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2022-09-24 18:08:59
PESD12VS2UT
PESD12VS2UT 35V SOT-23 180W original authentic
Document Copper Bond Wire 09/Jun/2013
Resin Hardener 02/Jul/2013
Copper Bond Wire 02/Sep/2013
RohsLead free / RoHS Compliant
Standard package 3,000
Voltage - Reverse Isolation (typ) 12V
- Breakdown voltage 14.7V
Power (Watts) 180W
Polarized 2 Channel Array - Unidirectional
Mounting Type Surface Mount
Bag/Box TO-236-3, SC-59, SOT-23-3
Supplier Device Package SOT-23-3
Packaging Tape & Reel (TR)
Type TVS
Number of pins 3
Direction TypeUni-Directional|Bi-Directional
Maximum clamping voltage 35 V
Number of components per chip 2
ESD protection voltage 30@Contact Disc/10@HBM kV
Maximum working voltage 12 V
Maximum leakage current 1 uA
Capacitance value 75 pF
Minimum operating temperature -65 °C
Maximum operating temperature 150 °C
Install the Surface Mount
Standard Packaging Tape & Reel
Maximum clamping voltage 35
Package Width1.4(Max)
PCB3
Maximum leakage current1
EU RoHS Directive Compliant
Capacitance value 75
Minimum operating temperature -65
Configure Dual Common Anode|Single
Supplier package form TO-236AB
Standard package name SOT-23
Maximum ESD Protection Voltage30@Contact Disc/10@HBM
Maximum working temperature 150
Maximum working voltage 12
Package Length3(Max)
Package Height1(Max)
Package Tape and_Reel
Lead Shape Gull-wing
Voltage - Clamp (Max) @ IPP35V
Mounting Type Surface Mount
Supplier Equipment Package SOT-23-3
Voltage - Breakdown (min) 14.7V
One-way channel number 2
Voltage - reverse isolation (standard value) 12V (Max)
Application ScopeGeneral Purpose
Operating temperature -65°C ~ 150°C
Capacitance @ Frequency 38pF @ 1MHz
Power cord protectionNo
Power - Peak Pulse 180W
Current - Peak Pulse (10/1000µs) 5A (8/20µs)
Package/Enclosure TO-236-3, SC-59, SOT-23-3
RoHS Directive Lead free / RoHS Compliant
Other name568-4025-1
Polar Unidirectional
Clamping voltage 19 V
Product CategoryTVS Diode Arrays
Channel 2 Channels
Factory packing quantity 3000
Series PESDxS2UT
Termination Type SMD/SMT
Working voltage 12 V
Installation style SMD/SMT
Capacitance 207 pF
Breakdown voltage 15 V
RoHSRoHS Compliant
Package/Enclosure SOT-23
Peak surge current 18 A
Part Number Alias PESD12VS2UT T/R
Peak pulse power dissipation 180 W
Dimensions 1.4 mm W x 3 mm L x 1.1 mm H
Leakage current (max) 1uA
Operating temperature range -65C to 150C
Number of components 2
Operating temperature classification Military
Reverse breakdown voltage 14.7 V
Peak pulse current 5 A
Reverse off-state voltage 12 V
Test current (It) 5 mA
Arc hardeningNo
The maximum operating temperature is Celsius. 150C
Operating temperature sensitivity. -65C
Product length (mm) 3 mm
Product thickness (mm) 1.4(Max) mm
Product height (mm) 1 mm
Suppressor Type TVS
Clamping voltage (max) 35V
Working voltage (maximum) 12V
Leakage current 1uA
Working voltage 12V
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PESD24VS1UB 330W SOD-523 original authentic
PESD24VS1UB 330W SOD-523 original authentic
PESD24VS1UB 330W SOD-523 Original Genuine PESD24VS1UB 330W SOD-523 Original Genuine
PESD24VS1UB 330W SOD-523 original authentic
PESD24VS1UB 330W SOD-523 original authentic
Hong Kong Xinrui Electronics Co., Ltd. is a professional supplier of integrated circuits and has many years of sales experience in the bank! With a large stock of stock, integrity-based, customer first, the quality of products for customers!
Due to the large number of company models, it is impossible to upload them one by one. If you can't find the product you want on the website, please contact the salesperson. Our company can provide electronic components distribution service.
The British government said conspiracy theories linking 5G base stations to the spread of the new coronavirus were dangerous disinformation after 5G base stations were set ablaze in several areas on Saturday,media reported. , is completely wrong.
When asked by reporters about the so-called "theory" that 5G towers could play a role in the spread of the coronavirus, British cabinet minister Michael Gove said: "This is dangerous nonsense."
In recent days, some mobile phone base stations in Birmingham in central England and Merseyside in the north have been vandalised and telecom workers have been abused. With people relying on their phones more than ever, these sabotages have significantly impacted people's cell phone communications.
Stephen Boyce, the medical director of the UK National Health Service, said that the 5G conspiracy theory is fake news, has no scientific basis, and has the potential to undermine the emergency response to the epidemic.
"The 5G conspiracy theory is utter rubbish, meaningless, and the worst kind of fake news," Bowes said. "The reality is that cell phone communication networks are critical to all of us, especially emergency services and health care. Department staff. I am outraged and disgusted by the disruption of the communications infrastructure needed to respond to this health emergency.”
Vodafone, the world's second-largest mobile operator, said the attacks had affected national security.
Hong Kong Xinrui Electronics Co., Ltd. is a professional supplier of integrated circuits and has many years of sales experience in the bank! With a large stock of stock, integrity-based, customer first, the quality of products for customers!
On September 10, the China Semiconductor Materials Innovation and Development Conference was officially held in Beilun, Ningbo. Dr. Fei Lu, Executive Vice President of Shanghai Xinsheng Semiconductor, pointed out in his speech that there are currently 14 companies in China that have officially announced their involvement in the 300mm large silicon wafer industry, with a total of more than The current number of 300mm silicon wafer companies in the world. The planned total monthly production capacity of these companies is 6.92 million pieces, which is higher than the current world production capacity.
Fei Lu pointed out that in the 42 years from 1976 to 2018, it increased by 168 times, and global integrated circuit sales rose from US$2.9 billion to US$470.3 billion, with a compound annual growth rate of 12.8%. The two fastest growing stages are driven by computers and mobile phones, respectively.
Fei Lu said that silicon wafers still dominate the semiconductor material, and more than 90% of chips and sensors are based on semiconductor monocrystalline silicon. At present, the monthly production capacity of 300mm large silicon wafers is 6.5 million pieces, and as the number of Fabs increases, the production capacity of large silicon wafers will continue to grow.
Fei Lu further pointed out that the production technology of large silicon wafers includes crystal pulling, cutting, grinding, polishing and epitaxy. The steps seem simple, but there are many parameters that need to be considered, and process engineers must take these parameters into account every day. The core technology of silicon wafers is a process of challenging limits. Fei Lu said that this is mainly reflected in four aspects: crystal growth, surface cleaning, intra-chip flattening and metal/impurity elimination.
Regarding the status of domestic large silicon wafers, Fei Lu revealed that there are currently 14 companies officially announced to be involved in the 300mm large silicon wafer industry in China, and the total number exceeds the current number of 300mm silicon wafer companies in the world. The planned total monthly production capacity of these companies is 6.92 million pieces, which is higher than the current world production capacity.
These companies have different capitals, including large funds, state-owned assets, local government funds, national project funds, foreign capital, private enterprises and market capital. Fei Lu said that the production capacity planned by these companies is too high, and it may not be so easy to realize.
Finally, Fei Lu also introduced the current situation of Shanghai Xinsheng Semiconductor. As the first domestic large-scale silicon wafer mass production company, Xinsheng's existing monthly production capacity has reached 100,000 wafers, the existing production room can hold a monthly production capacity of 300,000 wafers, and the existing factory can build a monthly production capacity of 600,000 wafers. The land can reach a production capacity of 1 million pieces/month. Fei Lu said that Xinsheng will achieve the leap from "0" to "1" for 300mm domestic large silicon wafers, and continuously improve the depth and breadth of products to meet customer needs.
Company: Hong Kong Xinrui Electronics Co., Ltd.
Contact: Miss Yao
Mobile: 13725590222
Tel: 0755-83780666/83265111
Fax: 0755-82800889
QQ: 3373563833
Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen
Company website: www.xrdz-hk.com