ICC05-042-360G: 2.54mm pitch, IC connector for DIP (gold plating), 42 poles. Company advantage inventory.

Leaf spring IC connector.

There are doubles.

The double-type KINK structure is used to prevent the solder from rising, and the back cover shape is used to prevent the solder from being sucked in.

Since its establishment, KEL has been moving towards a professional manufacturer of industrial connectors. In the era of miniaturization and high function of electronic equipment, it has a history of excellent high reliability and high function. And KEL attaches the most importance to the exchange of information with customers. Under the close contact and communication, clearly understand the customer's requirements for the product and meet the needs of the customer. Then, under the research and development of professional R&D, KEL will be the first in the industry to provide the latest products. To develop a bright future for the electronics industry. KEL will also work hard towards high-tech and high-performance products in the technological field of connector technology. In the rapidly changing and advancing technology and market environment, KEL will respond to such a changing environment with creativity. Please look forward to the development and response of KEL.

KEL connector ICC05 series:

ICC05-008-360G 2.54mm pitch, DIP IC connector (gold plating), 8 poles

ICC05-008-360GP 2.54mm pitch, DIP IC connector (gold plating), 8 poles, measures to prevent flux rise

ICC05-008-360T-F2.54mm pitch, DIP IC connector, 8 poles

ICC05-008-360TP-F 2.54mm pitch, DIP IC connector, 8 poles, measures to prevent flux rise

ICC05-014-360G 2.54mm pitch, DIP IC connector (gold plating), 14 poles

ICC05-014-360GP 2.54mm pitch, DIP IC connector (gold plating), 14 poles, measures to prevent flux rise

ICC05-014-360T-F2.54mm pitch, DIP IC connector, 14 poles

ICC05-014-360TP-F 2.54mm pitch, DIP IC connector, 14 poles, measures to prevent flux rise

ICC05-016-360G 2.54mm pitch, DIP IC connector (gold plating), 16 poles

ICC05-016-360GP 2.54mm pitch, DIP IC connector (gold plating), 16 poles, measures to prevent flux rise

ICC05-016-360T-F2.54mm pitch, DIP IC connector, 16 poles

ICC05-016-360TP-F 2.54mm pitch, DIP IC connector, 16 poles, measures to prevent flux rise

ICC05-018-360G 2.54mm pitch, DIP IC connector (gold plating), 18 poles

ICC05-018-360GP 2.54mm pitch, DIP IC connector (gold plating), 18 poles, measures to prevent flux rise

ICC05-018-360T-F2.54mm pitch, DIP IC connector, 18 poles

ICC05-018-360TP-F 2.54mm pitch, DIP IC connector, 18 poles, measures to prevent flux rise

ICC05-020-360G 2.54mm pitch, DIP IC connector (gold plating), 20 poles

ICC05-020-360GP 2.54mm pitch, DIP IC connector (gold plating), 20 poles, measures to prevent flux rise

ICC05-020-360T-F2.54mm pitch, DIP IC connector, 20 poles

ICC05-020-360TP-F 2.54mm pitch, DIP IC connector, 20 poles, measures to prevent flux rise

ICC05-028-360T-F 2.54mm pitch, DIP IC connector, 28 poles

ICC05-028-360TP-F 2.54mm pitch, DIP IC connector, 28 poles, measures to prevent flux rise

ICC05-032-360G 2.54mm pitch, DIP IC connector (gold plating), 32 poles

ICC05-032-360GP 2.54mm pitch, DIP IC connector (gold plating), 32 poles, measures to prevent flux rise

ICC05-032-360T-F2.54mm pitch, DIP IC connector, 32 poles

ICC05-032-360TP-F 2.54mm pitch, DIP IC connector, 32 poles, measures to prevent flux rise

ICC05-040-360G 2.54mm pitch, DIP IC connector (gold plating), 40 poles

ICC05-040-360GP 2.54mm pitch, DIP IC connector (gold plating), 40 poles, measures to prevent flux rise

ICC05-040-360T-F2.54mm pitch, DIP IC connector, 40 poles

ICC05-040-360TP-F 2.54mm pitch, DIP IC connector, 40 poles, measures to prevent flux rise

ICC05-042-360G 2.54mm pitch, DIP IC connector (gold plating), 42 poles

ICC05-042-360GP 2.54mm pitch, DIP IC connector (gold plating), 42 poles, measures to prevent flux rise

ICC05-042-360T-F2.54mm pitch, DIP IC connector, 42 poles

ICC05-042-360TP-F 2.54mm pitch, DIP IC connector, 42 poles, measures to prevent flux rise