ESD5Z6.0T1G ON TVS diode ESD DIODE 6V 181W excellent original spot import hot sale

ESD5Z6.0T1G product detailed specifications

ESD5Z6.0T1G datasheet

ESD5Z2.5T1

ESD5Z6.0T1G datasheet

Documentation Copper Wire 19/May/2010

Datasheet Update Max Forward Voltage 18/Jan/2008

RohsLead free / RoHS Compliant

Product Change Notice Specification Update Max Forward Voltage 18/Jan/2008

Standard package 3,000

Voltage - Reverse Isolation (typ) 6V

- Breakdown voltage 6.8V

Power (Watts) 181W

Polarized Unidirectional

Mounting Type Surface Mount

Bag/Box SC-79, SOD-523

Supplier Device Package SOD-523

Packaging Tape & Reel (TR)

Type TVS

Number of pins 2

Direction Type Uni-Directional

Maximum clamping voltage 20.5 V

Number of components per chip 1

ESD protection voltage ±30@Air Gap/±30@Contact Disc kV

Maximum operating voltage 6 V

Maximum leakage current 0.01 uA

Capacitance value 70(Typ) pF

Minimum operating temperature -55 °C

Maximum operating temperature 150 °C

Install the Surface Mount

Standard Packaging Tape & Reel

Maximum clamping voltage 20.5

Packaging width 0.8

PCB2

Maximum leakage current 0.01

EU RoHS Directive Compliant

Capacitance value 70(Typ)

Minimum operating temperature -55

Configure Single

Supplier package form SOD-523

Standard package name SOD-523

Maximum ESD protection voltage ±30@Air Gap/±30@Contact Disc

Maximum working temperature 150

Maximum working voltage 6

Packing length 1.2

Packaging height 0.6

Package Tape and_Reel

Lead Shape Flat

Voltage - Clamp (Max) @ IPP20.5V

Mounting Type Surface Mount

Supplier Equipment Package SOD-523

Voltage - Breakdown (Min) 6.8V

One-way channel number 1

Voltage - reverse isolation (standard value) 6V

Application ScopeGeneral Purpose

Operating temperature -55°C ~ 150°C

Power cord protectionNo

Power - Peak Pulse 181W

Current - Peak Pulse (10/1000µs) 8.8A (8/20µs)

Package/Enclosure SC-79, SOD-523

RoHS Directive Lead free / RoHS Compliant

Other namesESD5Z6.0T1GOSCT

Polar Unidirectional

Clamping voltage 20.5 V

Product CategoryTVS Diodes - Transient Voltage Suppressors

Dimensions 0.8 mm W x 1.2 mm L

Factory packing quantity 3000

SeriesESD5Z2.5T1G

Termination Type SMD/SMT

Channel 1 Channel

Working voltage 6 V

Capacitance 70 pF

Breakdown voltage 6.8 V

RoHSRoHS Compliant

Package/Enclosure SOD-523

Peak surge current 8.8 A

Peak pulse power dissipation 240 W

Leakage current (maximum) 0.01uA

Operating temperature range -55C to 150C

Package TypeSOD-523

Number of components 1

Operating temperature classification Military

Reverse breakdown voltage 6.8 V

Peak pulse current 8.8 A

Reverse off-state voltage 6 V

Test current (It) 1 mA

Arc hardeningNo

Mounting style Surface Mount

The maximum operating temperature is Celsius. 150C

Operating temperature sensitivity. -55C

Product length (mm) 1.2 mm

Product thickness (mm) 0.8 mm

Product height (mm) 0.6 mm

Suppressor Type TVS

Clamping voltage (max) 20.5V

Operating voltage (max) 6V

Leakage current 0.01uA

Working voltage 6V

Diode Type:ESD Protection

Power consumption: 240W

Clamping Voltage Vc Max: 20.5V

Diode Case Style: SOD-523

No. of Pins: 2

MSL:MSL 1 - Unlimited

SVHC: No SVHC (16-Dec-2013)

Weight (kg)0.000006

Tariff No.85412900

associatedSP1003-01DTG.

Xinrui Electronics (Hong Kong) Co., Ltd., a professional component distributor (authorized and non-authorized brands) for 18 years, one-stop terminal manufacturer supporting: (quality assurance and integrity management) is the company's commitment to provide customers with brand original semiconductors, electronic products Component terminal supporting market, focusing on ESD/TVS electrostatic protection diodes, LDO low-power voltage regulators, MOS tubes, battery charging and management power supplies, LEDs, optocouplers, resistors and capacitors, PCB solutions (wireless Bluetooth solutions, One-stop Bluetooth sports solution, speaker, wireless power bank).

Main products: ESD electrostatic diodes, TVS diodes, battery charging and management power supplies, MOS tubes, LDO low-power voltage regulators.

Company: Xinrui Electronics (Hong Kong) Co., Ltd.

Contact: Miss Yao

Mobile: 13725590222

Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen

Company website: www.xrdz-hk.com

Part of the company's stock:

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For more models, please inquire:

Xinrui Electronics (Hong Kong) is a professional supplier of integrated circuits and has many years of sales experience in our bank! With a large stock of stock, integrity-based, customer first, the quality of products for customers!

Due to the large number of company models, it is impossible to upload them one by one. If you can't find the product you want on the website, please contact the salesperson. Our company can provide electronic components distribution service.

Company: Xinrui Electronics (Hong Kong) Co., Ltd.

Contact: Miss Yao

Mobile: 13725590222

Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen

Company website: www.xrdz-hk.com

Since the SiP packaging technology was applied to the iWatch smart watch released by Apple in 2015, SiP has been well known to the public. The demand for system integration in terminal equipment has always been increasing. As Moore's Law tends to fail, SiP can contain multiple chips in a single package, and even stack different types of devices and circuit chips to form a complete system. characteristics, making it the "new darling" of the "post-Moorish era". So in 2020, while the 5G popularization process is accelerating, what new applications will SiP packaging have?

If the past 2019 is the first year of 5G, then in 2020, 5G will enter the real "fast lane" and accelerate the road to popularization. On November 1, 2019, my country officially launched 5G commercial use. According to statistics, as of the end of December 2019, 126,000 5G base stations have been opened nationwide, and 5G commercial use has been realized in 52 cities. At the same time, 5G terminals have also been put into commercial use, but most users still take a wait-and-see attitude towards 5G mobile phones. Miao Wei, Minister of Industry and Information Technology, said at the National Industry and Information Technology Work Conference that as of December 21, 2019, there were 870,000 subscribers to 5G packages nationwide. All prefecture-level cities across the country are covered by 5G networks.

For 5G terminals, due to the inconsistent allocation of telecommunications spectrum in various countries, 5G will use more frequency bands than 4G frequency bands that have already reached more than 30. The increase in antennas and radio frequency devices caused by the increase in frequency bands has brought great challenges to the size of terminals such as 5G mobile phones. At the same time, with the development of 5G, higher requirements have been put forward for the weight and volume of wirelessly connected IoT products in the IoT field.

Under such a demand, how to improve the system integration has become a concern of the industry chain. In fact, there are three ways to improve system integration, namely SoC, SiP and SoB. Yang Jun, an expert in packaging technology from an enterprise, told the reporter of Huaqiang Electronics that the three methods for improving system integration have their own characteristics. The SoC (system-on-chip) package integrates multiple functions on one chip. It has the highest level of integration and has great advantages in performance, power consumption, transmission, etc.; but the disadvantages are also more obvious. SoC has High technical threshold, while the development cycle is as long as 50 to 60 weeks, and affected by Moore's Law, the room for improvement in the future may be further reduced. SiP packaging is to integrate a variety of chips, including CPU, DRAM and other chips into a package module, thereby becoming a complete system. And it can realize heterogeneous integration, and the development cycle is 24 to 29 weeks, which is only half the development cycle compared to SoC. SoB (chip-on-board) packaging is a substrate-based package with the shortest development cycle of 12 to 15 weeks, but a shorter life cycle of only 24 to 29 weeks.

"Generally speaking, for products with a long life cycle, SoC will serve as the core of the product. If the development cycle, product volume, flexibility requirements are high, and the life cycle requirements are low, SiP or SoB are generally preferred. On the one hand, because SoB mainly transforms the packaging from the substrate, it has great limitations." Yang Jun added.

There is no doubt that SiP packaging has been sought after by terminal manufacturers, and its application fields are becoming more and more extensive. Shen Ji, deputy general manager of the SiP business department of Goertek Co., Ltd., said in an interview with a reporter from Huaqiang Electronics: "SiP has important application scenarios in the fields of smartphones, wearable devices, and medical electronic equipment. As early as 2016, Apple started The released iPhone 7 is loaded with as many as 16 SiPs, which drives the demand for SiP in mobile terminal equipment, which makes high-end or low-end series of devices more and more adopt SiP technology; but from another perspective, SiP technology Compared with traditional packaging, SiP can make PCB assembly simpler, and the cost of chip packaging is greatly reduced, thereby reducing the overall BOM cost.”

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Hong Kong Xinrui Electronics Co., Ltd. is a professional supplier of integrated circuits and has many years of sales experience in the bank! With a large stock of stock, integrity-based, customer first, the quality of products for customers!

Due to the large number of company models, it is impossible to upload them one by one. If you can't find the product you want on the website, please contact the salesperson. Our company can provide electronic components distribution service.

Company: Hong Kong Xinrui Electronics Co., Ltd.

Contact: Miss Yao

Mobile: 13725590222

Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen

Company website: www.xrdz-hk.com