BA10358 /BA10324A and high-reliability BA2904/BA2902 integrate two or four independent operational amplifiers on a single chip and have some features with high gain, low power consumption and wide operating voltage range from 3V to 36V (single power supply). The BA2904W has a low input offset voltage (2mV max).

feature

Can be powered by a single power supply

Wide operating supply voltage range

Both inputs and outputs operate with GND sensing

low supply current

High open loop voltage gain

Wide temperature range

application

Current Sensing Applications

Buffered Application Amplifier

Active filter

Consumer electronics products

Maximum Operating Temperature Chart

Simplified schematic

Pin Configuration Figure 1

Pin Configuration Figure 2

Electrical Characteristics Description

Described below is a description of the relevant electrical terminology used in this data sheet. Items and symbols used are also shown. Please note that item names and symbols and their meanings may differ from other manufacturers' documentation or other general documents.

1. Absolute Maximum Ratings

Absolute Maximum Ratings items represent conditions that must not be exceeded. Applying a voltage exceeding the absolute maximum rating or using an environment exceeding the absolute maximum rating may result in deterioration of characteristics.

(1) Power supply voltage (VCC/VEE) represents the maximum voltage that can be applied between the positive power supply terminal and the negative power supply terminal without deteriorating or destroying the characteristics of the internal circuit.

(2) Differential input voltage (VID) represents the maximum voltage that can be applied between the non-inverting and inverting terminals without damaging the IC.

(3) Input Common Mode Voltage Range (VICM) represents the maximum voltage that can be applied to the non-inverting and inverting terminals without deteriorating or destroying electrical characteristics. The maximum rating of the input common-mode voltage range does not guarantee proper operation of the IC. For normal operation, use the IC within the input common mode voltage range characteristics.

(4) Power consumption (PD)

Indicates the power that the IC can dissipate when mounted on a specific circuit board at an ambient temperature of 25°C (normal temperature). For packaged products, Pd is determined by the temperature allowed by the IC to the package (maximum junction temperature) and the thermal resistance of the package.

2. Electrical Characteristics

(1) Input offset voltage (VIO)

Indicates the voltage difference between the non-inverting terminal and the inverting terminal. It translates to the input dropout required to set the output voltage to 0 V.

(2) Input offset voltage drift (△VIO /△T)

Indicates the ratio of input offset voltage fluctuations to ambient temperature fluctuations.

(3) Input offset current (IIO)

Indicates the difference in input bias current between the non-inverting and inverting terminals.

(4) Input offset current drift (△Iio /△T)

Indicates the ratio of input offset current fluctuations to ambient temperature fluctuations.

(4) Input bias current (IB)

Indicates the current flowing into or out of the input terminal. It defines the non-inverting and inverting terminals by the average value of the input bias current.

(5) Supply current (ICC)

Indicates the current flowing within the IC under specified no-load conditions.

(7) Maximum output voltage (high) / maximum output voltage (low) (VOH/VOL)

Indicates the output voltage range under specified load conditions. It is usually divided into high and low maximum output voltage. Maximum output voltage high indicates the upper limit of the output voltage. A low maximum output voltage indicates a lower limit.

(8) Large signal voltage gain (Av)

Indicates the amplification (gain) of the output voltage and the voltage difference between the non-inverting terminal and the inverting terminal. Usually the amplification (gain) of the referenced DC voltage. Av = (output voltage)/(differential input voltage)

(9) Input common mode voltage range (VICM)

Indicates the input voltage range over which the IC operates normally.

(10) Common Mode Rejection Ratio (CMRR)

Indicates the fluctuation ratio of the input offset voltage when the input common mode voltage changes. It is usually a fluctuation of DC. CMRR = (change in input common mode voltage) / (input offset fluctuation)

(11) Power supply rejection ratio (PSRR)

Indicates the fluctuation ratio of the input offset voltage when the power supply voltage changes. Usually a fluctuation of DC. PSRR = (Supply Voltage Variation) / (Input Offset Fluctuation)

(12) Output source current/output sink current (Isource/Isink)

The maximum current that can be output from the IC under specific output conditions. The output source current represents the current flowing out of the IC, and the output sink current represents the current flowing into the IC. represents the current flowing out of the IC, and the output sink current represents the current flowing into the IC.

(13) Channel separation (CS)

Indicates the fluctuation of the output voltage of the driven channel, and refers to the undriven channel whose output voltage changes.

(14) Slew rate (SR)

Represents the ratio of the change in output voltage to time when a step input signal is applied.

(15) Gain bandwidth (GBW)

The product of the open loop voltage gain and the frequency at which the voltage gain is reduced by 6dB/octave.

(16) Input referred noise voltage (VN)

Indicates that the noise voltage generated inside the op amp is equivalent to a series of connected ideal voltage sources with input terminals.

Test circuit 1 (one channel only)

Test Circuit 2 (each op amp)

Test circuit 3 (channel separation) (R1 = 1kΩ, R2 = 100kΩ)

voltage follower

The voltage gain is 0 dB. The circuit controls the output voltage (OUT) to be equal to the input voltage (IN) and keeps OUT stable because of high input impedance and low output impedance. OUT displays the next formula. OUT= IN

Inverting amplifier

For an inverting amplifier, IN is amplified by the voltage gain to determine R1 and R2, and the inverse voltage is the output. OUT displays the next formula. OUT = - (R2/R1) IN input impedance is R1.

non-inverting amplifier

For a non-inverting amplifier, IN determines R1 and R2 by the voltage amplification gain, which is the same phase as IN. OUT displays the next formula. OUT = (1 + R2/R1) IN This circuit achieves high input impedance because the input impedance is the input impedance of the op amp.

Power consumption

Power dissipation (total loss) represents the power that the IC can dissipate at TA = 25°C (normal temperature). As the IC consumes power, it heats up, causing it to get hotter than the ambient temperature. There is a limit to the temperature that the IC can accept. It depends on circuit configuration, manufacturing process and power consumption. Power dissipation depends on the temperature allowed within the IC (maximum junction temperature) and the thermal resistance (heat dissipation capability) of the package used. The maximum junction temperature is usually equal to the maximum storage temperature. The heat generated by the IC dissipating power radiates out of the mold encapsulated resin or lead frame. The thermal resistance, denoted by the notation θJA°C/W, represents this heat dissipation capability. Similarly, the temperature of an IC within its package can be estimated through thermal resistance.

Instructions

1. Reverse connection of power supply

Connecting the power supply with reversed polarity will damage the IC. Connect the power supply taking precautions to prevent reverse polarity, such as installing an external diode termination between the power supply and the IC power supply.

2. Power cord

Design the PCB layout pattern to provide low impedance ground and power lines. Separate the ground and the lines supplying the digital and analog blocks to prevent ground noise and the supply lines for the digital blocks from being affected by the analog blocks. Also, connect capacitors to ground on all power pins. Consider the effect of temperature and aging on capacitance values when using electrolytic capacitors.

3. Ground voltage

Even under transient conditions, make sure that at no time is the voltage on the pin lower than the voltage on the ground pin.

4. Ground wire mode

When using both small-signal and high-current GND traces, the two ground traces should be routed separately and connected to a single ground at the application board reference point to avoid ground caused by small signal fluctuations and high current. Also make sure that the GND traces of external components do not cause varying GND voltages. Power and ground wires must be as short and thick as possible to reduce line impedance.

5. Heat dissipation considerations

If the power rating is exceeded, it may cause the chip temperature to rise and chip performance to deteriorate. The absolute maximum ratings for Pd specified in this specification are when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. If this absolute maximum rating is exceeded, increase the board size and copper area to prevent exceeding the Pd rating.

6. Recommended operating conditions

These conditions represent the range within which the expected characteristics of the IC can be approximately obtained. Electrical characteristics are guaranteed under the conditions of each parameter.

7. Inrush current

When power is first applied to the IC, the internal logic may be unstable and inrush current may flow instantaneously due to internal power supply sequencing and delays, especially if the IC has multiple power supplies. Therefore, special consideration should be given to power coupling capacitance, power wiring, GND wiring width, and wiring connections.

8. Operation under strong electromagnetic field

Operating the IC in the presence of strong electromagnetic fields may cause the IC to malfunction.

9. Test on the application board

When testing an IC on an application board, it is possible to connect capacitors directly to the low-impedance output pins of the IC to stress. Always fully discharge capacitors after each process or step. Power to the IC should be fully shut down before being connected during inspection or removed from the test setup. To prevent damage from electrostatic discharge, ground the IC during assembly and store it during shipping using similar precautions.

10. Short circuit between pins and installation errors

When mounting the IC on the PCB, make sure the orientation and position are correct. Incorrect installation may damage the IC. Avoid shorting nearby pins to each other, especially to ground. Pin shorts can be due to many reasons such as metal particles, water droplets (in very humid environments) and unintentional solder bridges deposited between the pins during assembly.