SI2304DDS-T1-G...

  • 2022-09-24 21:11:22

SI2304DDS-T1-GE3

SI2304DDS-T1-GE3 MOSFET N-CH 30V 3.3A 3-Pin SOT-23

SI2304DDS-T1-GE3 product detailed specifications

Standard package 3,000

FET Type MOSFET N-Channel, Metal Oxide

FET FeaturesLogic Level Gate

Drain-to-source voltage (VDSS) 30V

Current - Continuous Drain (Number) @ 25°C 3.3A

Rds (max) @ ID, VGS60 mOhm @ 3.2A, 10V

VGS (TH) (max) @ Id2.2V @ 250µA

Gate Charge (Qg) @ VGS6.7nC @ 10V

Input Capacitor (Ciss) @ 235pF of Vds @ 15V

Power - 1.7W max

Mounting Type*_Pack/Box TO-236-3, SC-59, SOT-23-3

Supplier Device Package SOT-23-3 (TO-236)

Packaging Tape & Reel (TR)

Packaging 3SOT-23

Channel Mode Enhancement

Maximum drain-source voltage 30 V

Maximum continuous drain current 3.3 A

RDS - at 60@10V mOhm

Maximum gate-source voltage ±20 V

Typical turn-on delay time 12 ns

Typical rise time 50 ns

Typical fall time 22 ns

Operating temperature -55 to 150 °C

Install the Surface Mount

Standard Packaging Tape & Reel

Maximum gate-source voltage ±20

Packing width 1.4(Max)

PCB3

Maximum Power Dissipation 1100

Maximum drain-source voltage 30

EU RoHS Directive Compliant

Maximum drain-source resistance 60@10V

Number of components per chip 1

Minimum operating temperature -55

Supplier Package SOT-23

Standard package name SOT-23

Maximum working temperature 150

Channel TypeN

Packing length 3.04(Max)

Number of pins 3

Packaging height 1.02(Max)

Maximum continuous drain current 3.3

Package Tape and_Reel

Lead Shape Gull-wing

FET FeaturesLogic Level Gate

Mounting Type Surface Mount

Current - Continuous Drain (Id ) @ 25 °C 3.3A (Ta), 3.6A (Tc)

Vgs(th) (max) @Id2.2V @250µA

Drain to source voltage (Vdss) 30V

Supplier Equipment Package SOT-23-3 (TO-236)

On-state Rds (max) @ Id, V GS60 mOhm @ 3.2A, 10V

FET Type MOSFET N-Channel, Metal Oxide

Power - 1.7W max

Input Capacitor (Ciss) @ VDS235pF @ 15V

Gate Charge (Qg) @ VGS6.7nC @ 10V

Package/Enclosure TO-236-3, SC-59, SOT-23-3

RoHS Directive Lead free / RoHS Compliant

Other namesSI2304DDS-T1-GE3CT

Continuous drain current 3.3 A

Gate-source voltage (max)? 20 V

Power dissipation 1.1 W

Drain-source on-resistance 0.06 ohm

Operating temperature range -55C to 150C

Packaging Type SOT-23

Polarity N

Type Power MOSFET

Number of components 1

Operating temperature classification Military

Drain-source turn-on voltage 30 V

Arc hardeningNo

Remove Compliant

Transistor Polarity: N Channel

Continuous Drain Current Id: 3.6A

Drain Source Voltage Vds: 30V

On Resistance Rds(on): 0.049ohm

Rds(on) Test Voltage Vgs:10V

Threshold Voltage Vgs: 2.2V

Power consumption: 1.1W

Operating Temperature Min:-55°C

Operating Temperature Max: 150°C

Transistor Case Style: SOT-23

No. of Pins: 3

MSL:-

Current Id Max: 3.3A

Operating temperature range: -55°C to +150°C

Ordinary Bluetooth audio devices can only achieve 1-to-1 connection, including ordinary wireless Bluetooth headsets. However, there is no wire connection between the two earbuds of the TWS headset, and a 1-to-2 connection is required when connecting to a mobile phone.

Apple AirPods adopts Snoop monitoring mode, that is, listening to the left and right ears together, and Apple has implemented a patent block on the monitoring mode. In the early days, other TWS mainly used the relay forwarding mode, and the audio was transmitted from the mobile phone to the left ear (master device), and then forwarded from the left ear to the right ear (slave device).

The forwarding technology can be divided into traditional 2.4G forwarding, NXP's NFMI near-field magnetic communication technology and Hengxuan's LBRT low-frequency forwarding technology.

Compared with Apple's listening mode, the forwarding mode has the following disadvantages:

1) Due to the process of forwarding to the right ear (slave device) through the left ear (master device), the stability and delay of the connection in the forwarding mode are much worse than Apple's monitoring mode;

2) The monitor mode can be used in any single ear, while the forward mode is only used for the left ear (main device);

3) The power consumption of the left ear (master device) is significantly higher than that of the right ear (slave device).

Bluetooth 5.0 does not improve forwarding mode performance. Bluetooth has long supported connecting multiple terminals, but does not support simultaneous audio playback. That is to say, ordinary Bluetooth 5.0 technology does not support the function of TWS headset 1-to-2 connection to play music at the same time, but can only rely on monitoring technology or forwarding technology, etc., because the audio data transmission uses the traditional Bluetooth mentioned above. standard, not BLE Bluetooth Low Energy.

Therefore, even if Bluetooth is upgraded from 4.2 to Bluetooth 5.0, the disadvantage of forwarding mode compared to listening mode still exists, and the connection stability and delay of other manufacturers' TWS headphones are still worse than Apple's AirPods.

Bluetooth 5.0 can transmit commands more smoothly. Although Bluetooth 5.0 does not upgrade audio transmission, Bluetooth 5.0 provides higher bandwidth for low-power Bluetooth BLE. The PHY has evolved from 1M to 2M in Bluetooth 4.X, enabling Bluetooth devices to transmit commands more smoothly. For example, AirPods2 can support Siri.

MTK Luoda launched the AB1532 chip equipped with a new generation of TWS technology (MCSync, Multi Cast Synchronization) in early 2019. MCSync has the advantages of more stable connection, less staccato sound, support for high-resolution audio stream, low latency, more balanced power consumption for both ears, and suitable for various mobile phone platforms. In addition, MCSync also supports Multiple speakers connection.

In mid-2019, Luoda launched a more mature AB1536 chip, whose comprehensive experience such as connection performance was on par with Apple's AirPods, and became a popular chip.

In July 2019, the Luoda AB155X platform series cooperated with Sony to launch the Sony WF-1000XM3 product, which features Active Noise Cancellation (ANC) and supports Google Bisto.

In February 2018, Qualcomm launched TWS+ (TrueWireless Stereo Plus) technology. According to its official website, TWS+ is a Qualcomm-to-Qualcomm connection technology that can only be implemented between TWS headsets using Qualcomm QCC5100/QCC30XX Bluetooth chips and mobile phones based on Snapdragon 845, 670, and 710 mobile platforms.

Under the TWS+ connection technology, there will be two independent audio streams directly transmitted from the mobile phone to two different headphones, that is, the left and right channels are connected independently. If it is detected that the phone does not support TWS+ technology during the communication between the headset and the mobile phone, the headset will automatically switch to the TWS universal mode that is compatible with almost all smartphones.

Qualcomm TWS+ technology has been launched for more than a year, but the promotion speed is slow. Since TWS+ technology actually exceeds the existing Bluetooth standard, it needs to be implemented by optimizing the Bluetooth standard or the Android system. Crazy rice FUNCL AI, OPPO O-Free, bird track air, Edifier TWS5 and other products use Qualcomm QCC30XX chip, but they all castrated the TWS+ function.

In September 2019, vivo's TWS Earphone true wireless Bluetooth headset is the first in the industry to be equipped with Qualcomm's flagship QCC5126 solution, and mobile phones equipped with chips above Snapdragon 855 can open the TWS Plus connection mode (currently supported models are NEX 3, NEX 3 5G, iQOO Pro, iQOO Pro 5G, Z5).

The 1more stylish released in April 2019 also castrated the TWS+ function, but the latest 1more TWS+ will start shipping on November 15, and the TWS+ function can be implemented for mobile phones with chips above Snapdragon 855.

We believe that with the launch of vivo's TWS Earphone and 1more's latest TWS earphones, it shows that Qualcomm's TWS+ technology has matured, and the Q to Q ecosystem is truly launched.

In the past, Huawei FreeBuds, FreeBuds 2 Pro, and Honor FlyPods all used Hengxuan's forwarding scheme.

In September 2019, the FreeBuds 3 released by Huawei adopted Huawei's self-developed Kirin A1 chip and self-developed dual-channel synchronous transmission technology, which can realize the left and right earphones respectively obtain the left and right channel signals from the mobile phone (similar to Qualcomm's TWS+ technology). ) for more efficient transmission and lower power consumption.

Under the same interference intensity, the anti-interference performance of Kirin A1 and Apple H1 is basically the same as that of H1, which is much higher than other chip solutions in the market; in terms of transmission rate, the theoretical transmission rate of Kirin A1 chip reaches 6.5Mbps, three times higher than Other chips; when connecting audio, the transfer rate of lossless audio reaches 2.3Mbps. In addition, FreeBuds 3 is equipped with an independent Audio DSP processing unit, and the delay is reduced to 190ms, which is 30ms less than the 220ms of AirPods.

We believe that Huawei's self-developed Kirin A1 chip is similar to Apple's self-developed H1 chip, indicating that Huawei's positioning of TWS+ headphones has reached a new level. Through the adaptation of the self-developed Kirin A1 chip and its own mobile phone Kirin SOC platform, Huawei will also establish its own FreeBuds 3 headset-Huawei mobile phone connection ecology, which will achieve or even surpass the AirPods-iPhone ecology.

Both Qualcomm TWS+ and Huawei FreeBuds 3 break through the existing Bluetooth 5 technology and realize left and right dual-channel transmission, which is an optimization and upgrade of the existing Bluetooth 5 technology.

If Qualcomm TWS+ and Huawei's Bluetooth technology are expected to become the standard of the next-generation Bluetooth technology Bluetooth 6, that is, the Bluetooth 6 standard itself supports left and right dual-channel transmission, or it may lead to the disappearance of the meaning of Apple's monitoring mode technology blocking, rather than the penetration rate of Apple's TWS headset Or it will be greatly accelerated, and at the same time lead to changes in the competitive landscape of Bluetooth chips.

Of course, the formation of standards is not an easy task, but a very long and cumbersome matter, which also involves games between multiple manufacturers; even after the formation of standards, the promotion and application of standards will take time.

How popular are TWS headphones? Perhaps the Huaqiangbei market is the most sensitive. At present, Huaqiangbei white-brand TWS headphones are popular, and even a bit recreates the era of "cottage phones" around 2010.

According to the introduction of some white-brand TWS earphone products on the Tmall APP, we found that the white-brand TWS can basically realize most of the functions of AirPods. We searched on Pinduoduo and Tmall APP and found that the price of Huaqiangbei white TWS earphones is around 100-300 yuan, the first place on Pinduoduo sells more than 5,000 pieces, and a certain product on Tmall sells more than 3,000 pieces per month. .

From the perspective of shipments, according to Counterpoint data, AirPods shipments accounted for about half of all TWS headset shipments in 2019Q1, that is, the ratio of Android TWS to AirPods shipments is about 1:1. According to Gartner data, the global smartphone shipments in 2018 were about 1.4 billion, of which Apple accounted for about 200 million, that is, the ratio of Android mobile phones to Apple mobile phone shipments was about 6:1. Considering that TWS earphones are mainly used with smartphones, replacing traditional wired earphones, it may even become the standard configuration of smartphones. Therefore, we can reasonably deduce that in the next few years, the annual sales of Android TWS is expected to reach 6 times that of AirPods.

As we mentioned above, the current TWS industry competition pattern is dominated by Apple, other mobile phone, traditional audio, and accessory manufacturers contend, and white-label TWS headphones are prevalent.

Referring to the development history of cottage machines, we believe that the competitive landscape of the TWS industry will go through the following processes:

1) Apple AirPods create new products, and high-end users begin to use them;

2) Low-priced white-brand TWS earphones encourage consumers to try and experience TWS earphones, which is conducive to opening up the market demand of the TWS industry;

3) Brand manufacturers rely on product quality and brand advantages to make the TWS headset industry concentrate on brand manufacturers;

4) Mobile phone brand manufacturers rely on the ecosystem formed by TWS earphones and smartphones to bring a better experience, making the TWS earphone industry further concentrate on mobile phone brand manufacturers.

Therefore, in the long run, we believe that TWS headsets from mobile phone brand manufacturers such as Apple, Huawei, Samsung, OPPO, vivo, and Xiaomi will occupy the main market. Behind the brand manufacturers is the competitive landscape of Bluetooth solutions. Apple uses self-developed Bluetooth chips; Huawei also uses self-developed Bluetooth chips; Samsung may also develop self-developed Bluetooth chips in the future; OPPO, vivo, and Xiaomi should mainly use Qualcomm's Bluetooth chips. Bluetooth chip to achieve adaptation with Qualcomm Snapdragon platform.

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At 5:10 on September 23, at the Xichang Satellite Launch Center, my country successfully launched the 47th and 48th Beidou navigation satellites in the "one arrow and two satellites" method.

According to Chinanews.com, this launch officially kicked off the high-density launch of Beidou-3 from a basic system to a complete system.

In recent years, some achievements have been made in the construction of both the Beidou system and the Beidou industrial chain.

According to Chinanews.com, after several years of hard work and long-term reliance on imported traveling wave tube amplifier components, microwave switches, high-power power supply controllers, momentum wheel components, star sensors and other key products, the main and backup components have been localized. The localization rate of Beidou-3 satellite components has reached 100%.

Taking the traveling wave tube amplifier as an example, it is a key component of communication satellites, and my country has long relied on imports. In 2014, when my country was developing the Beidou-3 test satellite, the supplier suddenly notified that the supply would be stopped due to government reasons. However, the Beidou team has long recognized the importance of localization for the construction and stable operation of the Beidou system. At the same time as the construction of the Beidou-3 system was launched, the Fifth Academy of China Aerospace Science and Technology Corporation, together with many domestic units, carried out traveling wave tube amplifiers, etc. Technical research on the localization of key components. When the supplier learned that my country's traveling wave tube amplifier technology had made a breakthrough, and the Beidou team decided to replace imported products with domestic products, they hurriedly said that they could supply and cut the price by half.

In terms of Beidou industry chain, on February 28, 2017, my country's first self-developed "meter-level rapid positioning Beidou chip" was officially launched, realizing the independent control of basic products and reaching the international advanced level; December 27, 2018 , Ran Chengqi, director of the China Satellite Navigation System Management Office, revealed that the vast majority of smart phones in the world have adopted chips that support Beidou, and the Beidou system has entered the 3GPP International Mobile Communications Organization.

In the past ten years, the Beidou chip technology independently developed by my country has been reduced in size from 90nm to 28nm, and its performance has been continuously improved, and it has the strength and confidence to compete on a global scale.

At the 10th China Satellite Navigation Annual Conference held in May this year, a group of figures on the Beidou industrial chain were released. It is reported that key technologies such as domestic Beidou chips and modules have made comprehensive breakthroughs, and their performance indicators are comparable to those of similar international products. The 28nm process radio frequency baseband integrated SoC chip supporting the new signal of Beidou-3 has been widely used in the field of Internet of Things and consumer electronics. The latest 22nm process dual-frequency positioning chip is ready for market application, and the full-frequency integrated high-precision chip is being developed, and the performance of Beidou chips will reach a new level. The cumulative sales of domestic Beidou navigation chip modules has exceeded 80 million pieces, and the sales of high-precision boards and antennas have occupied 30% and 90% of the domestic market share, and exported to more than 100 countries and regions.

In addition, the output value of the domestic satellite navigation industry has exceeded 300 billion yuan in 2018; it is estimated that by 2020, the scale of my country's satellite navigation industry will exceed 400 billion yuan, and Beidou will drive a market share of more than 300 billion yuan.

In recent years, with the rise of emerging technologies and industrial models such as Internet+, 5G, and artificial intelligence, after the integration with satellite navigation technology, new economic development models such as precision agriculture, precision logistics, autonomous driving, intelligent transportation, and smart cities have emerged. Models and new forms of industrial development.

Hong Kong Xinrui Electronics Co., Ltd., 18 years of professional component distributors (authorized and non-authorized brands), one-stop terminal manufacturer support: (quality assurance and integrity management) is the company's commitment to provide customers with brand original semiconductors, electronic components Terminal supporting market, focusing on ESD/TVS electrostatic protection diodes, LDO low-power voltage regulators, MOS tubes, battery charging and management power supplies, LEDs, optocouplers, resistors and capacitors, PCB solutions (wireless Bluetooth solutions, Bluetooth sports version solution one-stop, speakers, wireless power bank).

Main products: ESD electrostatic diodes, TVS diodes, battery charging and management power supplies, MOS tubes, LDO low-power voltage regulators.

Company: Hong Kong Xinrui Electronics Co., Ltd.

Contact: Miss Yao

Mobile: 13725590222

Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen

Company website: www.xrdz-hk.com

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For more models, please inquire:

Hong Kong Xinrui Electronics Co., Ltd. is a professional supplier of integrated circuits and has many years of sales experience in the bank! With a large stock of stock, integrity-based, customer first, the quality of products for customers!

Due to the large number of company models, it is impossible to upload them one by one. If you can't find the product you want on the website, please contact the salesperson. Our company can provide electronic components distribution service.

Company: Hong Kong Xinrui Electronics Co., Ltd.

Contact: Miss Yao

Mobile: 13725590222

Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen

Company website: www.xrdz-hk.com

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Hong Kong Xinrui Electronics Co., Ltd. is a professional supplier of integrated circuits and has many years of sales experience in the bank! With a large stock of stock, integrity-based, customer first, the quality of products for customers!

Due to the large number of company models, it is impossible to upload them one by one. If you can't find the product you want on the website, please contact the salesperson. Our company can provide electronic components distribution service.

Company: Hong Kong Xinrui Electronics Co., Ltd.

Contact: Miss Yao

Mobile: 13725590222

Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen

Company website: www.xrdz-hk.com The fastest shipping speed ever.