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2022-09-24 18:08:59
OSD32MP157C-512M-BAA-ES
OSD32MP15x System-in-Package (SiP)
Octavo's OSD32MP15 is a SiP featuring STMicroelectronics STM32MP15
Image of the Octavo OSD32MP15x SiP Octavo's OSD32MP15x SiP devices provide the functionality of a microprocessor in a package that feels like a microcontroller in a minimal footprint. At the heart of the OSD32MP15x devices is the versatile STMicroelectronics STM32MP15x with dual Arm® Cortex®-A7 cores and Arm Cortex-M4. Together with the processor, the OSD32MP15x family integrates up to 1 GB of DDR3, STPMIC1 power management IC, EEPROM, MEM oscillator and passive components into an easy-to-use BGA package.
This integration eliminates tedious tasks that do not add value to the end system, enabling the fastest designs for the STM32MP15x.
characteristic
One package integrates ST STM32MP15x, DDR3, STPMIC1, 4 KB EEPROM, oscillator and passive components
Operates all signals of the STM32MP1 TFBGA 361 package
Up to 1 GB DDR3
Low power MEMS oscillator x2
Single Voltage Input: 2.8 V to 5.5 V
Integrated boost: 5.2 V
System Power: Buck, LDOx4, Power Switch x2
Advantage
100+ components integrated
Compatible with STM32MP1 development tools and software
Can greatly reduce design time
64% less board space than discretes_Reduces layout complexity
Wide BGA ball pitch enables low cost assembly
Simplified component procurement
Fewer components, higher reliability