SI2302CDS-T1-GE3 20V 710mW SOT-23-3 Power MOSFET

SI2302CDS-T1-GE3 Product Specifications

Standard package 3,000

FET Type MOSFET N-Channel, Metal Oxide

FET FeaturesLogic Level Gate

Drain-to-source voltage (VDSS) 20V

Current - Continuous Drain (Number) @ 25°C 2.6A

Rds (max) @ ID, VGS57 mOhm @ 3.6A, 4.5V

VGS(TH) (max) @Id850mV @250µA

Gate Charge (Qg) @ VGS5.5nC @ 4.5V

Input Capacitance (Ciss) @ Vds -

Power - 710mW max

Mounting Type Surface Mount

Bag/Box TO-236-3, SC-59, SOT-23-3

Supplier Device Package SOT-23-3 (TO-236)

Packaging Tape & Reel (TR)

Packaging 3SOT-23

Channel Mode Enhancement

Maximum drain-source voltage 20 V

Maximum continuous drain current 2.6 A

RDS - at 57@4.5V mOhm

Maximum gate-source voltage ±8 V

Typical turn-on delay time 8 ns

Typical rise time 7 ns

Typical turn-off delay time 30 ns

Operating temperature -55 to 150 °C

Install the Surface Mount

Standard Packaging Tape & Reel

Product TypeMOSFET

RoHSRoHS Compliant

Transistor Polarity N-Channel

Drain-source breakdown voltage 20 V

Source breakdown voltage +/- 8 V

Continuous drain current 2.6 A

Anti-Drain Source RDS(ON) 0.057 Ohms

Configure Single

Maximum operating temperature + 150 C

Installation style SMD/SMT

Package/Enclosure SOT-23-3

Package Reel

Fall Time 7 ns

Minimum Operating Temperature - 55 C

Power dissipation 710 mW

Rise time 7 ns

Factory packing quantity 3000

Part number alias SI2302CDS-GE3

Maximum gate-source voltage ±8

Packing width 1.4(Max)

PCB3

Maximum Power Dissipation 710

Maximum drain-source voltage 20

EU RoHS Directive Compliant

Maximum drain-source resistance 57@4.5V

Number of components per chip 1

Minimum operating temperature -55

Supplier Package SOT-23

Standard package name SOT-23

Maximum working temperature 150

Channel TypeN

Packing length 3.04(Max)

Number of pins 3

Packaging height 1.02(Max)

Maximum continuous drain current 2.6

Lead Shape Gull-wing

P(TOT) 0.71W

Match code SI2302CDS

Unit pack 3000

Standard lead time 15 weeks

MOQ 3000

Polarized N-CHANNEL

Lead-free DefinRoHS-conform

I (D) 2.6A

V(DS) 20V

R (on DS) 0.075Ohm

FET FeaturesLogic Level Gate

Mounting Type Surface Mount

Current - Continuous Drain (Id ) @ 25 °C 2.6A (Ta)

Vgs(th) (max) @Id850mV @250µA

Supplier Equipment Package SOT-23-3 (TO-236)

On-state Rds (max) @ Id, V GS57 mOhm @ 3.6A, 4.5V

FET Type MOSFET N-Channel, Metal Oxide

Power - 710mW max

Drain to source voltage (Vdss) 20V

Gate Charge (Qg) @ VGS5.5nC @ 4.5V

Package/Enclosure TO-236-3, SC-59, SOT-23-3

RoHS Directive Lead free / RoHS Compliant

Other namesSI2302CDS-T1-GE3CT

CategoryPower MOSFET

Dimensions 3.04 x 1.4 x 1.02mm

Height 1.02mm

Length 3.04mm

Maximum drain-source resistance 0.057 Ω

Maximum power dissipation 0.71 W

Packaging Type SOT-23

Typical Gate Charge @ VGS3.5 nC V @ 4.5

Width 1.4mm

RDS(ON) 57 mOhms

Drain current (max) 2.6 A

Frequency (Max) Not Required MHz

Gate-source voltage (max) ~8 V

Output power (max) Not Required W

Noise Figure Not Required dB

Drain-source on-resistance 0.057 ohm

Operating temperature range -55C to 150C

Polarity N

Type Power MOSFET

Number of components 1

Operating temperature classification Military

Drain efficiency Not Required %_Drain-source turn-on voltage 20 V

Power Gain Not Required dB

Arc hardeningNo

Continuous Drain Current Id: 2.9A

Drain Source Voltage Vds: 20V

On Resistance Rds(on): 57mohm

Rds(on) Test Voltage Vgs:8V

Threshold Voltage Vgs: 850mV

Power consumption: 710mW

Operating Temperature Min:-55°C

Operating Temperature Max: 150°C

Transistor Case Style: SOT-23

No. of Pins: 3

MSL:-

Current Id Max: 2.9A

Junction Temperature Tj Max: 150°C

Operating temperature range: -55°C to +150°C

Termination Type: SMD

Voltage Vds Type: 20V

Voltage Vgs Max:850mV

Voltage Vgs Rds on Measurement: 4.5V

Voltage Vgs th Max: 0.85V

Voltage Vgs th Min: 0.4V

Ordinary Bluetooth audio devices can only achieve 1-to-1 connection, including ordinary wireless Bluetooth headsets. However, there is no wire connection between the two earbuds of the TWS headset, and a 1-to-2 connection is required when connecting to a mobile phone.

Apple AirPods adopts Snoop monitoring mode, that is, listening to the left and right ears together, and Apple has implemented a patent block on the monitoring mode. In the early days, other TWS mainly used the relay forwarding mode, and the audio was transmitted from the mobile phone to the left ear (master device), and then forwarded from the left ear to the right ear (slave device).

The forwarding technology can be divided into traditional 2.4G forwarding, NXP's NFMI near-field magnetic communication technology and Hengxuan's LBRT low-frequency forwarding technology.

Compared with Apple's listening mode, the forwarding mode has the following disadvantages:

1) Due to the process of forwarding to the right ear (slave device) through the left ear (master device), the stability and delay of the connection in the forwarding mode are much worse than Apple's monitoring mode;

2) The monitor mode can be used in any single ear, while the forward mode is only used for the left ear (main device);

3) The power consumption of the left ear (master device) is significantly higher than that of the right ear (slave device).

Bluetooth 5.0 does not improve forwarding mode performance. Bluetooth has long supported connecting multiple terminals, but does not support simultaneous audio playback. That is to say, ordinary Bluetooth 5.0 technology does not support the function of TWS headset 1-to-2 connection to play music at the same time, but can only rely on monitoring technology or forwarding technology, etc., because the audio data transmission uses the traditional Bluetooth mentioned above. standard, not BLE Bluetooth Low Energy.

Therefore, even if Bluetooth is upgraded from 4.2 to Bluetooth 5.0, the disadvantage of forwarding mode compared to listening mode still exists, and the connection stability and delay of other manufacturers' TWS headphones are still worse than Apple's AirPods.

Bluetooth 5.0 can transmit commands more smoothly. Although Bluetooth 5.0 does not upgrade audio transmission, Bluetooth 5.0 provides higher bandwidth for low-power Bluetooth BLE. The PHY has evolved from 1M to 2M in Bluetooth 4.X, enabling Bluetooth devices to transmit commands more smoothly. For example, AirPods2 can support Siri.

MTK Luoda launched the AB1532 chip equipped with a new generation of TWS technology (MCSync, Multi Cast Synchronization) in early 2019. MCSync has the advantages of more stable connection, less staccato sound, support for high-resolution audio stream, low latency, more balanced power consumption for both ears, and suitable for various mobile phone platforms. In addition, MCSync also supports Multiple speakers connection.

In mid-2019, Luoda launched a more mature AB1536 chip, whose comprehensive experience such as connection performance was on par with Apple's AirPods, and became a popular chip.

In July 2019, the Luoda AB155X platform series cooperated with Sony to launch the Sony WF-1000XM3 product, which features Active Noise Cancellation (ANC) and supports Google Bisto.

In February 2018, Qualcomm launched TWS+ (TrueWireless Stereo Plus) technology. According to its official website, TWS+ is a Qualcomm-to-Qualcomm connection technology that can only be implemented between TWS headsets using Qualcomm QCC5100/QCC30XX Bluetooth chips and mobile phones based on Snapdragon 845, 670, and 710 mobile platforms.

Under the TWS+ connection technology, there will be two independent audio streams directly transmitted from the mobile phone to two different headphones, that is, the left and right channels are connected independently. If it is detected that the phone does not support TWS+ technology during the communication between the headset and the mobile phone, the headset will automatically switch to the TWS universal mode that is compatible with almost all smartphones.

Qualcomm TWS+ technology has been launched for more than a year, but the promotion speed is slow. Since TWS+ technology actually exceeds the existing Bluetooth standard, it needs to be implemented by optimizing the Bluetooth standard or the Android system. Crazy rice FUNCL AI, OPPO O-Free, bird track air, Edifier TWS5 and other products use Qualcomm QCC30XX chip, but they all castrated the TWS+ function.

In September 2019, vivo's TWS Earphone true wireless Bluetooth headset is the first in the industry to be equipped with Qualcomm's flagship QCC5126 solution, and mobile phones equipped with chips above Snapdragon 855 can open the TWS Plus connection mode (currently supported models are NEX 3, NEX 3 5G, iQOO Pro, iQOO Pro 5G, Z5).

The 1more stylish released in April 2019 also castrated the TWS+ function, but the latest 1more TWS+ will start shipping on November 15, and the TWS+ function can be implemented for mobile phones with chips above Snapdragon 855.

We believe that with the launch of vivo's TWS Earphone and 1more's latest TWS earphones, it shows that Qualcomm's TWS+ technology has matured, and the Q to Q ecosystem is truly launched.

In the past, Huawei FreeBuds, FreeBuds 2 Pro, and Honor FlyPods all used Hengxuan's forwarding scheme.

In September 2019, the FreeBuds 3 released by Huawei adopted Huawei's self-developed Kirin A1 chip and self-developed dual-channel synchronous transmission technology, which can realize the left and right earphones respectively obtain the left and right channel signals from the mobile phone (similar to Qualcomm's TWS+ technology). ) for more efficient transmission and lower power consumption.

Under the same interference intensity, the anti-interference performance of Kirin A1 and Apple H1 is basically the same as that of H1, which is much higher than other chip solutions in the market; in terms of transmission rate, the theoretical transmission rate of Kirin A1 chip reaches 6.5Mbps, three times higher than Other chips; when connecting audio, the transfer rate of lossless audio reaches 2.3Mbps. In addition, FreeBuds 3 is equipped with an independent Audio DSP processing unit, and the delay is reduced to 190ms, which is 30ms less than the 220ms of AirPods.

We believe that Huawei's self-developed Kirin A1 chip is similar to Apple's self-developed H1 chip, indicating that Huawei's positioning of TWS+ headphones has reached a new level. Through the adaptation of the self-developed Kirin A1 chip and its own mobile phone Kirin SOC platform, Huawei will also establish its own FreeBuds 3 headset-Huawei mobile phone connection ecology, which will achieve or even surpass the AirPods-iPhone ecology.

Both Qualcomm TWS+ and Huawei FreeBuds 3 break through the existing Bluetooth 5 technology and realize left and right dual-channel transmission, which is an optimization and upgrade of the existing Bluetooth 5 technology.

If Qualcomm TWS+ and Huawei's Bluetooth technology are expected to become the standard of the next-generation Bluetooth technology Bluetooth 6, that is, the Bluetooth 6 standard itself supports left and right dual-channel transmission, or it may lead to the disappearance of the meaning of Apple's monitoring mode technology blocking, rather than the penetration rate of Apple's TWS headset Or it will be greatly accelerated, and at the same time lead to changes in the competitive landscape of Bluetooth chips.

Of course, the formation of standards is not an easy task, but a very long and cumbersome matter, which also involves games between multiple manufacturers; even after the formation of standards, the promotion and application of standards will take time.

How popular are TWS headphones? Perhaps the Huaqiangbei market is the most sensitive. At present, Huaqiangbei white-brand TWS headphones are popular, and even a bit recreates the era of "cottage phones" around 2010.

According to the introduction of some white-brand TWS earphone products on the Tmall APP, we found that the white-brand TWS can basically realize most of the functions of AirPods. We searched on Pinduoduo and Tmall APP and found that the price of Huaqiangbei white TWS earphones is around 100-300 yuan, the first place on Pinduoduo sells more than 5,000 pieces, and a certain product on Tmall sells more than 3,000 pieces per month. .

From the perspective of shipments, according to Counterpoint data, AirPods shipments accounted for about half of all TWS headset shipments in 2019Q1, that is, the ratio of Android TWS to AirPods shipments is about 1:1. According to Gartner data, the global smartphone shipments in 2018 were about 1.4 billion, of which Apple accounted for about 200 million, that is, the ratio of Android mobile phones to Apple mobile phone shipments was about 6:1. Considering that TWS earphones are mainly used with smartphones, replacing traditional wired earphones, it may even become the standard configuration of smartphones. Therefore, we can reasonably deduce that in the next few years, the annual sales of Android TWS is expected to reach 6 times that of AirPods.

As we mentioned above, the current TWS industry competition pattern is dominated by Apple, other mobile phone, traditional audio, and accessory manufacturers contend, and white-label TWS headphones are prevalent.

Referring to the development history of cottage machines, we believe that the competitive landscape of the TWS industry will go through the following processes:

1) Apple AirPods create new products, and high-end users begin to use them;

2) Low-priced white-brand TWS earphones encourage consumers to try and experience TWS earphones, which is conducive to opening up the market demand of the TWS industry;

3) Brand manufacturers rely on product quality and brand advantages to make the TWS headset industry concentrate on brand manufacturers;

4) Mobile phone brand manufacturers rely on the ecosystem formed by TWS earphones and smartphones to bring a better experience, making the TWS earphone industry further concentrate on mobile phone brand manufacturers.

Therefore, in the long run, we believe that TWS headsets from mobile phone brand manufacturers such as Apple, Huawei, Samsung, OPPO, vivo, and Xiaomi will occupy the main market. Behind the brand manufacturers is the competitive landscape of Bluetooth solutions. Apple uses self-developed Bluetooth chips; Huawei also uses self-developed Bluetooth chips; Samsung may also develop self-developed Bluetooth chips in the future; OPPO, vivo, and Xiaomi should mainly use Qualcomm's Bluetooth chips. Bluetooth chip to achieve adaptation with Qualcomm Snapdragon platform.

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Since turning to a comprehensive data-centric innovation strategy, Intel is navigating faster. As an important pawn FPGA, Intel has also accelerated its new pace. Recently, Intel announced the shipment of the new Stratix 10 DX FPGA, and the Agilex series based on the 10nm process has been shipped to customers participating in the early use program and will be officially mass-produced next year.

Heterogeneous solutions address acceleration challenges

“As we all know, data has grown exponentially, and customers are looking to monetize that data, through new applications and speeding up existing applications, and leveraging this massive amount of data requires a heterogeneous approach Patrick Dorsey, vice president of Intel's Network and Custom Logic Division and general manager of FPGA and power product marketing, pointed out the advantages of heterogeneous computing in the data age, "This heterogeneous architecture includes CPU, GPU, AI chips and FPGAs. Only by addressing specific problems in a comprehensive and targeted manner can a complete solution be created.”

In heterogeneous platforms, FPGA is absolutely "indispensable". With the slowdown of Moore's Law and the development of big data, AI, 5G, autonomous driving, etc., unprecedented requirements for computing power and bandwidth have been put forward. At the same time, new algorithms and new frameworks are emerging one after another. To cope with this change, it is necessary to be flexible. FPGA. It is estimated that by 2022, the FPGA market will reach a scale of 7.5 billion US dollars, with a compound annual growth rate of 9%.

The two major indicators of the data center need to work together: that is, the network throughput must be increased, and the latency must be reduced. Patrick Dorsey said that as servers require more efficient computing to handle AI and other related loads, hardware accelerators including FPGAs, GPUs, etc. are widely used, but their effective performance depends largely on CPU, available system memory and Communication bandwidth and latency between accelerators.

As a result, after Intel included Altera in the bag four years ago, Intel, which can build an "all-round heterogeneous platform", has announced the establishment of the world's largest FPGA China Innovation Center in Chongqing, China, and has announced one of the FPGA portfolio families. The new product Stratix 10 DX leverages the "combination punch" of the Xeon processor Xeon + Stratix 10 DX to meet the acceleration challenge.

Xeon+FPGA combination brings high memory expansion capability

For this new combination, Patrick Dorsey analyzed that its biggest advantages are low latency, high bandwidth and memory expansion capabilities. Stratix 10 DX is not only Intel's first FPGA to support PCIe Gen4, but also provides key value by taking a hyperpath interconnect UPI with Xeon processors to rapidly expand memory, such as supporting 8 independent Optane DCs Persistent memory controller with a total capacity of up to 4TB.

Patrick Dorsey explained that whether the memory is DDR or Optane, by sharing memory between the Xeon processor and FPGA, there is no need to migrate or copy data during the sharing process, because data migration and copying will bring high costs, and at the same time It will also degrade system performance. From the new memory pyramid level, different types of memory include storage, persistent memory and normalized memory, Stratix 10 DX can improve the performance of high-level memory at the top, such as Optane and DRAM.

For the optimization of different application performance, Patrick Dorsey listed specific numbers: In edge computing applications, Stratix 10 DX has a 37% faster response speed than using PCIe only after having UPI. In network applications, due to the support of PCIe Gen4, the bandwidth is doubled compared to the previous generation of PCIe Gen3, making data processing faster, and also having Ethernet functions. In terms of data center, the total bandwidth can be increased by 2.6 times through Intel's heterogeneous Xeon+FPGA computing, coupled with the interconnection of PCIe Gen4 and UPI.

While Intel has announced its exit from the 5G baseband business, it remains focused on infrastructure. For official commercial 5G, Stratix 10 DX is also promising. Patrick Dorsey introduced: "Stratix 10 DX can be applied to 5G base stations, and its benefits are reflected in low latency, especially when 5G goes to the data center and is applied in vRAN, with Xeon processors, it can accelerate many network functions."

At present, the new FPGA is interconnected with the Xeon processor through UPI. Patrick Dorsey mentioned the integration of packaging in the future. Diversified FPGAs can allow customers to flexibly configure and optimize, and integrated packaging is not necessary.

Next-Generation Agilex Enables Many Innovations

The Stratix 10 DX FPGA that has been offered is just a fortitude. Intel's complete roadmap for FPGAs has surfaced. The Agilex FPGA series has also been shipped and will be mass-produced next year.

It is reported that Intel's Agilex FPGA series integrates almost all of Intel's current technology and innovation advantages, including architecture, packaging, process, development tools, and a fast way to reduce power consumption through eASIC technology.

Patrick Dorsey emphasized that Agilex uses Intel's 10nm process, which can match the industry's 7nm level. In addition, Agilex will support the next-generation UPI, an open standard interface based on CXL, and will also support the fifth-generation PCIe. Other innovations include the second-generation HyperFlex architecture and DSP innovation. He also emphasized that UPI can only be used with Xeon processors at present, and CXL will be public in the future and can be adapted to any processor. And the transition from UPI to CXL only needs to update the hardware interface and some software. The most important thing is that developers can already use UPI for application development, and customers can also seamlessly transfer and iterate to CLX.

Looking at the two giants in the FPGA field, they have made the same choice in the digital age, and Intel's heterogeneous platform is obviously an important bargaining chip. Patrick Dorsey finally pointed out that it is not enough to have only four architectures. In order to ensure that customers can make full use of the advantages of heterogeneity, Intel provides developers with product roadmaps and one-API unified application development interfaces, etc. End-to-end hardware deployment works closely with customers.

Hong Kong Xinrui Electronics Co., Ltd., 18 years of professional component distributors (authorized and non-authorized brands), one-stop terminal manufacturer support: (quality assurance and integrity management) is the company's commitment to provide customers with brand original semiconductors, electronic components Terminal supporting market, focusing on ESD/TVS electrostatic protection diodes, LDO low-power voltage regulators, MOS tubes, battery charging and management power supplies, LEDs, optocouplers, resistors and capacitors, PCB solutions (wireless Bluetooth solutions, Bluetooth sports version solution one-stop, speakers, wireless power bank).

Main products: ESD electrostatic diodes, TVS diodes, battery charging and management power supplies, MOS tubes, LDO low-power voltage regulators.

Company: Hong Kong Xinrui Electronics Co., Ltd.

Contact: Miss Yao

Mobile: 13725590222

Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen

Company website: www.xrdz-hk.com

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Hong Kong Xinrui Electronics Co., Ltd. is a professional supplier of integrated circuits and has many years of sales experience in the bank! With a large stock of stock, integrity-based, customer first, the quality of products for customers!

Due to the large number of company models, it is impossible to upload them one by one. If you can't find the product you want on the website, please contact the salesperson. Our company can provide electronic components distribution service.

Company: Hong Kong Xinrui Electronics Co., Ltd.

Contact: Miss Yao

Mobile: 13725590222

Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen

Company website: www.xrdz-hk.com

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Hong Kong Xinrui Electronics Co., Ltd. is a professional supplier of integrated circuits and has many years of sales experience in the bank! With a large stock of stock, integrity-based, customer first, the quality of products for customers!

Due to the large number of company models, it is impossible to upload them one by one. If you can't find the product you want on the website, please contact the salesperson. Our company can provide electronic components distribution service.

Company: Hong Kong Xinrui Electronics Co., Ltd.

Contact: Miss Yao

Mobile: 13725590222

Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen

Company website: www.xrdz-hk.com The fastest shipping speed ever.