BA4560 is for ordinary grade and BA4560R, BA4564RFV, BA4564WFV are used for high reliability grade to integrate two or four pressure gain operational amplifiers on a single chip. In particular, this series is suitable for any audio applications characterized by low noise and low distortion, and they can be used in many other applications over a wide operating supply voltage range.

feature

High Voltage Gain, Low Noise, Low Distortion

Wide operating supply voltage range

Wide operating temperature range

Selection Guide, Maximum Operating Temperature

Simplified schematic

Pin Configuration Diagram

Electrical Characteristics Description

1. Absolute Maximum Ratings

Absolute Maximum Ratings items represent conditions that must not be exceeded. Over voltage applications

Absolute Maximum Ratings or use in an ambient temperature beyond the Absolute Maximum Ratings may cause deterioration

Features.

1.1 Power supply voltage (VCC-VEE)

Indicates the maximum voltage that can be applied between the positive power supply terminal and the negative power supply terminal without deteriorating or destroying the characteristics of the internal circuit.

1.2 Differential Input Voltage (VID)

Indicates the maximum voltage that can be applied between the non-inverting terminal and the inverting terminal, which deteriorates and destroys the characteristics of the IC.

1.3 Input Common Mode Voltage Range (VICM)

Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals, characteristic deterioration or destruction. The maximum rating of the input common-mode voltage range does not guarantee proper operation of the IC. When normal operation is required, the characteristics of the input common mode voltage must follow the project.

1.4 Power consumption (PD)

Indicates the power that can be consumed by the specified mounting board at an ambient temperature of 25°C (normal temperature). For packaged products, PD is determined by the allowable temperature of the IC chip in the package (maximum junction temperature) and the thermal resistance of the package.

2. Electrical Characteristics Items

2.1 Input Offset Voltage (VIO)

Represents the voltage difference between the non-inverting and inverting terminals. It can be translated into the input voltage difference required to set the output voltage to 0 V.

2.2 Input Offset Current (IIO)

Indicates the difference in input bias current between the non-inverting and inverting terminals.

2.3 Input Bias Current (IB)

Indicates the current flowing into or out of the input terminal. It defines the input bias current of the non-inverting and inverting terminals by the average value of the input bias current.

2.4 Input Common Mode Voltage Range (VICM)

Indicates the input voltage range over which the IC operates normally.

2.5 Large Signal Voltage Gain (AV)

Indicates the amplification (gain) of the output voltage and the voltage difference between the non-inverting terminal and the inverting terminal. Usually the amplification (gain) of the referenced DC voltage. AV = (output voltage fluctuation)/(input offset fluctuation)

2.6 Circuit Current (ICC)

Indicates the IC current flowing under specified conditions and the no-load steady state.

2.7 Output Saturation Voltage (VOM)

Indicates the voltage range that can be output under specific output conditions.

2.8 Common Mode Rejection Ratio (CMRR)

Indicates the ratio of input offset voltage fluctuations when the non-inverting input voltage changes. Usually a fluctuation of DC. CMRR = (change in input common mode voltage) / (input offset fluctuation)

2.9 Power Supply Rejection Ratio (PSRR)

Indicates the fluctuation ratio of the input offset voltage when the power supply voltage changes. Usually fluctuating DC. PSRR = (Supply Voltage Variation) / (Input Offset Fluctuation)

2.10 Unity Gain Frequency (ft)

Represents the frequency at which the voltage gain of the op amp is 1.

2.11 Slew Rate (SR)

SR is a parameter representing the movement speed of the operational amplifier. It expresses the rate of variable output voltage as a unit of time.

2.12 Gain Bandwidth (GBW)

Indicates the frequency and gain that is multiplied by the voltage gain to reduce 6dB/octave.

2.13 Total Harmonic Distortion + Noise (THD + N)

Indicates the fluctuation of the input offset voltage or the fluctuation of the output voltage, referring to the change of the output voltage to drive the channel.

2.14 Input-Referred Noise Voltage (VN)

Indicates that the noise voltage generated inside the op amp is equivalent to a series of connected ideal voltage sources with input terminals.

Test circuit 1 (one channel only)

Test Circuit 2 (each op amp)

Slew rate input/output waveform

Test circuit 3 (channel separation)

Power consumption

Power dissipation (total loss) represents the power that the IC can dissipate at TA = 25°C (normal temperature). The IC is heated when it consumes power, and the temperature of the IC chip becomes higher than the ambient temperature. The acceptable temperature of this IC chip depends on circuit configuration, manufacturing process and limited power of consumables. Power dissipation is determined by the allowable temperature of the IC die (maximum junction temperature) to determine the thermal resistance (heat dissipation capability) of the package. The maximum junction temperature is usually equal to the maximum value over the storage temperature range. The heat generated by the dissipated power of the IC radiates from the molding resin or leads the frame of the package. The parameter that expresses this heat dissipation capability (exothermic hardness) is called thermal resistance, and it is represented by the symbol θJA°C/W. From this, the temperature thermal resistance of the IC within the package can be estimated.

voltage follower circuit

The voltage gain is 0dB. Using this circuit, the output voltage (OUT) is configured to be equal to the input voltage (IN). This circuit also stabilizes the output voltage (OUT) with high input impedance and low output impedance. The output voltage (OUT) is calculated as follows.

Inverting amplifier

For an inverting amplifier, the input voltage (IN) is amplified by a voltage gain and depends on the ratio of R1 and R2. The out-of-phase output voltage is shown in the figure above. The next expression is OUT = - (R2/R1) IN The input impedance of this circuit is equal to R1.

non-inverting amplifier

For a non-inverting amplifier, the input voltage (IN) is amplified by a voltage gain, which depends on the ratio R1 and R2. The output voltage (OUT) is the non-inverting input voltage (IN) expressed as shown above. OUT = (1 + R2/R1) IN In fact, this circuit has a high input impedance and its input side is the same as the operation side of the amplifier.

Instructions

1. Reverse connection of power supply

Connecting the power supply with reversed polarity will damage the IC. Connect the power supply taking precautions to prevent reverse polarity, such as installing an external diode supply pin between the power supply and the IC power supply.

2. Power cord

Design the PCB layout pattern to provide low impedance power lines. Separate ground and supply lines for digital and analog blocks to prevent ground noise and power lines from digital blocks from affecting analog blocks. Also, connect capacitors to ground on all power pins. When using electrolytic capacitors considering the influence of temperature and temperature, the capacitance value will deteriorate.

3. Ground voltage

Even under transient conditions, make sure that at no time is the voltage on the pin lower than the voltage on the ground pin.

4. Ground wire mode

When using small signal and high current ground traces, the two ground traces should be routed separately, but connected to a single ground at the reference point of the application board to avoid ground caused by fluctuations in small signals and high currents. Also make sure that the ground traces of external components do not cause variations in the ground voltage. The ground wire must be as short and thick as possible to reduce line impedance.

5. Heat dissipation considerations

If the power rating is exceeded, it may cause the chip temperature to rise and chip performance to deteriorate. The absolute maximum ratings for PDs specified in this specification are when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. If this absolute maximum rating is exceeded, increase the board size and copper area to prevent exceeding the PD rating.

6. Recommended operating conditions

These conditions represent the range within which the expected characteristics of the IC can be obtained. Electrical characteristics are guaranteed under the conditions of each parameter.

7. Inrush current

When power is first applied to the IC, the internal logic may be unstable and inrush current may flow instantaneously due to internal power supply sequencing and delays, especially if the IC has multiple power supplies. Therefore, special consideration should be given to power coupling capacitors, power traces, ground trace widths, and connection routing.

8. Operation under strong electromagnetic field

Operating the IC in the presence of strong electromagnetic fields may cause the IC to malfunction.

9. Test on the application board

When testing the IC on an application board, you can stress the IC by connecting capacitors directly to the low impedance output pins. Always fully discharge capacitors after each process or step. Power to the IC should always be completely turned off before being connected during inspection or removed from the test setup. To prevent damage from electrostatic discharge, ground the IC during assembly and take similar precautions for shipping and storage during use.

10. Short circuit between pins and installation errors

When mounting the IC on the PCB, make sure the orientation and position are correct. Incorrect installation may damage the IC. Avoid shorting nearby pins to each other, especially ground, power, and output pins. Pin shorts can be caused by a number of reasons, such as metal particles, water droplets (in very humid environments) during assembly, unintentional solder bridge deposits between the pins, to name a few.