CL21B105KOF4PNE product detailed specifications

Rating AEC-Q200

Mounting Type Surface Mount, MLCC

Voltage - 16V nominal

Capacitor 1.0μF

Standard package 2,000

Product FeaturesOpen Mode, Soft Termination

Package Tape & Reel (TR)

Temperature Coefficient X7R

Dimensions/Dimensions 0.079 L x 0.049 W (2.01mm x 1.25mm)

ApplicationsAutomotive, Boardflex Sensitive

Operating temperature -55°C ~ 125°C

Package/Enclosure 0805 (2012 Metric)

Thickness (max) 0.053 (1.35mm)

Tolerance ±10%_Other name 1276-2929-2

RoHS Directive Lead free / RoHS Compliant

Thickness(mm)1.25mm

RatedVoltage16Vdc

TempCharacteristicX7R(-55 ~ +125)

Size L x W mm (Inch)2.0x1.25(0805)

In recent days, it is reported that Huawei's self-developed PA chips have been handed over to the domestic Sanan integrated foundry for production, and will achieve small-scale mass production in the first quarter of 2020. Since it was included in the Entity List by the U.S. Department of Commerce in May this year and banned from purchasing chips and software from U.S. companies, Huawei has publicly announced the use of a spare tire plan to increase investment in independent chip research and development. This time, it is frequently reported that Huawei has made new progress in PA chips, which is the proof of Huawei's breakthrough in RF chips. Of course, it can also be regarded as an important part of China's semiconductor localization.

5G and the Internet of Things parallel the PA demand gap to further expand

PA refers to power amplifier, which is a major component of the RF front-end transmission path. It is used to amplify the low-power RF signal generated by the modulation oscillator circuit to obtain appropriate RF output power. The signal amplified by the PA can be fed. radiate to the antenna. PA is one of the most critical components in a smartphone. It directly determines the distance, signal reception strength, call stability, and even standby time of the mobile phone's wireless communication, which can have a significant impact on user experience.

From 2G to 5G, the number of PAs in smartphones has gradually increased with the development of communication technology. The number of PA chips required in 4G multimode and multiband mobile phones is 5 to 7, while the number of PA chips in 5G smartphones is expected to reach as many as 16. In addition to smartphones, the usage of PAs in 5G base stations, smart mobile terminals and IoT terminals will all increase significantly. Compared with 4G base stations, the demand for PAs in 5G base stations is expected to increase by 16 times. The 4G base station adopts the 4T 4R scheme. According to the calculation of three sectors, the corresponding PA demand is 12 in total. It is expected that 64T 64R will become the mainstream scheme in the 5G base station, and the corresponding PA demand can reach 192.

Therefore, whether it is the popularization of 5G commercial use or the further implementation of the Internet of Things, it is a huge driving force behind the PA market. Currently, the PA market is growing relatively solidly, with a CAGR of around 7%, and is expected to grow from $5 billion in 2017 to $7 billion in 2023.

Strengthen independent supply capacity, domestic industrial chain rises with the wind

According to data from market research firm Gather, Huawei spent more than $21 billion on chip purchases in 2018, making it the world's third-largest chip buyer after Samsung and Apple, with radio frequency chips accounting for a large share. Due to the historical reasons of the development of the global RF industry, RF chips have been monopolized by Western countries for a long time. Therefore, if China wants to obtain all kinds of radio frequency chips, it has to import it for a long time. Before being included in the Entity List, Huawei met its PA needs by purchasing from US companies such as Skyworks, Qorvo, and Broadcom.

According to the supply chain, as early as last year when the ZTE incident broke out, Huawei has already begun to actively deploy the supply chain. The goal of "de-beautification" in the supply chain is clear. In order to ensure that there is no doubt about supply throughout the year, orders have increased by more than 50% compared with the usual, especially for RF components. In terms of RF chip design, the domestic RF PA manufacturer Weijie Chuangxin successfully entered Huawei's supply chain in 2018. In June of this year, a GaAs foundry revealed that Huawei has begun to design its own PA. In the Mate30 released in September this year, the 5G RF front-end has been exclusively provided by Murata, Japan, replacing the original American suppliers skyworks and Qorvo, and the 4G module is jointly supplied by Murata and Huawei HiSilicon.

In the wireless communication of smart phones, the vast majority of PAs are made of GaAs materials. The global GaAs RF device market is dominated by the IDM model, with American and Japanese companies occupying a monopoly position. The main manufacturers are Skyworks, Qorvo, Broadcom, Murata, etc. At present, the biggest constraint of the domestic semiconductor industry lies in the materials and equipment of the upstream link, while the advantage lies in the broad application market. Due to the high technical difficulty and complex industrial relations, the development of the semiconductor industry has to rely on the cooperation of global resources and technologies.

Most of the American PA manufacturers rely on Taiwan's GaAs foundry leader to stabilize the foundry, while Huawei independently develops PA chips and introduces the foundry capacity of Sanan related companies. There is a deeper meaning behind it. Apart from the consideration of the "de-beautification" strategy, another part of the reason is that the editor believes that it is to reduce the dependence on stability and reduce the risk caused by the excessive concentration of its own supply chain. Sanan Optoelectronics, the parent company of Sanan Integration, is an early domestic company that deploys GaAs materials. With Huawei's strong market response, Sanan Integration is expected to become one of the most important PA foundries in China.

As the world's largest communications equipment giant and the second largest mobile phone shipments, Huawei has an extraordinary influence on the semiconductor industry. Under the strong momentum of domestic substitution, domestic manufacturers who have entered Huawei's supply chain have already tasted the sweetness. The reshaping of Huawei's supply chain has led to changes in industry-wide expectations. Data shows that more than 20 Huawei concept stocks led by Huiding Technology, Zhaoyi Innovation, and Zhuoshengwei have all increased by more than 100% this year.

Objectively speaking, whether Huawei invests in independent research and development or chooses domestic substitution, the first is to ensure the supply of its own products and to diversify supply chain risks. But from another perspective, Huawei's industrial chain is also closely related to the development of China's semiconductor industry. For domestic manufacturers, entering Huawei's supply chain means that they can relieve a lot of market pressure, and at the same time obtain financial and resource support, and then better invest in product development and upgrading, forming a virtuous circle. Such opportunities have profound implications for manufacturers.

Hong Kong Xinrui Electronics Co., Ltd., 18 years of professional component distributors (authorized and non-authorized brands), one-stop terminal manufacturer support: (quality assurance and integrity management) is the company's commitment to provide customers with brand original semiconductors, electronic components Terminal supporting market, focusing on ESD/TVS electrostatic protection diodes, LDO low-power voltage regulators, MOS tubes, battery charging and management power supplies, LEDs, optocouplers, resistors and capacitors, PCB solutions (wireless Bluetooth solutions, Bluetooth sports version solution one-stop, speakers, wireless power bank).

Main products: ESD electrostatic diodes, TVS diodes, battery charging and management power supplies, MOS tubes, LDO low-power voltage regulators.

Company: Hong Kong Xinrui Electronics Co., Ltd.

Contact: Miss Yao

Mobile: 13725590222

Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen

Company website: www.xrdz-hk.com

Hong Kong Xinrui Electronics Co., Ltd. part of the spot:

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For more models, please inquire:

Hong Kong Xinrui Electronics Co., Ltd. is a professional supplier of integrated circuits and has many years of sales experience in the bank! With a large stock of stock, integrity-based, customer first, the quality of products for customers!

Due to the large number of company models, it is impossible to upload them one by one. If you can't find the product you want on the website, please contact the salesperson. Our company can provide electronic components distribution service.

Company: Hong Kong Xinrui Electronics Co., Ltd.

Contact: Miss Yao

Mobile: 13725590222

Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen

Company website: www.xrdz-hk.com

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Hong Kong Xinrui Electronics Co., Ltd. is a professional supplier of integrated circuits and has many years of sales experience in the bank! With a large stock of stock, integrity-based, customer first, the quality of products for customers!

Due to the large number of company models, it is impossible to upload them one by one. If you can't find the product you want on the website, please contact the salesperson. Our company can provide electronic components distribution service.

Company: Hong Kong Xinrui Electronics Co., Ltd.

Contact: Miss Yao

Mobile: 13725590222

Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen

Company website: www.xrdz-hk.com