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2022-09-24 20:26:29
ESD5Z6.0T1G
ESD5Z6.0T1G ON TVS diode ESD DIODE 6V 181W excellent original spot import hot sale
ESD5Z6.0T1G product detailed specifications
ESD5Z6.0T1G datasheet
ESD5Z2.5T1
ESD5Z6.0T1G datasheet
Documentation Copper Wire 19/May/2010
Datasheet Update Max Forward Voltage 18/Jan/2008
RohsLead free / RoHS Compliant
Product Change Notice Specification Update Max Forward Voltage 18/Jan/2008
Standard package 3,000
Voltage - Reverse Isolation (typ) 6V
- Breakdown voltage 6.8V
Power (Watts) 181W
Polarized Unidirectional
Mounting Type Surface Mount
Bag/Box SC-79, SOD-523
Supplier Device Package SOD-523
Packaging Tape & Reel (TR)
Type TVS
Number of pins 2
Direction Type Uni-Directional
Maximum clamping voltage 20.5 V
Number of components per chip 1
ESD protection voltage ±30@Air Gap/±30@Contact Disc kV
Maximum operating voltage 6 V
Maximum leakage current 0.01 uA
Capacitance value 70(Typ) pF
Minimum operating temperature -55 °C
Maximum operating temperature 150 °C
Install the Surface Mount
Standard Packaging Tape & Reel
Maximum clamping voltage 20.5
Packaging width 0.8
PCB2
Maximum leakage current 0.01
EU RoHS Directive Compliant
Capacitance value 70(Typ)
Minimum operating temperature -55
Configure Single
Supplier package form SOD-523
Standard package name SOD-523
Maximum ESD protection voltage ±30@Air Gap/±30@Contact Disc
Maximum working temperature 150
Maximum working voltage 6
Packing length 1.2
Packaging height 0.6
Package Tape and_Reel
Lead Shape Flat
Voltage - Clamp (Max) @ IPP20.5V
Mounting Type Surface Mount
Supplier Equipment Package SOD-523
Voltage - Breakdown (Min) 6.8V
One-way channel number 1
Voltage - reverse isolation (standard value) 6V
Application ScopeGeneral Purpose
Operating temperature -55°C ~ 150°C
Power cord protectionNo
Power - Peak Pulse 181W
Current - Peak Pulse (10/1000µs) 8.8A (8/20µs)
Package/Enclosure SC-79, SOD-523
RoHS Directive Lead free / RoHS Compliant
Other namesESD5Z6.0T1GOSCT
Polar Unidirectional
Clamping voltage 20.5 V
Product CategoryTVS Diodes - Transient Voltage Suppressors
Dimensions 0.8 mm W x 1.2 mm L
Factory packing quantity 3000
SeriesESD5Z2.5T1G
Termination Type SMD/SMT
Channel 1 Channel
Working voltage 6 V
Capacitance 70 pF
Breakdown voltage 6.8 V
RoHSRoHS Compliant
Package/Enclosure SOD-523
Peak surge current 8.8 A
Peak pulse power dissipation 240 W
Leakage current (maximum) 0.01uA
Operating temperature range -55C to 150C
Package TypeSOD-523
Number of components 1
Operating temperature classification Military
Reverse breakdown voltage 6.8 V
Peak pulse current 8.8 A
Reverse off-state voltage 6 V
Test current (It) 1 mA
Arc hardeningNo
Mounting style Surface Mount
The maximum operating temperature is Celsius. 150C
Operating temperature sensitivity. -55C
Product length (mm) 1.2 mm
Product thickness (mm) 0.8 mm
Product height (mm) 0.6 mm
Suppressor Type TVS
Clamping voltage (max) 20.5V
Operating voltage (max) 6V
Leakage current 0.01uA
Working voltage 6V
Diode Type:ESD Protection
Power consumption: 240W
Clamping Voltage Vc Max: 20.5V
Diode Case Style: SOD-523
No. of Pins: 2
MSL:MSL 1 - Unlimited
SVHC: No SVHC (16-Dec-2013)
Weight (kg)0.000006
Tariff No.85412900
associatedSP1003-01DTG.
Xinrui Electronics (Hong Kong) Co., Ltd., a professional component distributor (authorized and non-authorized brands) for 18 years, one-stop terminal manufacturer supporting: (quality assurance and integrity management) is the company's commitment to provide customers with brand original semiconductors, electronic products Component terminal supporting market, focusing on ESD/TVS electrostatic protection diodes, LDO low-power voltage regulators, MOS tubes, battery charging and management power supplies, LEDs, optocouplers, resistors and capacitors, PCB solutions (wireless Bluetooth solutions, One-stop Bluetooth sports solution, speaker, wireless power bank).
Main products: ESD electrostatic diodes, TVS diodes, battery charging and management power supplies, MOS tubes, LDO low-power voltage regulators.
Company: Xinrui Electronics (Hong Kong) Co., Ltd.
Contact: Miss Yao
Mobile: 13725590222
Tel: 0755-83780666/83265111
Fax: 0755-82800889
QQ: 3373563833
Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen
Company website: www.xrdz-hk.com
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For more models, please inquire:
Xinrui Electronics (Hong Kong) is a professional supplier of integrated circuits and has many years of sales experience in our bank! With a large stock of stock, integrity-based, customer first, the quality of products for customers!
Due to the large number of company models, it is impossible to upload them one by one. If you can't find the product you want on the website, please contact the salesperson. Our company can provide electronic components distribution service.
Company: Xinrui Electronics (Hong Kong) Co., Ltd.
Contact: Miss Yao
Mobile: 13725590222
Tel: 0755-83780666/83265111
Fax: 0755-82800889
QQ: 3373563833
Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen
Company website: www.xrdz-hk.com
Yangtze Memory Technologies Co., Ltd. (hereinafter referred to as "YMTC"), a subsidiary of Tsinghua Unigroup, announced today that it will apply Xtacking™ 2.0 in its third-generation 3D NAND flash memory, and related technical concepts will be introduced at the upcoming IC China 2019. This is another big news released by YMTC today after announcing the debut of China's first 64-layer 3D NAND flash memory.
Xtacking™ is the 3D NAND architecture first disclosed by YMTC at the FMS (Flash Technology Summit) last year, and won the "Best of Show" award that year. Its unique feature is that with Xtacking?, peripheral circuits responsible for data I/O and memory cell operations can be processed independently on a single wafer. Such a processing method is conducive to selecting a suitable advanced logic process, so that NAND can obtain higher I/O interface speed and more operation functions. The memory cells will also be processed independently on another wafer. When the two wafers are completed separately, the innovative Xtacking? technology can connect the two to the circuit through billions of metal VIAs (Vertical Interconnect Accesses) in just one processing step, bringing faster speed I/O transfer speeds, higher storage densities, and shorter time-to-market, all at a limited cost.
In the traditional 3D NAND architecture, peripheral circuits account for about 20-30% of the chip area, reducing the storage density of the chip. As 3D NAND technology is stacked to 128 layers or higher, peripheral circuits may account for more than 50% of the overall chip area. The Xtacking? technology of YMTC places the peripheral circuit on the storage unit. The peripheral circuit and the storage unit are two wafers, and the size of the two bare chips is the same, which means that its CMOS usable area is much larger than other traditional 3D NAND architecture, thereby achieving higher storage density and saving the CMOS part, in addition to the control circuit, it also provides infinite possibilities for the introduction of innovative functions of NAND peripheral circuits to realize the customization of NAND flash memory.
YMTC's 64-layer 3D NAND flash memory is the world's first flash memory product designed and mass-produced based on the Xtacking? architecture, with the highest storage density among its generation products. According to previous data, the I/O speed target value of the world's fastest 3D NAND is currently 1.4Gbps, and most NAND suppliers can only supply speeds of 1.0Gbps or lower. Using Xtacking? technology, it is expected to greatly increase the I/O speed of NAND to 3.0Gbps, which is about three times higher. The successful research and development of Xtacking? technology and the mass production of 64-layer 3D NAND flash memory indicate that YMTC has successfully embarked on an innovative road of high-end chip design and manufacturing.
It is reported that the Xtacking? 2.0 officially announced today will make full use of the advantages of the Xtacking? architecture, and bring more value to customers by further improving the NAND throughput rate, improving the overall performance of system-level storage, and opening a new business model for customized NAND. . In the future, YMTC's third-generation products equipped with Xtacking? 2.0 technology will be widely used in data centers, enterprise-level servers, personal computers and mobile devices, and will open a new chapter in high-performance, customized NAND solutions.
YMTC said that compared with the previous generation technology, the development of Xtacking™ 2.0 requires more close cooperation with customers, industry partners and industry standards bodies.
Flash memory prices have been declining since 2018, mainly due to the increase in the supply of 64-layer and 72-layer 3D chips, and the market expects global production of 96-layer 3D NAND to expand from the second quarter of 2019, which is likely to be a major contributor to this year's SSDs Markets and prices bring more variables. As a result, major NAND manufacturers have begun to slow down the pace of capacity expansion. However, in the cyclical market fluctuations, continuous investment in technology research and development and iterative upgrades are the keys to maintaining a competitive advantage. The mass production of the new generation of 96-layer 3D NAND has not slowed down, and major storage manufacturers are making great efforts to promote 96-layer 3D NAND. The mainstreaming of the technology is expected to be widespread by 2020.
In addition to impacting higher NAND stack layers, major storage manufacturers have also proposed a new generation of flash memory solutions. SK Hynix's "4D NAND", Micron's "CuA" and YMTC's "Xtracking?" are the main representatives. Among them, YMTC's Xtracking ? architecture can increase the proportion of storage unit area from 65% to 90% of the traditional architecture, and the storage density is higher than that of SK Hynix and Micron under the same stack layer, which is a major role in my country's memory field. One of the technological breakthroughs.
In the future, I hope that while increasing the number of NAND layers, YMTC can seize the advantages of its own flash memory architecture, accelerate product iteration, and promote the leap-forward development of my country's memory industry.
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Hong Kong Xinrui Electronics Co., Ltd. is a professional supplier of integrated circuits and has many years of sales experience in the bank! With a large stock of stock, integrity-based, customer first, the quality of products for customers!
Due to the large number of company models, it is impossible to upload them one by one. If you cannot find the product you want on the website, please contact the salesperson. Our company can provide electronic components distribution service.
Company: Hong Kong Xinrui Electronics Co., Ltd.
Contact: Miss Yao
Mobile: 13725590222
Tel: 0755-83780666/83265111
Fax: 0755-82800889
QQ: 3373563833
Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen
Company website: www.xrdz-hk.com