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2022-09-24 17:43:29
XC7Z045-3FBG676E
XC7Z045-3FBG676E product detailed specifications
Specifications XC7Z045-3FBG676E datasheet Specifications
Zynq-7000 (XC7Z030/045/100)
Zynq-7000 All Programmable SoC Overview
Zynq-7000 Errata
Zynq-7000 User Guide
DocumentationAdditional Wafer Fabrication 16/Dec/2013
MCU RAM 256KB
Main attributes Kintex?-7 FPGA, 350K Logic Cells
Vendor Device Package 676-FCBGA (27x27)
Package Tray
Connectivity CAN, EBI/EMI, Ethernet, I²C, SD, SPI, UART/USART, USB OTG
Operating temperature 0°C ~ 100°C
Number of I/O pins 130
Standard Package 1
Peripheral DMA
Package/Case 676-BBGA, FCBGA
Core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Speed 1GHz
Architectural MCU, FPGA
XC7Z045-3FBG676E series products
model
factory
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XC7Z045-3FBG676ERelated Search
XC7Z
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