SI2303CDS-T1-GE3 VISHAY 30 V 0.19 Ohm Surface Mount Power MosFet - SOT-23-3

SI2303CDS-T1-GE3 product detailed specifications

Standard package 3,000

FET Type MOSFET P-Channel, Metal Oxide

FET Features Standard

Drain-to-source voltage (VDSS) 30V

Current - Continuous Drain (No.) @ 25°C 2.7A

Rds (max) @ ID, VGS190 mOhm @ 1.9A, 10V

VGS (TH) (max) @ Id3V @ 250µA

Gate Charge (Qg) @ VGS8nC @ 10V

Input Capacitance (Ciss) @ 155pF of Vds @ 15V

Power - 2.3W max

Mounting Type Surface Mount

Bag/Box TO-236-3, SC-59, SOT-23-3

Supplier Device Package SOT-23-3 (TO-236)

Packaging Tape & Reel (TR)

Packaging 3SOT-23

channel type P

Channel Mode Enhancement

Maximum drain-source voltage 30 V

Maximum continuous drain current 1.9 A

RDS - at 190@10V mOhm

Maximum gate-source voltage ±20 V

Typical turn-on delay time 36 ns

Typical rise time 37 ns

Typical turn-off delay time 12 ns

Typical fall time 9 ns

Operating temperature -55 to 150 °C

Install the Surface Mount

Standard Packaging Tape & Reel

Product TypeMOSFET

RoHSRoHS Compliant

Transistor Polarity P-Channel

Drain-source breakdown voltage 30 V

Source breakdown voltage +/- 20 V

Continuous drain current 1.9 A

Anti-Drain Source RDS(ON) 0.19 Ohms

Configure Single

Maximum operating temperature + 150 C

Installation style SMD/SMT

Package/Enclosure SOT-23-3

Package Reel

Fall Time 37 ns

Minimum Operating Temperature - 55 C

Power dissipation 1 W

Rise time 37 ns

Factory packing quantity 3000

Part number alias SI2303CDS-GE3

Maximum gate-source voltage ±20

Packing width 1.4(Max)

PCB3

Maximum power dissipation 1000

Maximum drain-source voltage 30

EU RoHS Directive Compliant

Maximum drain-source resistance 190@10V

Number of components per chip 1

Minimum operating temperature -55

Supplier Package SOT-23

Standard package name SOT-23

Maximum working temperature 150

Packing length 3.04(Max)

Number of pins 3

Packaging height 1.02(Max)

Maximum continuous drain current 1.9

Lead Shape Gull-wing

P(TOT) 2.3W

Match code SI2303CDS

Unit pack 3000

Standard lead time 15 weeks

MOQ 3000

Polarized P-CHANNEL

Lead-free DefinRoHS-conform

I (D) 2.7A

V(DS) 30V

R (on DS) 0.158Ohm

FET Features Standard

Mounting Type Surface Mount

Current - Continuous Drain (Id ) @ 25 °C 2.7A (Tc)

Vgs(th) (max) @ Id3V @ 250µA

Supplier Equipment Package SOT-23-3 (TO-236)

On-state Rds (max) @ Id, V GS190 mOhm @ 1.9A, 10V

FET Type MOSFET P-Channel, Metal Oxide

Power - 2.3W max

Drain to source voltage (Vdss) 30V

Input Capacitor (Ciss) @ VDS155pF @ 15V

Gate Charge (Qg) @ VGS8nC @ 10V

Package/Enclosure TO-236-3, SC-59, SOT-23-3

RoHS Directive Lead free / RoHS Compliant

Other namesSI2303CDS-T1-GE3CT

CategoryPower MOSFET

Dimensions 3.04 x 1.4 x 1.02mm

Height 1.02mm

Length 3.04mm

Maximum drain-source resistance 0.19 Ω

Maximum power dissipation 1 W

Packaging Type SOT-23

Typical Gate Charge @ VGS2 nC V @ 4.5, 4 nC V @ 10

Typical Input Capacitance @ VDS155 pF V @ 15

Width 1.4mm

RDS(ON) 190 mOhms

Gate-source voltage (max)? 20 V

Drain-source on-resistance 0.19 ohm

Operating temperature range -55C to 150C

Polarity P

Type Power MOSFET

Number of components 1

Operating temperature classification Military

Drain-source turn-on voltage 30 V

Arc hardeningNo

Continuous Drain Current Id:-2.7A

Drain Source Voltage Vds:-30V

On Resistance Rds(on): 0.158ohm

Rds(on) Test Voltage Vgs:-10V

Threshold Voltage Vgs:-3V

Power consumption: 1W

Operating Temperature Min:-55°C

Operating Temperature Max: 150°C

Transistor Case Style: SOT-23

No. of Pins: 3

MSL:MSL 1 - Unlimited

Current Id Max: -1.9A

Operating temperature range: -55°C to +150°C

Ordinary Bluetooth audio devices can only achieve 1-to-1 connection, including ordinary wireless Bluetooth headsets. However, there is no wire connection between the two earbuds of the TWS headset, and a 1-to-2 connection is required when connecting to a mobile phone.

Apple AirPods adopts Snoop monitoring mode, that is, listening to the left and right ears together, and Apple has implemented a patent block on the monitoring mode. In the early days, other TWS mainly used the relay forwarding mode, and the audio was transmitted from the mobile phone to the left ear (master device), and then forwarded from the left ear to the right ear (slave device).

The forwarding technology can be divided into traditional 2.4G forwarding, NXP's NFMI near-field magnetic communication technology and Hengxuan's LBRT low-frequency forwarding technology.

Compared with Apple's listening mode, the forwarding mode has the following disadvantages:

1) Due to the process of forwarding to the right ear (slave device) through the left ear (master device), the stability and delay of the connection in the forwarding mode are much worse than Apple's monitoring mode;

2) The monitor mode can be used in any single ear, while the forward mode is only used for the left ear (main device);

3) The power consumption of the left ear (master device) is significantly higher than that of the right ear (slave device).

Bluetooth 5.0 does not improve forwarding mode performance. Bluetooth has long supported connecting multiple terminals, but does not support simultaneous audio playback. That is to say, ordinary Bluetooth 5.0 technology does not support the function of TWS headset 1-to-2 connection to play music at the same time, but can only rely on monitoring technology or forwarding technology, etc., because the audio data transmission uses the traditional Bluetooth mentioned above. standard, not BLE Bluetooth Low Energy.

Therefore, even if Bluetooth is upgraded from 4.2 to Bluetooth 5.0, the disadvantage of forwarding mode compared to listening mode still exists, and the connection stability and delay of other manufacturers' TWS headphones are still worse than Apple's AirPods.

Bluetooth 5.0 can transmit commands more smoothly. Although Bluetooth 5.0 does not upgrade audio transmission, Bluetooth 5.0 provides higher bandwidth for low-power Bluetooth BLE. The PHY has evolved from 1M to 2M in Bluetooth 4.X, enabling Bluetooth devices to transmit commands more smoothly. For example, AirPods2 can support Siri.

MTK Luoda launched the AB1532 chip equipped with a new generation of TWS technology (MCSync, Multi Cast Synchronization) in early 2019. MCSync has the advantages of more stable connection, less staccato sound, support for high-resolution audio stream, low latency, more balanced power consumption for both ears, and suitable for various mobile phone platforms. In addition, MCSync also supports Multiple speakers connection.

In mid-2019, Luoda launched a more mature AB1536 chip, whose comprehensive experience such as connection performance was on par with Apple's AirPods, and became a popular chip.

In July 2019, the Luoda AB155X platform series cooperated with Sony to launch the Sony WF-1000XM3 product, which features Active Noise Cancellation (ANC) and supports Google Bisto.

In February 2018, Qualcomm launched TWS+ (TrueWireless Stereo Plus) technology. According to its official website, TWS+ is a Qualcomm-to-Qualcomm connection technology that can only be implemented between TWS headsets using Qualcomm QCC5100/QCC30XX Bluetooth chips and mobile phones based on Snapdragon 845, 670, and 710 mobile platforms.

Under the TWS+ connection technology, there will be two independent audio streams directly transmitted from the mobile phone to two different headphones, that is, the left and right channels are connected independently. If it is detected that the phone does not support TWS+ technology during the communication between the headset and the mobile phone, the headset will automatically switch to the TWS universal mode that is compatible with almost all smartphones.

Qualcomm TWS+ technology has been launched for more than a year, but the promotion speed is slow. Since TWS+ technology actually exceeds the existing Bluetooth standard, it needs to be implemented by optimizing the Bluetooth standard or the Android system. Crazy rice FUNCL AI, OPPO O-Free, bird track air, Edifier TWS5 and other products use Qualcomm QCC30XX chip, but they all castrated the TWS+ function.

In September 2019, vivo's TWS Earphone true wireless Bluetooth headset is the first in the industry to be equipped with Qualcomm's flagship QCC5126 solution, and mobile phones equipped with chips above Snapdragon 855 can open the TWS Plus connection mode (currently supported models are NEX 3, NEX 3 5G, iQOO Pro, iQOO Pro 5G, Z5).

The 1more stylish released in April 2019 also castrated the TWS+ function, but the latest 1more TWS+ will start shipping on November 15, and the TWS+ function can be implemented for mobile phones with chips above Snapdragon 855.

We believe that with the launch of vivo's TWS Earphone and 1more's latest TWS earphones, it shows that Qualcomm's TWS+ technology has matured, and the Q to Q ecosystem is truly launched.

In the past, Huawei FreeBuds, FreeBuds 2 Pro, and Honor FlyPods all used Hengxuan's forwarding scheme.

In September 2019, the FreeBuds 3 released by Huawei adopted Huawei's self-developed Kirin A1 chip and self-developed dual-channel synchronous transmission technology, which can realize the left and right earphones respectively obtain the left and right channel signals from the mobile phone (similar to Qualcomm's TWS+ technology). ) for more efficient transmission and lower power consumption.

Under the same interference intensity, the anti-interference performance of Kirin A1 and Apple H1 is basically the same as that of H1, which is much higher than other chip solutions in the market; in terms of transmission rate, the theoretical transmission rate of Kirin A1 chip reaches 6.5Mbps, three times higher than Other chips; when connecting audio, the transfer rate of lossless audio reaches 2.3Mbps. In addition, FreeBuds 3 is equipped with an independent Audio DSP processing unit, and the delay is reduced to 190ms, which is 30ms less than the 220ms of AirPods.

We believe that Huawei's self-developed Kirin A1 chip is similar to Apple's self-developed H1 chip, indicating that Huawei's positioning of TWS+ headphones has reached a new level. Through the adaptation of the self-developed Kirin A1 chip and its own mobile phone Kirin SOC platform, Huawei will also establish its own FreeBuds 3 headset-Huawei mobile phone connection ecology, which will achieve or even surpass the AirPods-iPhone ecology.

Both Qualcomm TWS+ and Huawei FreeBuds 3 break through the existing Bluetooth 5 technology and realize left and right dual-channel transmission, which is an optimization and upgrade of the existing Bluetooth 5 technology.

If Qualcomm TWS+ and Huawei's Bluetooth technology are expected to become the standard of the next-generation Bluetooth technology Bluetooth 6, that is, the Bluetooth 6 standard itself supports left and right dual-channel transmission, or it may lead to the disappearance of the meaning of Apple's monitoring mode technology blocking, rather than the penetration rate of Apple's TWS headset Or it will be greatly accelerated, and at the same time lead to changes in the competitive landscape of Bluetooth chips.

Of course, the formation of standards is not an easy task, but a very long and cumbersome matter, which also involves games between multiple manufacturers; even after the formation of standards, the promotion and application of standards will take time.

How popular are TWS headphones? Perhaps the Huaqiangbei market is the most sensitive. At present, Huaqiangbei white-brand TWS headphones are popular, and even a bit recreates the era of "cottage phones" around 2010.

According to the introduction of some white-brand TWS earphone products on the Tmall APP, we found that the white-brand TWS can basically realize most of the functions of AirPods. We searched on Pinduoduo and Tmall APP and found that the price of Huaqiangbei white TWS earphones is around 100-300 yuan, the first place on Pinduoduo sells more than 5,000 pieces, and a certain product on Tmall sells more than 3,000 pieces per month. .

From the perspective of shipments, according to Counterpoint data, AirPods shipments accounted for about half of all TWS headset shipments in 2019Q1, that is, the ratio of Android TWS to AirPods shipments is about 1:1. According to Gartner data, the global smartphone shipments in 2018 were about 1.4 billion, of which Apple accounted for about 200 million, that is, the ratio of Android mobile phones to Apple mobile phone shipments was about 6:1. Considering that TWS earphones are mainly used with smartphones, replacing traditional wired earphones, it may even become the standard configuration of smartphones. Therefore, we can reasonably deduce that in the next few years, the annual sales of Android TWS is expected to reach 6 times that of AirPods.

As we mentioned above, the current TWS industry competition pattern is dominated by Apple, other mobile phone, traditional audio, and accessory manufacturers contend, and white-label TWS headphones are prevalent.

Referring to the development history of cottage machines, we believe that the competitive landscape of the TWS industry will go through the following processes:

1) Apple AirPods create new products, and high-end users begin to use them;

2) Low-priced white-brand TWS earphones encourage consumers to try and experience TWS earphones, which is conducive to opening up the market demand of the TWS industry;

3) Brand manufacturers rely on product quality and brand advantages to make the TWS headset industry concentrate on brand manufacturers;

4) Mobile phone brand manufacturers rely on the ecosystem formed by TWS earphones and smartphones to bring a better experience, making the TWS earphone industry further concentrate on mobile phone brand manufacturers.

Therefore, in the long run, we believe that TWS headsets from mobile phone brand manufacturers such as Apple, Huawei, Samsung, OPPO, vivo, and Xiaomi will occupy the main market. Behind the brand manufacturers is the competitive landscape of Bluetooth solutions. Apple uses self-developed Bluetooth chips; Huawei also uses self-developed Bluetooth chips; Samsung may also develop self-developed Bluetooth chips in the future; OPPO, vivo, and Xiaomi should mainly use Qualcomm's Bluetooth chips. Bluetooth chip to achieve adaptation with Qualcomm Snapdragon platform.

AD8505ARJZ AD8532ARZ-REEL7 AD8534ARZ-REEL AD8541ARTZ-REEL7 AD8542ARZ-REEL7 AD8544ARUZ AD8544ARZ AD8613AUJZ AD8617ARZ-REEL7 AD8692ARZ-REEL7 AD8694ARZ-REEL7 ADA4505-1ARJZ

Since the launch of AirPods, TWS earphones have been widely recognized by end consumers for their convenience, intelligence, and improvements in performance such as charging battery life, sound quality transmission, and connection speed, and market demand has shown an explosive growth trend.

According to Qualcomm's recently released "2019 Usage Status Survey Report" of audio technology, sound quality has become the primary purchasing driver for all consumer audio equipment categories for the fourth consecutive year, and the vast majority of respondents believe that the sound quality of wireless headphones has reached or exceeded. wired device.

Specifically in terms of shipments, according to Counterpoint data, the global TWS headset shipments in 2018 were 46 million pieces, and the shipments in the first quarter of 2019 were about 18 million pieces, a month-on-month increase of 40%; it is expected to ship by 2020. It will be 129 million pieces, with a compound annual growth rate of 67%.

The rise of the market, Qualcomm launched three high-end and low-end chips

At present, audio products are at a turning point in the overall transition from wired to wireless, and at the same time, they are rapidly evolving to the ultimate experience brought by true wireless products. ) etc. to meet changing user needs is critical.

As one of the mainstream manufacturers of TWS headset chips, Chris Havell, senior director of product marketing for Qualcomm's personal audio business, said that the true wireless headset market is rapidly rising, and the market will see significant changes in this trend from now to next year or in the next few years. ; At the same time, technologies such as left and right earphone synchronization must be integrated into the small space that can be inserted into the ear, which is a big challenge.

For Qualcomm, Chris Havell said, we are facing how to innovate to meet these needs. For a true wireless earbud product, we need to consider different aspects of the characteristics. First, a true wireless earbud needs to support voice assistants and active noise cancellation to eliminate background noise; at the same time, it needs to have the ability to support all-day battery life, and the left and right earbuds can be freely interchanged. In addition, TWS headphones also need to have high-resolution sound quality, and low latency to support smooth gaming or watching videos, and they also need a very robust connection that is not easy to disconnect.

Chris Havell emphasized that each different application scenario has different needs or purposes, as well as different types of technologies, and we need to integrate these technologies into TWS earbuds to meet these application scenarios. Qualcomm is helping consumers use audio products smoothly in different application scenarios, bringing diversified solutions to the market.

To this end, Qualcomm's top Bluetooth audio SoC QCC5100 series, mid-range QCC303X series, and entry-level QCC302X series products, based on the three different grades of SoCs provided by Qualcomm, can create a variety of TWS products at different price points.

"We will also assist customers in the process of putting these three SoC products on the market." Chris Havell said that in terms of product development and innovation for customers, we can provide reference designs and tools, which are used to quickly bring products to market. It also provides a complete set of software solutions to support customers to choose the required technologies and features, and create products that meet their own requirements, such as products with lower prices, products that support differentiated features such as support for active noise reduction and voice assistants, or surround sound-enabled in-ear products for the high-end market.

It is worth emphasizing that if the audio products and mobile terminals used by the user are equipped with Qualcomm chips, they can fully combine the technical strengths of the two, which can better complete the synchronization, bring the lowest delay and bring More robust connectivity.

Incorporated into the mid-to-high-end Snapdragon platform, TWS+ products will emerge

At present, Qualcomm is cooperating with many terminal companies around the world, and at the same time launching TWS headphones in the domestic market, including vivo. Not long ago, at the vivo new product launch conference, the new vivo TWS Earphone true wireless Bluetooth headset was launched, equipped with Qualcomm SoC QCC5100 series high-end chips.

Chris Havell said that Qualcomm had early contact with vivo on the QCC5100 series platform. We discussed their expectations for product design, and vivo also proposed some very creative ideas. Our latest QCC5126 flagship platform fits very well with vivo's design philosophy for their ideal product. On this new platform, we work very closely with vivo to jointly leverage the innovative features of the new platform. vivo is one of our very important customers on this platform.

However, Qualcomm has released the QCC3000 to 5000 series, and now the vivo TWS is the first true wireless headset that supports the TWS+ mode. In this regard, Chris Havell believes that from a technical point of view, TWS+ and standard TWS are not the same. TWS+ transmits an independent audio stream from the phone to each earbud, TWS transmits an audio stream to one earbud, and then relays it from one earbud to the other earbud. Therefore, from a technical point of view, these are two different solutions, which also require Qualcomm technical support at both ends of the audio transmission stream, that is, the mobile phone side and the earphone side. This new technology has many advantages. Especially better stability and lower latency.

In fact, TWS+ is different from the conventional connection technology. Qualcomm calls it dual connection, that is, the two links are directly output to the left and right earphones. Its advantage is that there is no distinction between the main and auxiliary headphones, and the left and right headphones can be seamlessly switched. From the perspective of connection technology, this is Qualcomm's leading technological advantage.

Chris Havell revealed that our innovation was realized during the launch of the QCC5100 series, and then we collaborated with colleagues in the mobile department to introduce the technology to mobile phone chips. The first to incorporate this technology is the Snapdragon 845 mobile platform. At present, the flagship Snapdragon 855, Snapdragon 845, high-end Snapdragon 730/730G, Snapdragon 712, Snapdragon 710, and mid-range Snapdragon 675, Snapdragon 670, and Snapdragon 665 support this technology.

As the most processor platform used by current mobile phone manufacturers, Qualcomm Snapdragon will have a more obvious effect on the application of Qualcomm TWS chips. The Qualcomm Snapdragon platform started with the earliest Snapdragon 845, and then the subsequent Snapdragon 710, Snapdragon 670, Snapdragon 675, Snapdragon 855, and Snapdragon 730/730G, all began to support TWS+ technology.

In Chris Havell's view, Qualcomm has expanded TWS+ technology to many mobile phone levels. In order to promote this new technology in the market, it also requires the technical capabilities of Qualcomm's cross-level chips. This is what we have in the past 18 months. direction of efforts.

At this stage, the application scenarios of TWS headsets are mainly used with smartphones. Although global smartphone shipments have declined since the beginning of this year, with the continuous advancement of global 5G network construction, 5G mobile phone shipments will grow rapidly and become an important driving force for boosting smartphone shipments. As more and more mobile phone platforms begin to support the TWS+ technology, more and more devices will emerge in the terminal, and earphones from different manufacturers can also use this advanced technology. The market for TWS earphones is expected to explode further.

Hong Kong Xinrui Electronics Co., Ltd., 18 years of professional component distributors (authorized and non-authorized brands), one-stop terminal manufacturer support: (quality assurance and integrity management) is the company's commitment to provide customers with brand original semiconductors, electronic components Terminal supporting market, focusing on ESD/TVS electrostatic protection diodes, LDO low-power voltage regulators, MOS tubes, battery charging and management power supplies, LEDs, optocouplers, resistors and capacitors, PCB solutions (wireless Bluetooth solutions, Bluetooth sports version solution one-stop, speakers, wireless power bank).

Main products: ESD electrostatic diodes, TVS diodes, battery charging and management power supplies, MOS tubes, LDO low-power voltage regulators.

Company: Hong Kong Xinrui Electronics Co., Ltd.

Contact: Miss Yao

Mobile: 13725590222

Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen

Company website: www.xrdz-hk.com

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For more models, please inquire:

Hong Kong Xinrui Electronics Co., Ltd. is a professional supplier of integrated circuits and has many years of sales experience in the bank! With a large stock of stock, integrity-based, customer first, the quality of products for customers!

Due to the large number of company models, it is impossible to upload them one by one. If you can't find the product you want on the website, please contact the salesperson. Our company can provide electronic components distribution service.

Company: Hong Kong Xinrui Electronics Co., Ltd.

Contact: Miss Yao

Mobile: 13725590222

Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen

Company website: www.xrdz-hk.com

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Hong Kong Xinrui Electronics Co., Ltd. is a professional supplier of integrated circuits and has many years of sales experience in the bank! With a large stock of stock, integrity-based, customer first, the quality of products for customers!

Due to the large number of company models, it is impossible to upload them one by one. If you can't find the product you want on the website, please contact the salesperson. Our company can provide electronic components distribution service.

Company: Hong Kong Xinrui Electronics Co., Ltd.

Contact: Miss Yao

Mobile: 13725590222

Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen

Company website: www.xrdz-hk.com The fastest shipping speed ever.