CL05B821KB5NNNC product detailed specifications

Standard Package 10,000

Capacitance 820pF

Voltage - Rated 50V

Tolerance ±10%_Temperature Coefficient X7R

Mounting Type Surface Mount, MLCC

Operating temperature -55°C ~ 125°C

Apply General Purpose

grade-

Bag/Box 0402 (1005 Metric)

Size/Dimensions 0.039 L x 0.020 W (1.00mm x 0.50mm)

Height-Seated (Max)-

Thickness (max) 0.022 (0.55mm)

Lead Spacing-

Features-

Packaging Tape & Reel (TR)

lead to style-;;other names;

Package/Enclosure 0402

Install the Surface Mount

Capacitance value 820 pF

Voltage 50 Vdc

Tolerance 10 %_Media X7R

Operating temperature -55 to 125 °C

Structure Flat

Product length 1 mm

Product height 0.5 mm

Standard Packaging Tape & Reel

Product length 1

EU RoHS Directive Compliant

Maximum operating temperature 125

Product thickness 0.5

Product height 0.5

Package Paper Tape and_Reel

Chassis Style Ceramic Chip

TechnologyStandard

Match code KC820P0402X7R050K NORM

style CHIP

Electrode BME

T(A)min-55°C

Tape type PAPER

Unit package 10000

Standard lead time 20 weeks

MOQ 10000

C(N) 820pF

T(A) max +125°C

Lead-free DefinRoHS-conform

Packaging 0402

Case size 0402

carNO

Terminal NISN

V(N) 50V

Mounting Type Surface Mount, MLCC

Voltage - Rated 50V

Capacitance 820pF

Temperature Coefficient X7R

Dimensions/Dimensions 0.039 L x 0.020 W (1.00mm x 0.50mm)

Application ScopeGeneral Purpose

Package/Enclosure 0402 (1005 Metric)

Thickness (max) 0.022 (0.55mm)

Other name1276-1589-2

RoHS Directive Lead free / RoHS Compliant

Operating temperature range -55C to 125C

Arc hardeningNo

Failure rate Not Required

Tolerance (+ or -) 10%_Temperature Coefficient (Insulation) X7R

Line Form Not Required

Mounting style Surface Mount

Product length (mm) 1 mm

Product thickness (mm) 0.5 mm

Product height (mm) 0.5 mm

Product diameter (mm) Not Required mm

In 2019, AI chips represented by FPGA continued to expand the traditional hardware platform market on the one hand, and extended to emerging computing platforms, especially the AI computing platform market, on the other hand. In the competition with more general-purpose GPU/TPU and fully customized ASIC AI chips, FPGA occupies a place with its unique flexibility and reconfigurability. On the data center side, Intel's CPU+FPGA solution was adopted by Microsoft, and on the 5G/edge side Xilinx's ACAP platform can directly and conveniently implement the entire AI computing system. As the FPGA-based AI computing platform matures and its ease of use continues to improve, more applications, especially in the vast IoT field, will be activated and form an industrial ecosystem of flexible computing platform + AI application innovation.

GOWIN Semiconductor also took an important step in expanding into emerging computing platforms in 2019. The first is the productization of heterogeneous SoC FPGAs. In 2019, Gowin Semiconductor is launching a variety of FPGA products that support ARM, RISC-V soft and hard cores, making the MCU more closely and more effectively integrated with other units in the system. On this basis, GOWIN Semiconductor has developed the GoAI solution to meet the needs of the IoT market with low and medium computing power, small area, low power consumption and high flexibility. The solution is currently in the market introduction stage. The new products and solutions in 2019 have expanded the market structure of GOWIN Semiconductor from a single hardware RTL design user, to SoC software design users, to AI algorithm system-level design users.

GOWIN Semiconductor is full of hope for 2020. After several years of development and market precipitation, AI technology has gradually shifted from the academic research stage to the practical application stage. The "cooling" of new technologies reflects, to some extent, the process of commercializing AI technologies. In fact, the emergence of new AI products has not diminished. From smart wearables, smart homes, and smart parks to autonomous driving and public safety, the trend of AI technology productization will continue in 2020. The process of productization is also a process of continuous exploration. In this process FPGA has its unique advantages. As an upstream enterprise in the AI industry chain, GOWIN Semiconductor will continue to focus on the development of computing system platforms for IoT, and improve accelerator IP, algorithm compilation chain, and development tool chain on the basis of SoC FPGA hardware to support the development and development of downstream AI application products. Innovation.

In 2019, Chinese companies were blocked by the United States and the supply of chips was cut off, making the replacement of domestic chips imminent. As a latecomer in the industry, domestic FPGA has a latecomer advantage and can learn from the experience of international advanced enterprises. Especially for the mature market of FPGA, product requirements and definitions are clear, and domestic FPGAs can reduce trial and error and reduce costs. However, domestic FPGAs must actively innovate in targeting new products and new markets, and cannot follow suit. The source of innovation comes from China's prosperous manufacturing industry and the consumer market that is highly receptive to new products, which is the innate advantage of Chinese FPGA companies. GOWIN Semiconductor has always adhered to the strategy of being close to users and following the market. Through micro-innovation and rapid product iteration, it has continuously expanded the market and created opportunities in the competition with international companies.

Hong Kong Xinrui Electronics Co., Ltd., 18 years of professional component distributors (authorized and non-authorized brands), one-stop terminal manufacturer support: (quality assurance and integrity management) is the company's commitment to provide customers with brand original semiconductors, electronic components Terminal supporting market, focusing on ESD/TVS electrostatic protection diodes, LDO low-power voltage regulators, MOS tubes, battery charging and management power supplies, LEDs, optocouplers, resistors and capacitors, PCB solutions (wireless Bluetooth solutions, Bluetooth sports version solution one-stop, speakers, wireless power bank).

Main products: ESD electrostatic diodes, TVS diodes, battery charging and management power supplies, MOS tubes, LDO low-power voltage regulators.

Company: Hong Kong Xinrui Electronics Co., Ltd.

Contact: Miss Yao

Mobile: 13725590222

Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen

Company website: www.xrdz-hk.com

Hong Kong Xinrui Electronics Co., Ltd. part of the spot:

TLV70433DBVR、TP4101、TP5100、TP4056、RT9013-33PB、TPS73618DBVR、MIC5255-3.0YM5、CDSOT23-T36C、CDSOT23-24C、TL431CDBZR、TL431IDBZR、TLV1117CDCYR、LM317EMPX、NCP1117ST33T3G、NCP1117ST50T3G、PESD5V0V1BL、PESD5V0V1BSF、PESD2CAN、PESD5V0S1BA、PESD12VS2UT、PESD15VL2BT , PESD36VS2UT, PESD3V3L1BA, PESD24VL2BT, IP4220CZ6, IP4223CZ6, BCP56-16, BCP51-16, BSN20, uClamp0511T.TCT, SRV05-4.TCT, RCLAMP0531T.TCT, RCLAMP0502A.TCT, SD05C.TCT, SRAMP05.TCT 、ESD5Z2.5T1G、ESD5Z3.3T1G、CM1213A-01SO、CM1213A-04SO、NTR4501NT1G、NTR4502PT1G、NTR4170NT1G、NTR4171PT1G、RLST23A032C、RLST23A0122C、RLST23A052C、PRTR5V0U2X、GBLC03CI-LF-T7、GBLC03C-LF-T7、GBLC05CI-LF-T7 , GBLC05C-LF-T7, GBLC08CI-LF-T7, GBLC08C-LF-T7, GBLC12CI-LF-T7, GBLC12C-LF-T7, GBLC15CI-LF-T7, GBLC24CI-LF-T7, GBLC24C-LF-T7, PSD03C -LF-T7, PSD05-LF-T7, PSD05C-LF-T7, PSD08C-LF-T7, PSM712-LF-T7, AO3400, AO3400A, AO3401A, AO3402, TPSMB6.8CA-E3/52, TPSMB6.8A, TPSMB47A , TPSMB43A, TPSMB39A, TPSMB36A, TPSMB33A, TPSMB30A, STTH208, , IRLML2502TRPBF, TP4101, IRLML6401TRPBF, TLV70433DBVR, PESD5V0S1BB, PSM712-LF-T7, NTR4171PT1G, SGM2 036-3.3YUDH4G/TR, SGM2036-1.8YUDH4G/TR, DMN2046U-7, etc.

For more models, please inquire:

Hong Kong Xinrui Electronics Co., Ltd. is a professional supplier of integrated circuits and has many years of sales experience in the bank! With a large stock of stock, integrity-based, customer first, the quality of products for customers!

Due to the large number of company models, it is impossible to upload them one by one. If you can't find the product you want on the website, please contact the salesperson. Our company can provide electronic components distribution service.

Company: Hong Kong Xinrui Electronics Co., Ltd.

Contact: Miss Yao

Mobile: 13725590222

Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen

Company website: www.xrdz-hk.com

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AOZ8808DI-05、AOZ1284PI、AOZ1280CI、AOT11N70、AON7934、AON7544、AON7534、AON7524、AON7520、AON7506、AON7423、AON7421、AON7418、AON7410、AON7409、AON7407、AON7405、AON7403、AON7401、AON7296、AON7264E、AON6522、AON6512、AON6508、 AON6504、AON6414AL、AON6262E、AON5820、AON2801、AOD603A、AOD516、AOD484、AOD482、AOD478、AOD444、AOD4185、AOD4184L、AOD4184A、AOD4132、AOD413A、AOD409、AOD417、AOD407、AOD403、AO8822、AO8810、AO3414、AO3402、AO4606、 AO4485、AO4453、AO4447AL、AO4443、AO4468、AO4435、AO4421、AO4419、AO4407AL、AO4406AL、AO4354、AO4292、AO4264E、AO3485、AO3481、AO3480、AO3423、AO3422、AO3416、AO3415AL、AO3415、AO3407A、AO3401A、AO3400A

Hong Kong Xinrui Electronics Co., Ltd. is a professional supplier of integrated circuits and has many years of sales experience in the bank! With a large stock of stock, integrity-based, customer first, the quality of products for customers!

Due to the large number of company models, it is impossible to upload them one by one. If you can't find the product you want on the website, please contact the salesperson. Our company can provide electronic components distribution service.

Company: Hong Kong Xinrui Electronics Co., Ltd.

Contact: Miss Yao

Mobile: 13725590222

Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen

Company website: www.xrdz-hk.com