THERM-A-GAP GEL45 is a fully cured dispensable thermal gel with a thermal conductivity of 4.5 W/mK. It is designed as a one-component full maturation system with automatic dispensing. This eliminates time-consuming manual assembly, reduces installation costs and reduces manufacturing and procurement (logistics) complexity for customers. These products require no mixing or curing, and offer excellent design flexibility.

Features/Benefits

Easy to apply

Fully cooked/no pump out

High volume thermal conductivity

Low thermal resistance

Ultra low compression force

High tack surface and reworkability

Proven long-term reliability

product properties

Provides low thermal resistance regardless of the thickness of the gap, allowing the use of common heat sinks

Reliable in the face of extreme temperature cycling, shock and vibration

Easily deflects at very low compressive forces, reducing stress on components, resulting in fewer component failures

Compatible with a variety of equipment and can accommodate a variety of bond line thicknesses

GEL45 has been successfully used to fill a wide variety of gap thicknesses

High volume thermal conductivity

Excellent value for money

Compatible with large batch automatic feeding process

Meets Telcordia (Bellcore) Silicone Specifications

typical application

Automotive Electronic Control Unit (ECU)

Power and Semiconductors

Memory and Power Modules

Microprocessor/Graphics

processor

Flat Panel Displays and Consumer Electronics

65-02-GEL45-0030, 65-02-GEL45-0180