TFC718S, new original spot delivery on the same day or store pick-up 0755-82732291.

Texas Instruments

Texas Instruments (TI), Texas Instruments designs and manufactures analog technology, digital signal processing (DSP) and microcontroller (MCU) semiconductors. TI is the leader in analog and digital embedded and application processing semiconductor solutions. As a global semiconductor company, TI innovates through design, sales and manufacturing operations in more than 30 countries. Engineering development tools help design engineers evaluate, create or debug designs based on semiconductor devices. Development tools come in many forms, including starter kits, evaluation boards, debuggers, or a complete development environment. At the beginning of TI's development, the company's goal was to use the company's unique technological capabilities to fundamentally disrupt traditional markets and create entirely new ones. . There is always a clear main line running through our development process, which is to use more and more advanced real-time signal processing technology to achieve progress from quantitative change to qualitative change, and truly and constantly change the world.

NXP (NXP)

NXP Semiconductors (NXP) provides high-performance mixed-signal (High Performance Mixed Signal) and standard product solutions with its leading RF, analog, power management, interface, security and digital processing expertise. These innovative products and solutions can be used in a wide range of applications such as automotive, smart identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing.

ON (On Semiconductor)

ON Semiconductor is the premier supplier of high-performance silicon solutions for energy-efficient electronics. The company's product portfolio includes power and signal management, logic, discrete and custom devices to help customers solve their unique design challenges in automotive, communications, computer, consumer, industrial, LED lighting, medical, military/aerospace and power applications, both Fast and cost-effective. The company operates a world-leading, value-added supply chain and network of manufacturing plants, sales offices and design centers in key markets in North America, Europe and Asia Pacific.

UTC (Taiwan Youshun)

The products are mainly IC (covering Power Management, Amplifier / Comparator, Analog Switches, Hall ICs, Special Application ICs, Logic, etc.), supplemented by Discrete (covering Transistors, MOSFETs, TRIACs, SCRs, DIODEs, etc.), and the main products are extensive Used in communication products such as mobile phones, smart phones, LNB, satellite navigation devices, wireless communication equipment; consumer electronic products such as MP3 and PMP, digital cameras, portable devices, LCD TVs and panel products; PCs such as notebooks Computers, monitors, keyboards, wireless mice, motherboards, VGA cards, power supplies, DC FAN, Adapter, external hard disk storage devices and computer peripheral products and other related markets.

CJ (Jiangsu Changdian)

Jiangsu Changdian Technology Co., Ltd. focuses on the semiconductor packaging and testing business, providing customers at home and abroad with a complete set of solutions for chip testing, packaging design, packaging and testing.

Diodes - switching diodes, Schottky diodes, Zener diodes, TVS diodes, rectifier diodes, fast recovery diodes, Zener circuits

MPS (Core Source)

Core Source Systems Co., Ltd. (MPS) designs and manufactures high-performance analog integrated circuits and mixed-signal integrated circuits, especially high-power power management chips.

*_DC/DC converter IC for supplying various electronic devices with supply voltage.

*_LED driver integrated circuits for lighting displays such as porous cell phones and handheld computing devices.

*_CCFL lamp driver chip, used for the lighting of liquid crystal displays, such as notebook computers, flat panel monitors and TV sets.

*_Class D power amplifier integrated circuit, suitable for miniaturized and portable electronic equipment.

*_Linear integrated circuits include operational current sense amplifiers.

*_Battery charger and protector.

*_Ethernet (PoE) Power Solutions.

S3C6410XH-66 Overview

The S3C6410XH-66 is a 16/32-bit RISC microprocessor designed to provide a cost-effective, low-power capable, high-performance application processor solution for mobile phones and general applications.

The S3C6410XH-66 has an optimized interface to external memory. This optimized interface to external memory can maintain the high memory bandwidth required for high-end communication services. This memory system features dual external memory ports, DRAM and Flash/ROM. The DRAM port can be configured to support mobile DDR, DDR mobile SDRAM and SDRAM. The Flash/ROM port supports NOR Flash, NAND Flash, OneNAND Flash, CF and ROM types of external memory.

S3C6410XH-66 performance

The ARM1176JZF-S CPU subsystem with Java acceleration engine and 16KB/16KB I/D Cache and 16KB/16KB I/D TCM.

1.1V at 533MHz and 1.2V for the 667 respectively.

The 8-bit ITU 601/656 interface camera is up to 4M pixels for scaling and 16M pixels for scaling resolution.

Multi-format codec provides MPEG-4/H.263/H.264 encoding and decoding up to VC1 video up to 30fps @ SD @ 30fps SD and decoding.

2D graphics acceleration with pixel data and rotation.

3D graphics acceleration with 4M triangles/sec @ 133Mhz (transform only)

AC-97 audio codec interface and PCM serial audio interface.

1/2/4bpp tray or 16bpp/24 bpp non-tray color TFT

I2S and I2C interface support.

FIR, MIR and SIR for dedicated IrDA ports.

Flexible configuration of GPIO.

EL814S1(TA)-V

ATMEGA88PA-AU, TQFP-32

Port USB 2.0 OTG supports high-speed devices (up to 480Mbps, on-chip transceiver).

Port USB 2.0 OTG supports high-speed devices (up to 480Mbps, on-chip transceiver).

SD/MMC/SDIO/CE-ATA Host Controller

Real time clock, PLL, timer, PWM and watchdog timer.

32-channel DMA controller.

8x8 key matrix is supported.

Advanced power management mobile app.

memory subsystem

SRAM/ROM/NOR flash interface with x8 or x16 data bus

OneNAND with multiplexed interface uses x16 data bus.

NAND flash interface with x8 data bus

Interface with X32 (port 1) data bus SDRAM

Mobile SDRAM interface with X32 (port 1) data bus

DDR interface and X32 (port 1) data bus

Mobile DDR interface with X32 (port 1) data bus

SAMSUNG Samsung

NT99142

THX201

THX202H

THX203H

THX208

TFC718

TFC719

TFC718S

D5668

HT1380

ZTP-135SR

MTP10-B7F55

LSSTSA01

BM43THA-T2

QCMRT311

EL814S1(A)-V SOP-4

TLP161J SOP-4

GTP682T4514F11

S3C6410XH-66 Overview

S3C6410XH-66 is a 16/32-bit RISC microprocessor, which is designed to provide a cost-effective, low-power capabilities, high performance Application Processor solution for mobile phones and_general applications.

The S3C6410XH-66 has an optimized interface to external memory. This optimized interface to external memory is capable of sustaining the high memory bandwidths required in high-end communication services. The memory system has dual external memory ports, DRAM and_Flash/ROM. The DRAM The port can be configured to support mobile DDR, DDR, mobile SDRAM and_SDRAM. The Flash/ROM port supports NOR-Flash, NAND-Flash, OneNAND, CF and_ROM type external memory.

MRT-311

EL814S1(A)(TU) SOP-4

HM583

BM43THA80C

10TP583T

HT1381

D7377

LPD6803

S3C6410XH-66 performance

The ARM1176JZF-S based CPU subsystem with Java acceleration engine and_16KB/16KB I/D Cache and_16KB/16KB I/D TCM.

533MHz at 1.1V and_667MHz at 1.2V respectively.

8-bit ITU 601/656 Camera interface up to 4M pixel for scaled and_16M pixel for unscaled resolution.

Multi Format Codec provides encoding and_decoding of MPEG-4/H.263/H.264 up to 30fps@SD and_decoding of VC1 video up to 30fps@SD.

2D graphics acceleration with BitBlit and_rotation.

3D graphics acceleration with 4M triangles/s @133Mhz (Transform only)

AC-97 audio codec interface and_PCM serial audio interface.

1/2/4bpp Palletized or 16bpp/24bpp Non-Palletized Color-TFT

I2S and_I2C interface support.

Dedicated IrDA port for FIR, MIR and_SIR.

Flexibly configurable GPIOs.

Port USB 2.0 OTG supporting high speed as Device (480Mbps, on-chip transceiver).

Port USB 2.0 OTG supporting high speed as Device (480Mbps, on-chip transceiver).

SD/MMC/SDIO/CE-ATA Host Controller

Real time clock, PLL, timer with PWM and_watch dog timer.

32 channel DMA controller.

Support 8x8 key matrix.

Advanced power management for mobile applications.

Memory Subsystem

SRAM/ROM/NOR Flash Interface with x8 or x16 data bus

Muxed OneNAND Interface with x16 data bus.

NAND Flash Interface with x8 data bus

SDRAM Interface with x32(Port1) data bus

Mobile SDRAM Interface with x32(Port1) data bus

DDR Interface with x32(Port1 ) data bus

Mobile DDR Interface with x32(Port1 ) data bus

CD4013

TDA2822

HV9910

LM2576