The LSM6DSRX is a system-in-package (SiP) featuring a 3D digital accelerometer and a 3D digital gyroscope with a full-scale extended range of up to 4000 dps and high stability over temperature and time. The LSM6DSRX supports major OS requirements, offers real, virtual and batch sensors with 9 kBytes, and has up to 3x FIFO compression for dynamic data batching.

STMicroelectronics' family of MEMS sensor modules takes advantage of the robust and proven manufacturing processes already used to produce micromachined accelerometers and gyroscopes.

The LSM6DSRX has full-scale acceleration ranges of ±2 g, ±4 g, ±8 g, and ±16 g, and angular rate ranges of ±125 dps, ±250 dps, ±500 dps, ±1000 dps, ±2000 dps, and ±4000 dps .

The LSM6DSRX embeds a wide range of advanced features, supports Android wearable sensors and programmable sensors (for activity recognition), and comes in a plastic Land Grid Array (LGA) package.

feature

Extended full-scale range of gyroscope up to 4000 dps

High stability over temperature and time

Smart FIFO up to 9 KB

Compliant with Android

Auxiliary SPI for OIS data output from gyroscopes and accelerometers

±2 g / ±4 g / ±8 g / ±16 g full scale

±125 / ±250 / ±500 / ±1000 / ±2000 / ±4000 dps full scale

Analog Supply Voltage: 1.71 V to 3.6 V

SPI, I2C and MIPII3C™ serial interfaces with host processor data synchronization

Supports Qualcomm compliant sensor sync S4S (I2C, MIPI I3C, SPI compliant)

Advanced pedometer, step detector and step counter

Significant motion detection and tilt detection

Programmable Finite State Machines: Accelerometers, Gyroscopes and External Sensors

Machine Learning Core

Standard Interrupts: Free Fall, Wake, 6D/4D Orientation, Single and Double Tap

Embedded temperature sensor

Compliant with ECOPACK, RoHS and Green standards

Application field

Motion Tracking and Gesture Detection

Virtual and Augmented Reality

OIS for Camera Applications

sensor hub

Indoor Navigation

IoT and connected devices

Sports application

sensor