GSOT03C-GS08 Vishay ESD Suppressor TVS ±30KV 3-Pin SOT-23

GSOT03C-GS08 product detailed specifications

Standard package 3,000

Voltage - Reverse Isolation (typ) 3.3V

- Breakdown voltage 4V

Power (Watts) 369W

Polarized 2 Channel Array - Unidirectional

Mounting Type Surface Mount

Bag/Box TO-236-3, SC-59, SOT-23-3

Supplier Device Package SOT-23-3

Packaging Tape & Reel (TR)

Type TVS

Number of pins 3

Direction Type Bi-Directional

Maximum clamping voltage 12.3 V

Number of components per chip 1

ESD protection voltage ±30@Air Gap/±30@Contact Disc kV

Maximum working voltage 3.3(Min) V

Maximum leakage current 100 uA

Capacitance value 600 pF

Minimum operating temperature -40 °C

Maximum operating temperature 125 °C

Install the Surface Mount

Standard Packaging Tape & Reel

Maximum clamping voltage 12.3

Packaging width 1.43(Max)

PCB3

Maximum leakage current 100

EU RoHS Directive Compliant

Capacitance value 600

Minimum operating temperature -40

Configure Single

Supplier Package SOT-23

Standard package name SOT-23

Maximum ESD protection voltage ±30@Air Gap/±30@Contact Disc

Maximum operating temperature 125

Maximum working voltage 3.3(Min)

Packing length 3.1(Max)

Packaging height 1.05(Max)

Package Tape and_Reel

Lead Shape Gull-wing

Match code GSOT03C-GS08

Clamp VOLTAG10V

Packaging SOT23

Unit pack 3000

Standard lead time 15 weeks

MOQ 15000

Standby off V VWM3.3V

Apply BIDIRECTIO

Lead-free DefinRoHS-conform

PowerDissipati0.3kW

Automotive AEC-Q(101)

Tolerance 5%_Breakdown - V(BR) 4V

Channel 2 Channels

Clamping voltage 7.5 V

Product CategoryTVS Diodes - Transient Voltage Suppressors

Factory packing quantity 15000

SeriesGSOT03C-36C

Termination Type SMD/SMT

Unit Weight 0.000353 oz

Installation style SMD/SMT

Capacitance 420 pF

Breakdown voltage 4 V

Operating voltage 3.3 V (Min)

Package/Enclosure SOT-23

RoHSRoHS Compliant

TVS Polarity:Bidirectional

Reverse Stand-Off Voltage Vrwm: 24.5V

Breakdown Voltage Min: 27.5V

Breakdown Voltage Max:30.7V

Clamping Voltage Vc Max:12.3V

Peak Pulse Current Ippm: 30A

Diode Case Style: SOT-23

No. of Pins: 3

MSL:MSL 1 - Unlimited

Breakdown Voltage Range: 27.5V to 30.7V

Diode Configuration: Bidirectional

Diode Type:ESD Protection

Peak Pulse Power: 369W

Stand-off Voltage: 3.3V

Termination Type: SMD

Weight (kg)0.0001

Tariff No.85363010

associatedPESD3V3S2UT

According to the Taiwan media "Financial News", former Elpida president Yukio Sakamoto served as the senior vice president of Ziguang Group and the CEO of the Japanese branch. The matchmaker was Gao Qiquan, chairman of Yangtze River Storage.

Recently, Sakamoto Yukio said in an exclusive interview with Japan's "Diamond Weekly" that he and Gao Qiquan were old acquaintances. Three years ago, Gao Qiquan invited him to Ziguang Group to do NAND, but Sakamoto Yukio still has an obsession with DRAM. , therefore declined Gao Qiquan.

Since the beginning of this year, Gao Qiquan has invited Sakamoto Yukio twice to do DRAM together. Originally, he thought that his 70-year-old age would cause his physical strength to be unable to keep up, but because of the pace of learning kendo two years ago, he felt that he should be able to continue to work for two or three years. year. Therefore, when Gao Qiquan went to Japan again in September, it only took 30 minutes to invite Yukio Sakamoto, because DRAM was so attractive to him.

A few days ago, Sakamoto Yukio said in an interview that Ziguang's goal is to mass-produce DRAM memory within 5 years, and his job is to assist the company to achieve its goal. For this reason, Ziguang will set up a "development center" in Kawasaki, Kanagawa, Japan, and it is expected to recruit 70- 100 engineers, in cooperation with the manufacturing process team in China, spend 2-3 years to build a memory technology that can be mass-produced.

Regarding the recruitment of talents, Yukio Sakamoto said that it should come from Japanese semiconductor manufacturers such as Renesas Electronics, or people who serve in Taiwanese companies but are dissatisfied with the status quo. He emphasized that many engineers are excellent and willing to work, but limited by the company's division of labor strategy, they can only do subdivided work and lack freedom.

Yukio Sakamoto further pointed out that to make good DRAM, designers must consider the product as a whole, so companies must let them play freely, and Ziguang not only pays well, but should also provide an interesting working environment for them.

Tsinghua Unigroup's DRAM business group was established in June this year, with Diao Shijing, who was the director of the Electronic Information Department of the Ministry of Industry and Information Technology, as the chairman, and Gao Qiquan as the CEO. On August 27, Tsinghua Unigroup announced that it had signed a cooperation agreement with the Chongqing Municipal Government, and invested in a DRAM R&D center and factory in Chongqing. The factory is scheduled to start construction at the end of 2019 and be completed in 2021.

In addition, a source revealed that Tsinghua Unigroup has planned to invest 800 billion yuan in the next ten years to accelerate the mass production of DRAM.

With the heavy participation of Sakamoto Yukio, the DRAM layout of Tsinghua Unigroup is expected to grow further. It is understood that Yukio Sakamoto has more than 30 years of experience in the DRAM field and has excellent leadership in technology and strategic development. Mr. Yukio Sakamoto served as the vice president of Texas Instruments, the general manager of the semiconductor department of Kobe Steel's electronic information department, the president and representative director of Nippon Semiconductor, and the president, representative director and CEO of Elpida Storage.

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Samsung is once again caught up in rumors of factory closures. It is reported that Samsung will close its last mobile phone factory in China as soon as September. The company is currently doing the final liquidation work. The factory has been communicating with workers about the closure since May this year. The factory will be completely closed. A reporter from Beijing Business Daily reached out to Samsung China, but as of press time, the other party has not responded.

There have been many reports this year about the rumors of Samsung closing its Chinese factories, but none of them have been confirmed by Samsung. In early June, it was reported that Samsung Electronics was cutting production and laying off workers at its only remaining smartphone factory in China, the factory in Huizhou, Guangdong province. If the rumors are true, this factory is not the first factory Samsung has closed in China. As early as December 31, 2018, the 18-year-old Tianjin Samsung mobile phone manufacturing plant (Samsung Tianjin Communication) was shut down. In 2010, Samsung produced and sold more than 200 million mobile phones, of which more than 60% were produced in China, and the Tianjin factory produced the most.

It is reported that in recent years, Samsung is gradually shifting its mobile phone manufacturing to India and Vietnam. Among them, Vietnam has undertaken the most smartphone manufacturing business. As of April last year, Samsung’s total investment in Vietnam was as high as 17.3 billion US dollars, and 8 manufacturing facilities were built locally. The factory mainly produces smartphones, electronic parts, etc.

However, while the factory is closed, Samsung appears to be building a new factory. It is reported that Samsung is accelerating the construction of new projects such as automotive MLCC factories (multi-layer ceramic capacitors) and power battery production lines, and the new investment in high-end manufacturing has reached 2.4 billion US dollars (about 16.26 billion yuan). At present, there are 10 Samsung-related companies in the Tianjin area, with a cumulative investment of more than 5.8 billion US dollars (about 39.3 billion yuan), accounting for nearly 1/5 of Samsung's total investment in China.

Hong Kong Xinrui Electronics Co., Ltd., 18 years of professional component distributors (authorized and non-authorized brands), one-stop terminal manufacturer support: (quality assurance and integrity management) is the company's commitment to provide customers with brand original semiconductors, electronic components Terminal supporting market, focusing on ESD/TVS electrostatic protection diodes, LDO low-power voltage regulators, MOS tubes, battery charging and management power supplies, LEDs, optocouplers, resistors and capacitors, PCB solutions (wireless Bluetooth solutions, Bluetooth sports version solution one-stop, speakers, wireless power bank).

Main products: ESD electrostatic diodes, TVS diodes, battery charging and management power supplies, MOS tubes, LDO low-power voltage regulators.

Company: Hong Kong Xinrui Electronics Co., Ltd.

Contact: Miss Yao

Mobile: 13725590222

Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen

Company website: www.xrdz-hk.com

Hong Kong Xinrui Electronics Co., Ltd. part of the spot:

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For more models, please inquire:

Hong Kong Xinrui Electronics Co., Ltd. is a professional supplier of integrated circuits and has many years of sales experience in the bank! With a large stock of stock, integrity-based, customer first, the quality of products for customers!

Due to the large number of company models, it is impossible to upload them one by one. If you can't find the product you want on the website, please contact the salesperson. Our company can provide electronic components distribution service.

Company: Hong Kong Xinrui Electronics Co., Ltd.

Contact: Miss Yao

Mobile: 13725590222

Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen

Company website: www.xrdz-hk.com

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Hong Kong Xinrui Electronics Co., Ltd. is a professional supplier of integrated circuits and has many years of sales experience in the bank! With a large stock of stock, integrity-based, customer first, the quality of products for customers!

Due to the large number of company models, it is impossible to upload them one by one. If you can't find the product you want on the website, please contact the salesperson. Our company can provide electronic components distribution service.

Company: Hong Kong Xinrui Electronics Co., Ltd.

Contact: Miss Yao

Mobile: 13725590222

Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen

Company website: www.xrdz-hk.com

At the Yunqi Conference held on September 25, Ge Qun, chairman and global vice president of Synopsys China, said that from the current development situation, chip design will face huge challenges.

Especially after 7nm, the challenges faced will be even more arduous, and the new materials, equipment, processes and lithography technology required need to be re-explored. If major manufacturers want to solve this problem, they will need to invest a lot of time and cost. .

How to solve this problem?

Ge Qun said that Synopsys is currently working on optimizing design technology through cooperation and building a platform to allow different manufacturers to deepen cooperation and integrate, thereby accelerating design.

At the same time, Ge Qun also pointed out that in addition to the new design challenges brought about by process evolution, chip design is also faced with increasing design scale, which will increase the requirements for IT infrastructure, and the need to pursue chip performance drives various new Methodology and high cost of chip design and production require three major challenges for one-time tape-out success.

In Ge Qun's view, in addition to cooperation, cloud-based design tools will be able to provide design companies with unparalleled scalability and flexibility through flexible and scalable cloud services.

It can be said that the cloudification of design tools can not only make on-demand resource allocation a reality, and ultimately achieve cost optimization, but also ensure cross-department, cross-industry and cross-regional cooperation, reduce design costs, and accelerate chip design.

Finally, at the meeting, Pingtou Gehe and Synopsys jointly released a cloud-on-chip white paper.