voltage range extends down to 3 V (C suffix type), thus allowing operation with supply levels typically available for TTL and HCMOS; however, for maximum dynamic range, a single 16 V supply operation is recommended.
Many single-supply applications require a voltage to be applied to one input to establish a reference level above ground. A resistor divider is usually sufficient to establish this reference level. The low input bias currents of the TLC272 and TLC277 allow the use of very large resistor values to implement voltage dividers, minimizing power dissipation.
The TLC272 and TLC277 work well with digital logic; however, the following precautions are recommended when powering linear devices and digital logic from the same supply:
1. Power the linear unit from a separate bypass power line; otherwise, the linear unit power rail may fluctuate due to voltage sag due to high switching currents in the digital logic.
2. Use appropriate bypass techniques to reduce the probability of noise causing errors. A single capacitor decoupling is usually sufficient; however, high frequency applications may require RC decoupling.

The input characteristics specify the minimum and maximum input voltages for the TLC272 and TLC277, exceeding either input could cause the device to malfunction. Exceeding this specification is a common problem, especially in single-supply operation. Note that the lower limit includes the negative rail, while the upper limit is specified as V–1 V at t=25°C and V–1.5 V at all other temperatures. DD-DD
The use of a polysilicon gate process and careful input circuit design give the TLC272 and TLC277 very good input offset voltage drift characteristics relative to conventional metal gate processes. The offset voltage shift in CMOS devices is largely affected by the threshold voltage shift caused by the polarization of phosphorus doped in the oxide. Placing phosphorus dopants in conductors, such as polysilicon gates, alleviates polarization issues, reducing threshold voltage shift by more than an order of magnitude. The offset voltage drift over time has been calculated to be typically 0.1 μV/month, including the first month of operation.
Because of their extremely high input impedance and resulting low bias current requirements, the TLC272 and TLC277 are well suited for low-level signal processing; however, leakage currents on printed circuit boards and sockets can easily exceed bias current requirements, and Causes device performance to degrade. It is a good practice to include guard rings at the input (similar to Figure 4 in the Parametric Measurement Information section). These guards should be driven from a low impedance source at the same voltage level as the common mode input. Unused amplifiers should be connected as unity gain followers to ground to avoid possible oscillations.

Noise performance The noise specification in an op amp circuit is highly dependent on the current in the first stage differential amplifier. The low input bias current requirements of the TLC272 and TLC277 result in very low noise currents, which are insignificant in most applications. This characteristic makes the device more advantageous than bipolar devices when using circuit impedance values greater than 50 kΩ, which exhibit larger noise currents.

Electrostatic Discharge Protection Tested in accordance with MIL-STD-883C Method 3015.2, the TLC272 and TLC277 contain an internal electrostatic discharge (ESD) protection circuit that prevents functional failure at voltages up to 2000 V. However, care should be taken when handling these devices as exposure to electrostatic discharge may result in degraded performance of device parameters. The protection circuit also makes the input bias current temperature dependent and has the characteristics of a reverse biased diode.
Latch-up Since CMOS devices are prone to latch-up due to their inherent parasitic thyristors, the TLC272 and TLC277 inputs and outputs are designed to withstand -100 mA inrush currents without maintaining latch; however, try to Techniques may be used to reduce the chance of latching. By design, the internal protection diodes should not be forward biased. The applied input and output voltages should not exceed 300 mV of the supply voltage. Care should be taken when using capacitive coupling on pulse generators. Power transients should be shunted by using decoupling capacitors (0.1 microF typical) on the power rails as close to the device as possible.
If latch-up occurs, the established current path is typically between the positive supply rail and ground, and can be triggered by a surge on the supply line and/or voltage on the output or input (in excess of the supply voltage). Once latching occurs, the current is limited only by the source impedance and the parasitic thyristor forward resistance, often resulting in device damage. Latch-up is more likely to occur as temperature and supply voltage increase.

Marketing status values are defined as follows:
Activity: Recommended for newly designed product installations.
LIFEBUY: Texas Instruments has announced that the device will be discontinued and a lifetime purchase period will be in effect.
NRND: Not recommended for new designs. The device is in production to support existing customers, but TI does not recommend using the part in new designs. Preview: The device has been released, but not yet in production. Samples may or may not be available. Obsolete: TI has discontinued production of this device.
RoHS: Ti defines "RoHS" to refer to semiconductor products that meet the RoHS requirements of all 10 current RoHS substances in the European Union, including the requirement that the weight of RoHS substances in homogeneous materials does not exceed 0.1%. Where designed for high temperature soldering, "RoHS" products apply to specified lead-free processes. TI may refer to these types of products as "lead-free".
RoHS Exemption: Ti defines a "RoHS exemption" as a product that contains lead but is EU RoHS compliant, specified as EU RoHS exemption.
Green: Ti defines "green" when the content of chlorine (Cl) and bromine (Br) based flame retardants meets the JS709B low halogen requirement <= 1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temperature - Moisture Sensitivity Rating according to JEDEC Industry Standard Classification, and Maximum Solder Temperature.
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(5)
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