BCP53 product detailed specifications

Specification BCP53 datasheet Specification

Collector current (DC) (max) 1 A

Collector-Base Voltage 100 V

Collector-emitter voltage 80 V

Emitter-Base Voltage 5 V

Frequency (max) 145 MHz

Power dissipation 1 W

Install the Surface Mount

Operating temperature range -65C to 150C

Packaging Type SOT-223

Package Tape and_Reel

Number of pins 3 +Tab

Number of components 1

DC current gain (min) 63

Operating temperature classification Military

Arc hardeningNo

Transistor Polarity PNP

Frequency 145 MHz

DC current gain 63

Collector current (DC) 1 A

Collector Emitter Voltage V(br)ceo:80V

Transition Frequency ft: 145MHz

Power consumption: 650mW

DC Collector Current: 1A

DC Current Gain hFE:63

Operating Temperature Min:-65°C

Operating Temperature Max: 150°C

Transistor Case Style: SOT-223

No. of Pins: 3

MSL:-

SVHC: No SVHC (20-Jun-2013)

Av Current Ic: 1A

Collector Emitter Voltage Vces:-500mV

Continuous collector current Ic max: 1.5A

Current Gain Hfe Max: 250

Current Ic Continuous a Max: 1A

Current Ic hFE: 500mA

Gain Bandwidth ft Typ: 115MHz

Hfe Min: 63

No. of Transistors: 1

Operating temperature range: -65°C to +150°C

Power Dissipation Ptot Max: 1.5W

SMD Marking: BCP53

Termination Type: SMD

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From the "New Wassenaar Agreement" late last year to last month's "New Three" (that is, three measures agreed by senior U.S. officials at a meeting on March 25 that could be used to prevent Chinese companies from buying certain items from the U.S.) Optical materials, radar equipment and semiconductors, etc.) and the subsequent "robbery" against Huawei's cutting-edge chip sales (the "Foreign Direct Product Rule" being revised), all show the current US's "response to the rising of China's semiconductor industry". Fear".

But obviously, now both Huawei and the frequently suppressed Chinese semiconductor industry are increasingly showing strong vitality under the wave of "domestic substitution", and "de-beautification" is already on the way. Taking Huawei P40 mobile phone as an example, from the chip supply chain based on CPU, baseband, and storage to the supply chain of radio frequency, camera, screen, power device and passive components, a large number of related products from local suppliers are used, and the supply chain is "localized". ” has increased significantly. This, to a certain extent, alleviates the performance impact of local semiconductor manufacturers due to the epidemic, and also strengthens Huawei's supply chain "security".

As mentioned by Yu Chengdong, CEO of Huawei's consumer business on the morning of April 9, Huawei's supply chain can now do without American components, but it still retains a small number of American components, maintains cooperative relations with American suppliers, and takes care of their business. . "We didn't say that all domestic products are used. Of course, there are more domestic products, and the number in the United States has been greatly reduced. In principle, we can completely replace American devices, but we take care of their business. The capabilities of Chinese companies are getting stronger and stronger. Give more opportunities to domestic companies." Why is Huawei so confident in the important issue of supply chain "security" today? The editor believes that it is ultimately due to the strong local cooperation system behind it and the self-research of core technologies. ability:

1. 5G chip

Since the release of the world's first SoC chip Kirin 980, the world's first 5G-enabled commercial mobile phone manufactured using TSMC's 7nm process, in 2018, Huawei's self-developed 5G CPU has attracted worldwide attention. It is for this reason that Huawei's many core businesses in the 5G field have also begun to be frequently blocked by the United States.

However, unlike other technology companies, Huawei has not slowed down its own development and iteration in the 5G product line. With the launch of a series of powerful 5G chip solutions such as Kirin 985, Kirin 990, and Kirin 820, the independent CPU supply capacity is getting stronger and stronger, and it is no longer necessary to worry about the core components of smartphones being "out of stock" as usual. ".

2. Baseband chip

In order to ensure that its own mobile phones and other related products can not be cut off in extraordinary times, Huawei has also done a good job in baseband chips in recent years. In the 5G field, Huawei HiSilicon has successfully developed and released two 5G modems, namely the 2018 Balong 5G01, which is Huawei's first 3GPP standard 5G commercial chip; the other is the Balong launched in 2019 5000 is a 5G baseband chip mainly for the high-end smartphone market. The performance is very strong and was once praised by the industry.

However, in February this year, Qualcomm released the third-generation 5G baseband Snapdragon X60 using a 5nm process, setting a new performance record again. But now Huawei has also begun to look for a new "spare tire" to reduce its dependence on Qualcomm's 5G modem as much as possible. On April 9, according to the latest report from Digitimes, with the increase of 5G penetration rate, both Samsung and MediaTek hope to provide Huawei with 5G chipsets for mid-to-low-end smartphones. ) manufacturers, as potential customers of their own 5G solutions, have some "coincidence" charm.

3. LCP antenna

With the 5G era, the requirements for signal transmission are getting higher and higher, and mobile phone manufacturers will naturally be more strict in the selection of antenna solutions. Because the LCP transmission loss is small and the frequency increase loss can be further reduced, the signal transmission performance above 10Ghz occupies the upper hand among the current mass-produced materials, and is used by Apple and Huawei, two major mobile phone manufacturers. After Huawei used an LCP antenna in the Mate 30 last year, its P40 series continues to use an LCP antenna.

Although driven by these first-tier manufacturers, LCP antenna solutions are expected to be promising in the 5G mobile phone market. However, from the perspective of the supply chain, the upstream raw materials and FPC manufacturers of LCP antennas are currently dominated by American and Japanese manufacturers. Mass production capacity is very strong, LCP resin production capacity accounts for 75% of the world, while domestic enterprises only have the ability to participate in module manufacturing.

However, with the increased risk of closing cities and out of stock caused by the epidemic, coupled with the continued suppression of Huawei by the United States, it is not ruled out that Huawei will choose some potential domestic companies as LCP raw material suppliers, such as Plitte, Kingfa Technology, Water shares, Ningbo Jujia and other manufacturers. It is reported that these enterprises have been put into production in the fields of injection molding, film and spinning LCP resin materials, and the localization of LCP materials is gradually accelerating, which is also a major guarantee for Huawei to improve the security of the supply chain.

4. Charger master control

At the Huawei 2020 spring new product launch conference on the evening of April 8, Huawei officially released the 65W GaN dual-port super fast charging charger, which supports Type-A and Type-C dual-port charging, and can charge mobile phones, platforms and PCs. Although some media reported that the power management IC of Huawei's GaN fast charging charger was jointly developed by Huawei and HiSilicon, it was later confirmed by the supply chain and Huawei insiders that the main control power IC of this charger was The chip is actually a solution independently developed by Huawei.

However, according to supply chain sources, Huawei still relies on external companies for this new charger, such as the overall outsourcing to Sumitomo Electric, and the core GaN MOSFET is foundry by WIN Semiconductors.

5. GPU

Although Huawei has laid a preliminary foundation on its own CPU, the GPU aspect is still Huawei's current shortcoming. However, Huawei’s current self-developed GPU plan has been put on the agenda. Recently, according to Korean media The Elec, Huawei Technologies will set up a cloud and AI business group in South Korea this year, hoping to enter the GPU server market currently dominated by NVIDIA.

According to industry insiders on April 3, the business group may be spun off later for further development. Huawei is currently recruiting experts for the new agency, including former and current employees and executives from Nvidia. However, self-developed GPU is a long and quite difficult process. It is expected that Huawei may only focus on planning and technical accumulation on GPU this year.

6. HMS service

Last year, because Google could not pre-install GMS (Google Mobile Services) in Huawei's new models, Huawei had to release its own "killer", namely HMS (Huawei Mobile Services). Similar to GMS, HMS can also provide mobile phone users with downloads of various applications such as application market, cloud space, browser, video, and music. Huawei hopes to help global users, especially overseas users, eliminate their dependence on GMS by creating an HMS software ecosystem that is comparable to or even surpasses GMS, and thus turns to the embrace of the Huawei ecosystem. For Huawei itself, it is no longer worried that the product will be scrapped due to the interruption of GMS supply.

However, in the short term, Huawei HMS will be difficult to make up for the gap in GMS, and the epidemic situation in Europe, North America, the Middle East and other regions is serious, which will have a great impact on the overseas sales market of the P40 series equipped with HMS services. But now the domestic epidemic situation has been greatly improved. With the continuous expansion of Huawei's new machine in the domestic market share, HMS is expected to gradually build a solid foundation in China and go global based on the domestic market.

7. Hongmeng OS

Also in response to the interruption of Andriod's supply under the leadership of Google, Huawei officially launched its self-developed Hongmeng OS system at the developer conference on August 9 last year. Although at the beginning of the release, many professionals in the industry questioned whether it was really "completely self-developed" because of the microkernel and other issues, but Huawei still responded calmly.

Hong Kong Xinrui Electronics Co., Ltd. is a professional supplier of integrated circuits and has many years of sales experience in the bank! With a large stock of stock, integrity-based, customer first, the quality of products for customers!

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BCP53 product detailed specifications

Specification BCP53 datasheet Specification

Collector current (DC) (max) 1 A

Collector-Base Voltage 100 V

Collector-emitter voltage 80 V

Emitter-Base Voltage 5 V

Frequency (max) 145 MHz

Power dissipation 1 W

Install the Surface Mount

Operating temperature range -65C to 150C

Packaging Type SOT-223

Package Tape and_Reel

Number of pins 3 +Tab

Number of components 1

DC current gain (min) 63

Operating temperature classification Military

Arc hardeningNo

Transistor Polarity PNP

Frequency 145 MHz

DC current gain 63

Collector current (DC) 1 A

Company: Hong Kong Xinrui Electronics Co., Ltd.

Contact: Miss Yao

Mobile: 13725590222

Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen

Company website: www.xrdz-hk.com