HSF Series Heatsink/Fan Combination

Wakefield-Vette's heat sink/fan combination is designed for airflow applications in many industries

Image of Wakefield-Vette's HSF Series Heatsink/Fan Combo Wakefield-Vette's HSF Series Heatsink/Fan Combo works with Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Powerex, Infineon, Microsemi and more match. These radiators are designed for airflow applications in telecommunications, data centers, networking, cloud computing, and many other industries.

When used in combination with an installed fan, the HSF series is ideal for optimal forced convection in a small footprint. Forced convection is a mechanism by which fluid motion is created by an external source such as a pump, fan, or other device. Although the term "forced convection" can be used to refer to any fluid, it is most often associated with forced air cooling. Due to the high airspeeds normally associated with forced convection, large amounts of heat can be transported quickly and efficiently. The amount of surface area on the heat sink is an important factor in helping to meet the desired thermal performance, but too much surface area can result in a larger pressure drop across the heat sink. The greater the drop pressure, the greater the strain placed on the fan, which can result in reduced fan performance.

feature

easy to assemble

Small footprint

Pre-installed add-on method

Enhanced thermal performance

Application field

telecommunications

information Center

networking