The semiconductor transistor SI7414DN-T1-E3 mosfet switching application can now use around 1 mΩ in resistance and capability to handle 85. While these die capabilities represent a significant advance that was available just a few years ago, it is important for power MOSFET packaging technology to keep pace. Clearly, package degradation of high performance dies is not desirable. PowerPAK is a new package technology that solves these problems. The PowerPAK 1212-8 provides ultra-low thermal impedance in a small package, ideal for space-constrained applications. In this application note, the construction of the PowerPAK 1212-8 is described. After this, mount information will be displayed. Finally, the thermal and electrical properties of the system are discussed.

Semiconductor Transistor SI7414DN-T1-E3 PowerPAK Package The PowerPAK 1212-8 package (Figure 1) is a derivative of the PowerPAK SO-8. It uses the same packaging technology to maximize the mold area. The bottoms of the die attach pads are exposed to provide a direct, low resistance thermal path to the substrate on which the device is mounted. So the PowerPAK 1212-8 translates the benefits of the PowerPAK SO-8 into a smaller package with the same level of thermal performance. (See Application Note "PowerPAK SO-8 Installation and Thermal Considerations".)

The memory footprint of the semiconductor transistor SI7414DN-T1-E3 PowerPAK 1212-8 is equivalent to that of TSOP-6. It is more than 40% smaller than standard tssop8. Its modulus is more than double that of the standard top -6. Its thermal performance is an order of magnitude better than SO-8 and 20 times better than tssop8. Its thermal performance is better than all SMT packages currently on the market. It will utilize the capabilities of any PC board heatsink. Compared with tssop8, reducing the junction temperature can also improve the mold efficiency by about 20%. The PowerPAK 1212-8 is a good choice for applications that typically only need to consider thermal effects and require a larger package. Both single and dual PowerPAK 1212-8 use the same output as single and dual PowerPAK SO-8. The lower 1.05 mm PowerPAK height profile makes both versions the best choice for applications with space constraints.

PowerPAK 1212 Monolithic Mounting To take full advantage of the thermal performance of the monolithic PowerPAK 1212-8, see Application Note 826, which recommends Vishay Siliconix mosfts to use Minimal Pad Mode with Profile Map Access. Click PowerPAK 1212-8 in this document index. In this picture, the drainage ground pattern is given to make full contact with the drainage pads on the PowerPAK pack. This land mode can be extended to the left, right and top of the drawing mode. This extension will increase heat dissipation by reducing the thermal resistance from the PowerPAK foot to the PC board, thereby reducing the ambient temperature. Note that increasing the drain area beyond a certain point will produce a small drop in thermal resistance in feet to the board and feet to ambient. Experiments have found that adding copper outside the range of 0.3 to 0.5 in2 has little improvement in thermal performance under specific plate shape, copper weight, and layer stacking conditions.

Semiconductor transistor SI7414DN-T1-E3

Semiconductor Transistor SI7414DN-T1-E3 Heating Rate + 6°C/sec Maximum Temperature 155±15°C 120 seconds Maximum Temperature Above 180°C 70 - 180 seconds Maximum Temperature 240 + 5/- 0°C Maximum Temperature 20 - 40 seconds Decrease Rate + 6 ℃/sec maximum temperature

Shenzhen Tianzhuo Weiye Electronics Co., Ltd.

In the past 10 years, Shenzhen Tianzhuo Weiye Electronics Co., Ltd. has seized the historical opportunities brought by China's reform and opening up and the rapid development of the electronics industry, adhered to customer-centricity and high-quality products as the foundation, and provided customers with one-stop procurement services for components. Won the respect and trust of customers, from an entrepreneurial company based in Huaqiangbei, Shenzhen Special Economic Zone, China, it has grown steadily into an electronic component supplier with several well-known brand product lines and customers in many countries and regions around the world. The electronic IC and 3C distributed and wholesaled sell well in the consumer market and enjoy a high status among consumers. The company has established long-term and stable cooperative relations with many retailers and agents.