XC7K325T-2FBG676I

Mouser ID: 217-C7K325T-2FBG676I

Manufacturer number:

XC7K325T-2FBG676I

Manufacturer: Xilinx

illustrate:

FPGA - Field Programmable Gate Array XC7K325T-2FBG676I

Lifecycle: New Product: New from this manufacturer.

data sheet:

XC7K325T-2FBG676I Datasheet

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Specification

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Manufacturer: Xilinx

Product Category:FPGA - Field Programmable Gate Array

RoHS: Details

Product: Kintex-7

Number of logic elements: 326080

Number of input/output terminals: 400 I/O

Operating supply voltage: 1.2 V to 3.3 V

Minimum operating temperature:- 40 C

Maximum operating temperature: + 100 C

Installation style: SMD/SMT

Package/Case: FCBGA-676

Data rate: 6.6 Gb/s

Series: XC7K325T

Trademark: Xilinx

Distributed RAM: 4000 kbit

Embedded block RAM - EBR: 16020 kbit

Maximum operating frequency: 640 MHz

Humidity Sensitivity: Yes

Number of Transceivers: 8 Transceiver

Product Type:FPGA - Field Programmable Gate Array

Factory Packing Quantity: 1

Subcategory: Programmable Logic ICs

Brand Name: Kintex

product compliance

More information

Kintex®-7 FPGA

Xilinx Kintex™-7 FPGAs provide optimal price/performance and low power consumption for fast-growing applications and wireless communications. Kintex-7 FPGAs offer superior performance and connectivity at prices previously limited to higher-volume applications.

Summary of 7 Series FPGA Features

? Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.

? 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data

buffering.

? High-performance SelectIO? technology with support for DDR3

interfaces up to 1,866 Mb/s.

? High-speed serial connectivity with built-in multi-gigabit transceivers

from 600 Mb/s to max. rates of 6.6 Gb/s up to 28.05 Gb/s, offering a

special low-power mode, optimized for chip-to-chip interfaces.

? A user configurable analog interface (XADC), incorporating dual

12-bit 1MSPS analog-to-digital converters with on-chip thermal and_supply sensors.

? DSP slices with 25 x 18 multiplier, 48-bit accumulator, and_pre-adder

for high-performance filtering, including optimized symmetric

coefficient filtering.

? Powerful clock management tiles (CMT), combining phase-locked

loop (PLL) and_mixed-mode clock manager (MMCM) blocks for high

precision and_low jitter.

? Quickly deploy embedded processing with MicroBlaze? processor.

? Integrated block for PCI Express? (PCIe), for up to x8 Gen3

Endpoint and_Root Port designs.

? Wide variety of configuration options, including support for

commodity memories, 256-bit AES encryption with HMAC/SHA-256

authentication, and_built-in SEU detection and_correction.

? Low-cost, wire-bond, bare-die flip-chip, and_high signal integrity flipchip packaging offering easy migration between family members in

the same package. All packages available in Pb-free and_selected

packages in Pb option.

? Designed for high performance and_lowest power with 28 nm,

HKMG, HPL process, 1.0V core voltage process technology and_0.9V core voltage option for even lower power.XC2S100-5-PQG-208C

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Advantages of aerospace and military companies: XILINX, ALTERA, SAMSUNG, MICRON, HYNIX, NANYA, ISSI, INTEL, TI, MAXIM, ADI, POWER, DAVICOM, PLX, CYPRESS, MARVELL, AOS, ON, ST, NXP, TOSHIBA, DIODES, RENESAS, ATMEL, IR, FREESCALE, NS, AVAGO, etc.. Advantageous brands.