XC7Z045-L2FFG900I

Specification

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Manufacturer: Xilinx

Product Category: Processors - Specialty Applications

RoHS: Details

Installation style: SMD/SMT

Package / Box: FBGA-900

Series: XC7Z045

Application: Automotive, Infotainment Applications

Core: ARM Cortex A9

Number of cores: 2 Core

Data bus width: 32 bit

Maximum clock frequency: 800 MHz

L1 cache instruction memory: 32 kB, 32 kB

L1 cache data memory: 32 kB, 32 kB

Minimum operating temperature:- 40 C

Maximum operating temperature: + 100 C

Storage Type: DDR2, DDR3, DDR3L, LPDDR2

Trademark: Xilinx

Data RAM size: 256 kB

Interface Type: CAN, Ethernet, GPIO, SDIO, UART, USB

Number of input/output terminals: 362 I/O

I/O voltage: 1.2 V to 3.3 V

Manual Type: Floating Point

L2 cache instruction/data memory: 512 kB

Humidity Sensitivity: Yes

Processor Family: Zynq-7000 SoC

Product Type:Processors - Application Specialized

Factory Packing Quantity: 1

Subcategory: Processors - Application Specialized

Brand Name: Zynq

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Chip Details

Manufacturer Part Number:

XC7Z045-L2FFG900I

Rohs Code:

Yes

Part Life Cycle Code:

Active

Ihs Manufacturer:

XILINX INC

Package Description:

BGA,

Reach Compliance Code:

compliant

ECCN Code:

3A991.D

HTS Code:

8542.39.00.01

Factory Lead Time:

12 Weeks

Manufacturer:

Xilinx

Risk Rank:

5.63

Additional Feature:

PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

Boundary Scan:

YES

Bus Compatibility:

CAN;_ETHERNET;_I2C;_SPI;_UART;_USB

Clock Frequency-Max:

800MHz

JESD-30 Code:

S-PBGA-B900

JESD-609 Code:

e1

Length:

31 mm

Moisture Sensitivity Level:

4

Number of I/O Lines:

4

Number of Terminals:

900

Operating Temperature-Max:

100 °C

Operating Temperature-Min:

-40 °C

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

SQUARE

Package Style:

GRID ARRAY

Peak Reflow Temperature (Cel):

245

RAM (words):

131072

Seated Height-Max:

3.35mm

Supply Voltage-Max:

1.05V

Supply Voltage-Min:

0.95V

Supply Voltage-Nom:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max (s):

30

Width:

31 mm

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