OSD3358-512M-IC...

  • 2022-09-24 18:08:59

OSD3358-512M-ICB

OSD335x C-SiP Series

Octavo's OSD335x System-in-Package (SiP) is a self-contained computing system that increases reliability by reducing component count

Octavo's OSD335x C-SiP Image via Octavo's OSD335x C-SiP is a self-contained computing system ideal for powering the latest embedded applications. It integrates Texas Instruments' powerful 1 GHz Sitara?Arm? Cortex?-A8 AM335x processor, up to 1 GB of DDR3L memory, up to 16 GB of embedded Multimedia Card (eMMC) non-volatile memory, low power consumption and low jitter MEM oscillator, 4 KB EEPROM, TPS65217C PMIC, TL5209 LDO, and resistors, capacitors and inductors in an easy-to-use 27 mm x 27 mm IC package.

With this level of integration, the OSD335x C-SiP has everything needed to build a complete embedded computing platform. It allows designers to focus on key aspects of the system without spending too much time on the complexities of the processor core. It also reduces the overall size and complexity of the design while simplifying the supply chain. The OSD335x C-SiP can significantly reduce time-to-market for any embedded computing product.

Feature advantage

TI AM335x, TPS65217C, TL5209, DDR3, EEPROM, eMMC, MEMS oscillator and passive components in one package

TI AM335x features:

Arm Cortex-A8, up to 1 GHz

8-channel 12-bit SAR ADC

2-port Ethernet 10/100/1000

USB 2.0 HS OTG + PHY x2

MMC, SD and SDIO x3

LCD controller

SGX 3D graphics engine

PRU subsystem

Access to all AM335x peripherals (except those used to communicate with eMMC): CAN, SPI, UART, I2C, GPIO

Up to 1 GB DDR3

Up to 16 GB eMMC

Low Power, Low Jitter, MEMS Oscillator

Power Input: AC Adapter, USB or Single Cell (1S) Li-Ion/Li-Polymer Battery

Power output: 1.8 V, 3.3 V and SYS

Selectable I/O voltage: 1.8 V or 3.3 V

100+ components integrated

Compatible with AM335x development tools and software

Significantly reduces design time

45% less board space than discrete_reduces layout complexity

Wide BGA ball pitch enables low cost assembly

Simplified component procurement

Lower component count, higher reliability