BA30E00WHFP: Low dropout voltage regulator, the company's advantage stock.

Multi-Output LDO Regulator. Example

Dual Output (Fixed/Variable) LDO Regulator - BA30E00WHFP

Rohm's two-stage LDO regulators are designed to maximize device characteristics and provide stable operation through low power consumption, high miniaturization, and low noise. Dual Output Fixed/Variable Two-Stage LDO Regulator for Local Power Supplies with Two Outputs (3.3V Fixed/0.8V-3.3V Variable), ±2% Output Voltage Accuracy, Low Saturation, Reduced Parts Count and installation area. In addition, multiple protection circuits (ie, overcurrent, thermal shutdown) are integrated, providing high reliability.

Single Output LDO Regulator. Example

1A Variable Output LDO Regulator-BA00CC0WT-V5(New)

The BA00CC0WT-V5 is a low saturation regulator that can be used to output up to 1A. The output voltage can be arbitrarily configured using external resistors. This LDO regulator is available in an extensive package series. It has a built-in overcurrent protection circuit to prevent damage to the IC due to output short circuit, and a thermal shutdown circuit that protects the IC from thermal damage due to overloading.

Rohm Corporation offers an extensive family of general purpose three-pin regulators featuring low power dissipation, high current capability, and high voltage resistance, making them ideal for mobile phones, automotive systems, consumer electronics, and commercial/industrial equipment

●Overview

The BA3259HFP and BA30E00WHFP are 2 output, low saturation regulators. These units have a fixed 3.3 V output

and variable output with ±2% accuracy of voltage output and integrated overcurrent protection circuit to prevent IC

Damage due to output short circuit and TSD (thermal shutdown) circuit to protect IC from thermal damage

Caused by overload.

●Features

Output voltage accuracy: ±2%.

? Reference voltage accuracy: ±2%

? Ceramic capacitors can be used to prevent output

Oscillation (BA3259HFP)

?Low power consumption, supports two voltage inputs

(BA30E00WHFP)

Built-in thermal shutdown circuit

?Built-in overcurrent protection circuit

●Main Specifications

■Input power supply voltage:

BA3259HFP 14.0V (max)

BA30E00WHFP 16.0V (max)

■Output voltage type: VO1 fixed

?VO2 variable

■Output current:

BA3259HFP 1A (max)

BA30E00WHFP 0.6A (max)

■Operating temperature range:

BA3259HFP 0 to 85℃

BA30E00WHFP -25 to 105℃

●Application field

Suitable for all commercial equipment such as FPD, TV,

and PC equipment, as well as DSP power for DVD and DVD

CD sleeve.

●Precautions for use

1) Absolute Maximum Ratings

Excessive absolute maximum ratings (such as supply voltage, temperature range of operating conditions, etc.) may

Damage the device, so the damage mode, such as a short or open circuit, cannot be recognized. if

Anything beyond the ratings will exceed the Absolute Maximum Ratings, consider adding circuit protection devices,

such as fuses.

2) Ground voltage

The potential of the GND pin must be the minimum potential under all operating conditions.

3) Heat dissipation design

Using thermal design, there is sufficient margin considering the power consumption (Pd) in actual operation

condition.

4) Short circuit between pins and wrong installation

Be careful when placing ICs to be mounted on printed circuit boards. If there is, the IC may be damaged

Wrong connection or pin shorted.

5) The role in strong electromagnetic fields

Be careful when using the IC in strong electromagnetic fields, as doing so may cause the IC

Fault.

6) Test on application board

When testing an IC on an application board, connecting a capacitor to a low-impedance pin can stress the IC.

Be sure to discharge the capacitors after each procedure or step. Be sure to power off the IC before connecting it to or .

Remove it from the jig or fixture during inspection. Ground the IC to prevent static electricity during assembly steps

Measurement. Take similar precautions when shipping or storing ICs.

7) About the input pins of the IC

This monolithic IC contains a P+ isolation layer and a P substrate layer between adjacent elements to maintain isolation.

PN junctions are formed at the intersections of these P layers with N layers of other elements, creating parasitics

diode or transistor. For example, the relationship between each potential is as follows:

When GND>PIN A and GND>PIN B, the PN junction acts as a parasitic diode.

When GND > PIN B, the PN junction acts as a parasitic transistor.

Parasitic diodes inevitably appear in the IC structure. operation of parasitic diodes may cause mutual

Interference between circuits, operational malfunction or physical damage. Therefore, the parasitic diode method

For example, do not apply a voltage lower than the GND (P substrate) voltage to the input pins.

8) Grounding wiring diagram

When using both small signal and high current GND modes, it is recommended to isolate the two ground modes,

Place a ground point at the applied ground potential for patterning resistance and voltage

Changes caused by large currents do not cause changes in small signal ground voltages. Be careful not to change

GND wiring diagram for any external components.

9) Thermal Shutdown Circuit (TSD)

The IC has a built-in thermal shutdown circuit to prevent thermal damage. should end

When the temperature (Tj) reaches the thermal shutdown ON temperature threshold, the TSD will be activated, turning off all outputs

power components. Once the temperature Tj of the chip falls below the threshold temperature, the circuit will automatically reset.

The thermal shutdown circuit operates assuming the IC's absolute maximum ratings have been exceeded.

The application design should not use thermal shutdown circuitry.

10) Overcurrent protection circuit

To prevent damage due to short-term overload current, an overcurrent protection circuit is built in.

Continued use of protective circuits should be avoided. Note that an increase in current will

temperature.

11) When the polarity of the Vcc pin is opposite to the polarity of other pins, it may damage the internal circuit or components

In the application. (ie, when the external capacitor is charging, the Vcc is shorted to the GND pin.)

The maximum capacitance of the output pins is 1000 mF. Insert a diode to prevent reverse current with

It is recommended to use Vcc or bypass diodes between Vcc and each pin.