SI2304BDS-T1-GE3 Single N-Channel 30V 0.07Ohm 0.75W Surface Mount Power Mosfet - SOT-23-3

SI2304BDS-T1-GE3 product detailed specifications

Standard package 3,000

FET Type MOSFET N-Channel, Metal Oxide

FET FeaturesLogic Level Gate

Drain-to-source voltage (VDSS) 30V

Current - Continuous Drain (Number) @ 25°C 2.6A

Rds (max) @ ID, VGS70 mOhm @ 2.5A, 10V

VGS (TH) (max) @ Id3V @ 250µA

Gate Charge (Qg) @ VGS4nC @ 5V

Input Capacitor (Ciss) @ 225pF of Vds @ 15V

Power - 750mW max

Mounting Type Surface Mount

Bag/Box TO-236-3, SC-59, SOT-23-3

Supplier Device Package SOT-23-3 (TO-236)

Packaging Tape & Reel (TR)

Packaging 3SOT-23

Channel Mode Enhancement

Maximum drain-source voltage 30 V

Maximum continuous drain current 2.6 A

RDS - at 70@10V mOhm

Maximum gate-source voltage ±20 V

Typical turn-on delay time 7.5 ns

Typical rise time 12.5 ns

Typical turn-off delay time 19 ns

Typical fall time 15 ns

Operating temperature -55 to 150 °C

Install the Surface Mount

Standard Packaging Tape & Reel

Maximum gate-source voltage ±20

Packing width 1.4(Max)

PCB3

Maximum Power Dissipation 750

Maximum drain-source voltage 30

EU RoHS Directive Compliant

Maximum drain-source resistance 70@10V

Number of components per chip 1

Minimum operating temperature -55

Supplier Package SOT-23

Standard package name SOT-23

Maximum working temperature 150

Channel TypeN

Packing length 3.04(Max)

Number of pins 3

Packaging height 1.02(Max)

Maximum continuous drain current 2.6

Package Tape and_Reel

Lead Shape Gull-wing

unit pack 0

MOQ 1

FET FeaturesLogic Level Gate

Mounting Type Surface Mount

Current - Continuous Drain (Id ) @ 25 °C 2.6A (Ta)

Vgs(th) (max) @ Id3V @ 250µA

Supplier Equipment Package SOT-23-3 (TO-236)

On-state Rds (max) @ Id, V GS70 mOhm @ 2.5A, 10V

FET Type MOSFET N-Channel, Metal Oxide

Power - 750mW max

Drain to source voltage (Vdss) 30V

Input Capacitor (Ciss) @ VDS225pF @ 15V

Gate Charge (Qg) @ VGS4nC @ 5V

Package/Enclosure TO-236-3, SC-59, SOT-23-3

RoHS Directive Lead free / RoHS Compliant

Other namesSI2304BDS-T1-GE3CT

Factory packing quantity 3000

Product TypeMOSFET

Transistor Polarity N-Channel

Configure Single

Source breakdown voltage +/- 20 V

Continuous drain current 2.6 A

Installation style SMD/SMT

RDS(ON) 70 mOhms

Power dissipation 750 mW

Minimum Operating Temperature - 55 C

Package/Case TO-236-3

Part number alias SI2304BDS-GE3

Rise time 12.5 ns

Maximum operating temperature + 150 C

Drain-source breakdown voltage 30 V

RoHSRoHS Compliant

Fall Time 12.5 ns

Continuous Drain Current Id: 3.2A

Drain Source Voltage Vds: 30V

On Resistance Rds(on): 105mohm

Rds(on) Test Voltage Vgs: 20V

"Domestic large silicon wafers are one of the three major strategic tasks that need to be broken through in the national integrated circuit field. In 2018, the market share of the top 5 300nm silicon wafer companies was about 98%, and the concentration was very high. At present, domestic 12/8-inch silicon wafer companies ( The development status of more than 16 companies is small and scattered, lacking international competitiveness." At the 2019 China IC Industry Development Seminar and the 22nd China IC Manufacturing Annual Conference held today, Shanghai Silicon Industry Group According to Dr. Li Wei, Executive Vice President of Co., Ltd.

Regarding the development status of domestic silicon wafer companies, Dr. Li Wei believes that from the perspective of corporate announcements, domestic silicon wafer companies have overcapacity for 8-inch (heavy-doped) silicon wafers, and 8-inch (lightly-doped) silicon wafers need to make technological breakthroughs. It needs to compete with Top5. Only Shanghai Xinsheng has made a breakthrough in industrialization of 12-inch silicon wafers; 8-inch SOI Xinao Technology has achieved international advanced results, and the next stage will focus on developing 12-inch SOI technology research and development and production.

Dr. Li Wei said that Shanghai Xinsheng is the first domestic large-scale silicon wafer mass production company, with an existing production capacity of 150,000 wafers/month, and an existing delivery room that can accommodate 300,000 wafers/month. In 2019, Shanghai Xinsheng had more than 10 positive films passed the demonstration. Shanghai Xinsheng has achieved the leap from 0 to 1 for 300mm domestic large silicon wafers, and is working hard in the direction of 300mm domestic large silicon wafers from 1 to ∞, and from 1 to ∞ is the ultimate goal of domestic large silicon wafers.

In addition, Dr. Li Wei also analyzes the global market. He said that after the shortage of supply in the past two years, the silicon wafer market is now slightly oversupplied. The global monthly shipment of 300mm silicon wafers is now close to 6 million, while the global installed capacity is around 5.5 million. It is predicted that the installed capacity of 300mm wafer fab equipment will be 5.63 million pieces per month in 2020. With the increase of wafer fab installed capacity, the demand for 300mm silicon wafers will further increase.

AD8505ARJZ AD8532ARZ-REEL7 AD8534ARZ-REEL AD8541ARTZ-REEL7 AD8542ARZ-REEL7 AD8544ARUZ AD8544ARZ AD8613AUJZ AD8617ARZ-REEL7 AD8692ARZ-REEL7 AD8694ARZ-REEL7 ADA4505-1ARJZ

In September this year, it can be described as the "big month" for the integrated circuit industry, with many wafer factories and integrated circuit projects put into operation one after another.

On September 21, the large silicon wafer project of Hangzhou Zhongxin Wafer Semiconductor Co., Ltd. was completed and put into production, realizing the official mass production of 8-inch large silicon wafers. At the same time, the 12-inch large silicon wafer production line entered the stage of debugging and trial production.

On September 20, at the 2019 World Manufacturing Conference held in Hefei, Anhui, Changxin's self-manufacturing project for memory memory chips was announced to be put into production.

On September 20, Yuexin held a 12-inch wafer project launch event.

On September 17, the Hua Hong Wuxi project achieved phased progress. The first phase of the 12-inch production line was successfully completed and the filming was held at the Wuxi project site.

On September 10, Juneng Jingyuan (Qingdao) Semiconductor Materials Co., Ltd. held a ceremony for the commissioning and product release of the 8-inch GaN epitaxial material project.

According to Securities Times.com, the first round of mainland fabs that were planned or started from 2016 to 2018 have been put into operation one after another, with product design and process technology becoming more and more mature.

BOC International believes that some domestic integrated circuit process equipment has a certain market position, but in the new round of equipment procurement for fabs, the price competition pressure from world-class imported brands has increased. Based on the equipment procurement of Changjiang Storage, Huali Phase II, and Huahong No. 7 Plant, the average localization rate of process equipment is only about 10%. The localization rates of PVD, CMP and copper plating equipment are 87%, 25%, 22%, 21%, 13%, 12%, and 11%, respectively. In the new round of equipment procurement, these domestic equipment have the opportunity to continue to expand market share, but according to BOC International estimates, international imported brands that are still in an absolute monopoly position will adopt a competitive strategy of stabilizing market share by reducing prices, giving Domestic equipment brings cost pressure.

Hong Kong Xinrui Electronics Co., Ltd., 18 years of professional component distributors (authorized and non-authorized brands), one-stop terminal manufacturer support: (quality assurance and integrity management) is the company's commitment to provide customers with brand original semiconductors, electronic components Terminal supporting market, focusing on ESD/TVS electrostatic protection diodes, LDO low-power voltage regulators, MOS tubes, battery charging and management power supplies, LEDs, optocouplers, resistors and capacitors, PCB solutions (wireless Bluetooth solutions, Bluetooth sports version solution one-stop, speakers, wireless power bank).

Main products: ESD electrostatic diodes, TVS diodes, battery charging and management power supplies, MOS tubes, LDO low-power voltage regulators.

Company: Hong Kong Xinrui Electronics Co., Ltd.

Contact: Miss Yao

Mobile: 13725590222

Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen

Company website: www.xrdz-hk.com

Hong Kong Xinrui Electronics Co., Ltd. part of the spot:

TLV70433DBVR、TP4101、TP5100、TP4056、RT9013-33PB、TPS73618DBVR、MIC5255-3.0YM5、CDSOT23-T36C、CDSOT23-24C、TL431CDBZR、TL431IDBZR、TLV1117CDCYR、LM317EMPX、NCP1117ST33T3G、NCP1117ST50T3G、PESD5V0V1BL、PESD5V0V1BSF、PESD2CAN、PESD5V0S1BA、PESD12VS2UT、PESD15VL2BT , PESD36VS2UT, PESD3V3L1BA, PESD24VL2BT, IP4220CZ6, IP4223CZ6, BCP56-16, BCP51-16, BSN20, uClamp0511T.TCT, SRV05-4.TCT, RCLAMP0531T.TCT, RCLAMP0502A.TCT, SD05C.TCT, SRAMP05.TCT 、ESD5Z2.5T1G、ESD5Z3.3T1G、CM1213A-01SO、CM1213A-04SO、NTR4501NT1G、NTR4502PT1G、NTR4170NT1G、NTR4171PT1G、RLST23A032C、RLST23A0122C、RLST23A052C、PRTR5V0U2X、GBLC03CI-LF-T7、GBLC03C-LF-T7、GBLC05CI-LF-T7 , GBLC05C-LF-T7, GBLC08CI-LF-T7, GBLC08C-LF-T7, GBLC12CI-LF-T7, GBLC12C-LF-T7, GBLC15CI-LF-T7, GBLC24CI-LF-T7, GBLC24C-LF-T7, PSD03C -LF-T7, PSD05-LF-T7, PSD05C-LF-T7, PSD08C-LF-T7, PSM712-LF-T7, AO3400, AO3400A, AO3401A, AO3402, TPSMB6.8CA-E3/52, TPSMB6.8A, TPSMB47A , TPSMB43A, TPSMB39A, TPSMB36A, TPSMB33A, TPSMB30A, STTH208, , IRLML2502TRPBF, TP4101, IRLML6401TRPBF, TLV70433DBVR, PESD5V0S1BB, PSM712-LF-T7, NTR4171PT1G, SGM2 036-3.3YUDH4G/TR, SGM2036-1.8YUDH4G/TR, DMN2046U-7, etc.

For more models, please inquire:

Hong Kong Xinrui Electronics Co., Ltd. is a professional supplier of integrated circuits and has many years of sales experience in the bank! With a large stock of stock, integrity-based, customer first, the quality of products for customers!

Due to the large number of company models, it is impossible to upload them one by one. If you can't find the product you want on the website, please contact the salesperson. Our company can provide electronic components distribution service.

Company: Hong Kong Xinrui Electronics Co., Ltd.

Contact: Miss Yao

Mobile: 13725590222

Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen

Company website: www.xrdz-hk.com

AOZ8808DI-05、AOZ1284PI、AOZ1280CI、AOT11N70、AON7934、AON7544、AON7534、AON7524、AON7520、AON7506、AON7423、AON7421、AON7418、AON7410、AON7409、AON7407、AON7405、AON7403、AON7401、AON7296、AON7264E、AON6522、AON6512、AON6508、 AON6504、AON6414AL、AON6262E、AON5820、AON2801、AOD603A、AOD516、AOD484、AOD482、AOD478、AOD444、AOD4185、AOD4184L、AOD4184A、AOD4132、AOD413A、AOD409、AOD417、AOD407、AOD403、AO8822、AO8810、AO3414、AO3402、AO4606、 AO4485、AO4453、AO4447AL、AO4443、AO4468、AO4435、AO4421、AO4419、AO4407AL、AO4406AL、AO4354、AO4292、AO4264E、AO3485、AO3481、AO3480、AO3423、AO3422、AO3416、AO3415AL、AO3415、AO3407A、AO3401A、AO3400A

Hong Kong Xinrui Electronics Co., Ltd. is a professional supplier of integrated circuits and has many years of sales experience in the bank! With a large stock of stock, integrity-based, customer first, the quality of products for customers!

Due to the large number of company models, it is impossible to upload them one by one. If you can't find the product you want on the website, please contact the salesperson. Our company can provide electronic components distribution service.

Company: Hong Kong Xinrui Electronics Co., Ltd.

Contact: Miss Yao

Mobile: 13725590222

Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen

Company website: www.xrdz-hk.com The fastest shipping speed ever.