The BA4558 , BA4558F and BA4558N are monolithic ICs with two operational amplifiers with low power consumption and internal phase compensation mounted on a single silicon die. These products provide high speed, wide bandwidth and low noise. Excellent thermal characteristics and voltage gain bandwidth make these ICs ideal for a variety of electronic circuits. The BA4558 is available in an 8-pin DIP package and is compatible with the 4558 op amp. The BA4558F is available in an 8-pin SOP package and an 8-pin SIP package.

The ordinary BA4558 and the high reliability BA4558R integrate two independent operational amplifiers on one chip. This series in particular is suitable for any audio application due to its low noise and low distortion characteristics. It can be used in many other applications with a wide operating supply voltage range. BA4558R It is a high reliability product with extended operation, temperature range and high ESD tolerance.

Features

High Voltage Gain, Low Noise, Low Distortion

Wide operating supply voltage

Internal ESD protection

Wide operating temperature range

key specification

Wide operating supply voltage

(Separate power supply): ±4.0V to ±15V

Wide temperature range: BA4558: -40°C to +85°C

BA4558R: -40°C to +105°C

High conversion rate: 1V/μs (typ.)

Total Harmonic Distortion: 0.005% (typ.)

Input referred noise voltage: 12 HznV/(typ)

selection guide

maximum operating temperature

block diagram

Simplified schematic

Pin Configuration (TOP VIEW)

Electrical Characteristics Description

Described here are the electrical characteristics terminology used in this data sheet. The bullets and symbols used are also shown. Note that item names and symbols and their meanings may differ from those in other manufacturers' documentation or general documentation.

1. Absolute Maximum Ratings

Absolute Maximum Ratings items represent conditions that must not be exceeded. Applying voltages in excess of the Absolute Maximum Ratings or using a temperature environment that exceeds the Absolute Maximum Ratings may result in degraded characteristics.

1.1 Power supply voltage (VCC-VEE)

Indicates the maximum voltage that can be applied between the positive power supply terminal and the negative power supply terminal without deteriorating or destroying the characteristics of the internal circuit.

1.2 Differential input voltage (Vid)

Indicates the deterioration and destruction of the characteristics of the IC, the maximum voltage that can be applied between the non-inverting terminal and the inverting terminal.

1.3 Input common mode voltage range (Vicm)

Indicates the maximum voltage characteristic degradation or destruction that can be applied to the non-inverting and inverting terminals. The maximum rating of the input common-mode voltage range does not guarantee proper operation of the IC. When normal operation is required, the characteristics of the input common mode voltage must follow the project.

1.4 Power consumption (Pd)

Indicates the power that can be consumed by the specified mounting board at an ambient temperature of 25°C (normal temperature). For packaged products, Pd is determined by the allowable temperature of the IC core in the package (maximum junction temperature) and the thermal resistance of the package.

2. Electrical Characteristics Items

2.1 Input Offset Voltage (Vio)

Represents the voltage difference between the non-inverting and inverting terminals. It can be translated into the input voltage difference required to set the output voltage to 0V.

2.2 Input offset current (Iio)

Indicates the difference in input bias current between the non-inverting and inverting terminals.

2.3 Input Bias Current (Ib)

Indicates the current flowing into or out of the input terminal. It defines the input bias current of the non-inverting and inverting terminals by the average value of the input bias current.

2.4 Input common mode voltage range (Vicm)

Indicates the input voltage range over which the IC operates normally.

2.5 Large Signal Voltage Gain (AV)

Indicates the amplification (gain) of the output voltage and the voltage difference between the non-inverting terminal and the inverting terminal. Usually the amplification (gain) of the referenced DC voltage. Av = (output voltage fluctuation)/(input offset fluctuation)

2.6 Circuit Current (ICC)

Indicates the IC current flowing under specified conditions and the no-load steady state.

2.7 Output Saturation Voltage (VOM)

Indicates the voltage range that can be output under specific output conditions.

2.8 Common Mode Rejection Ratio (CMRR)

Indicates the ratio of input offset voltage fluctuations when the non-inverting input voltage changes. Usually a fluctuation of DC.

CMRR = (change in input common mode voltage) / (input offset fluctuation)

2.9 Power Supply Rejection Ratio (PSRR)

Indicates the fluctuation ratio of the input offset voltage when the power supply voltage changes. Usually fluctuating DC. PSRR = (Supply Voltage Variation) / (Input Offset Fluctuation)

2.10 Channel Separation (CS)

Indicates the fluctuation of the input offset voltage or the fluctuation of the output voltage, referring to the change of the output voltage to drive the channel.

2.11 Slew Rate (SR)

SR is a parameter representing the movement speed of the operational amplifier. It expresses the rate of variable output voltage as a unit of time.

2.12 Transition frequency (ft)

Represents the frequency at which the voltage gain of the op amp is 1.

2.13 Total Harmonic Distortion (THD + N)

Indicates the fluctuation of the input offset voltage or the fluctuation of the output voltage, referring to the change of the output voltage to drive the channel.

2.14 Input-Referred Noise Voltage (Vn)

Indicates that the noise voltage generated inside the op amp is equivalent to a series of connected ideal voltage sources with input terminals.

Power consumption

Power dissipation (total loss) represents the power that the IC can dissipate at Ta = 25°C (normal temperature). The IC is heated as it consumes power and the temperature of the IC die becomes higher than the ambient temperature. Temperature IC chips can accept limits that depend on circuit configuration, manufacturing process and consumable power.

The power dissipation is determined by the allowable temperature of the IC die (maximum junction temperature) and the heat of the package resistance (the ability to dissipate heat). The maximum junction temperature is usually equal to the value within the maximum storage temperature range. The IC consumes power to generate heat from the molded resin or lead radiating the frame of the package. A parameter representing this heat dissipation capability (heat release hardness) is called thermal resistance, and is represented by the symbol θja°C/W. The temperature of the IC inside the package can be estimated from this

thermal resistance. Thermal resistance θja, ambient temperature Ta, junction temperature Tj and power dissipation Pd can be calculated by the following formula:

θja=(Tjmax-Ta)/Pd℃/W・・・(Ⅰ)

The derating curve in Figure 50(b) represents the power that the IC can dissipate with reference to the ambient temperature. Power can be dissipated by the IC referring to the ambient temperature. The power that the IC can dissipate starts to diminish by a certain ambient temperature. This gradient is determined by the thermal resistance θja. Thermal resistance θja depends on

Chip size, power consumption, package, ambient temperature, package conditions, wind speed, etc. are uniformly used in the same package. Thermal reduction curves represent reference values measured under specified conditions.

circuit example

voltage follower

The voltage gain is 0 dB. This circuit controls the output voltage (Vout) to be equal to the input voltage (Vin) and keeps Vout stable because

High input impedance and low output impedance. Vout shows the next formula. VOUT= Vin

Inverting amplifier

For an inverting amplifier, the Vi(b) derating curve voltage gain determines R1 and R2, and the phase-reversed voltage output. Vout shows the next formula. VOUT = - (R2/R1) Vin's input impedance is R1.

non-inverting amplifier

For a non-inverting amplifier, Vin determines R1 and R2 by the voltage amplification gain, which is the same phase as Vin. Vout shows the next formula. Vout = (1 + R2/R1) Vin This circuit achieves high input impedance because the input impedance is the input of the op amp

impedance.

Instructions

1) Dealing with unused circuits It is recommended to apply the connections (see diagram below) and set the input terminals (Vicm) within the common mode voltage range of the non-inverting input, any unused circuits.

2) Input voltage

Applications (VEE - 0.3) to (VEE + 36) V (BA4558R) can input terminals without causing degraded electrical characteristics or destruction, regardless of supply voltage. However, this does not ensure normal circuit operation. Note the electrical characteristics of the input voltage range for the circuit to function properly only when the input voltage is within the common-mode range.

3) Maximum output voltage

Because the output voltage range is narrowed and the output current is narrowed and increased, the application electrical characteristics and temperature characteristics are designed with margin by considering the changes.

4) The output terminal is short-circuited

When the output terminal and the VCC or VEE terminal are short-circuited, excessive output current may flow under certain conditions, and heating may destroy the IC. It is necessary to connect a resistor as shown below to prevent short circuit of the resistive load.

5) Power supply in use (split supply/single supply)

The op amp operates when the specified voltage is applied between VCC and VEE. Therefore, single-supply op amps can also be used in dual-supply op amps.

6) Power consumption (Pd)

According to the power consumption (Pd) in actual operation, use thermal design, allowing sufficient margin conditions.

7) Short circuit between pins and wrong installation

Pay attention to the mounting direction of the IC. Mounting orientation between terminals, GND, or other terminals, or short-circuiting components on the wrong circuit can damage the IC.

8) Use in strong electromagnetic fields

Using the IC in strong electromagnetic fields can cause malfunctions in operation.

9) Radiation

This IC is not designed to be radiation hardened.

10) IC processing

When stress is applied to the IC due to deflection or bending of the plate, the characteristics may fluctuate due to piezoelectric (piezo) effects.

11) Check the fixing plate

During testing, turn the power on or off before installing or removing the board from the test fixture. Do not turn on the power board without waiting for the output capacitors to discharge. Capacitors in low output impedance terminals can stress the device. During IC handling, transportation and storage, please be aware of electrostatic voltage.

12) Output capacitor

When the VCC terminal is short-circuited to the VEE (GND) potential and the electric charge is accumulated on the external capacitor, connected to the output terminal, the accumulated electric charge can be discharged in the VCC terminal through the parasitic element circuit or the terminal protection element. Components in the circuit can be damaged (thermally destroyed). There is no output capacitive load when using this IC for application circuits where oscillation exists, such as using this IC as a voltage comparator. Set the capacitor connected to the output terminal below 0.1µF to prevent damage to the IC.