SI2303CDS-T1-G...

  • 2022-09-24 21:26:48

SI2303CDS-T1-GE3

SI2303CDS-T1-GE3 VISHAY 30 V 0.19 Ohm Surface Mount Power MosFet - SOT-23-3

SI2303CDS-T1-GE3 product detailed specifications

Standard package 3,000

FET Type MOSFET P-Channel, Metal Oxide

FET Features Standard

Drain-to-source voltage (VDSS) 30V

Current - Continuous Drain (No.) @ 25°C 2.7A

Rds (max) @ ID, VGS190 mOhm @ 1.9A, 10V

VGS (TH) (max) @ Id3V @ 250µA

Gate Charge (Qg) @ VGS8nC @ 10V

Input Capacitance (Ciss) @ 155pF of Vds @ 15V

Power - 2.3W max

Mounting Type Surface Mount

Bag/Box TO-236-3, SC-59, SOT-23-3

Supplier Device Package SOT-23-3 (TO-236)

Packaging Tape & Reel (TR)

Packaging 3SOT-23

channel type P

Channel Mode Enhancement

Maximum drain-source voltage 30 V

Maximum continuous drain current 1.9 A

RDS - at 190@10V mOhm

Maximum gate-source voltage ±20 V

Typical turn-on delay time 36 ns

Typical rise time 37 ns

Typical turn-off delay time 12 ns

Typical fall time 9 ns

Operating temperature -55 to 150 °C

Install the Surface Mount

Standard Packaging Tape & Reel

Product TypeMOSFET

RoHSRoHS Compliant

Transistor Polarity P-Channel

Drain-source breakdown voltage 30 V

Source breakdown voltage +/- 20 V

Continuous drain current 1.9 A

Anti-Drain Source RDS(ON) 0.19 Ohms

Configure Single

Maximum operating temperature + 150 C

Installation style SMD/SMT

Package/Enclosure SOT-23-3

Package Reel

Fall Time 37 ns

Minimum Operating Temperature - 55 C

Power dissipation 1 W

Rise time 37 ns

Factory packing quantity 3000

Part number alias SI2303CDS-GE3

Maximum gate-source voltage ±20

Packing width 1.4(Max)

PCB3

Maximum power dissipation 1000

Maximum drain-source voltage 30

EU RoHS Directive Compliant

Maximum drain-source resistance 190@10V

Number of components per chip 1

Minimum operating temperature -55

Supplier Package SOT-23

Standard package name SOT-23

Maximum working temperature 150

Packing length 3.04(Max)

Number of pins 3

Packaging height 1.02(Max)

Maximum continuous drain current 1.9

Lead Shape Gull-wing

P(TOT) 2.3W

Match code SI2303CDS

Unit pack 3000

Standard lead time 15 weeks

MOQ 3000

Polarized P-CHANNEL

Lead-free DefinRoHS-conform

I (D) 2.7A

V(DS) 30V

R (on DS) 0.158Ohm

FET Features Standard

Mounting Type Surface Mount

Current - Continuous Drain (Id ) @ 25 °C 2.7A (Tc)

Vgs(th) (max) @ Id3V @ 250µA

Supplier Equipment Package SOT-23-3 (TO-236)

On-state Rds (max) @ Id, V GS190 mOhm @ 1.9A, 10V

FET Type MOSFET P-Channel, Metal Oxide

Power - 2.3W max

Drain to source voltage (Vdss) 30V

Input Capacitor (Ciss) @ VDS155pF @ 15V

Gate Charge (Qg) @ VGS8nC @ 10V

Package/Enclosure TO-236-3, SC-59, SOT-23-3

RoHS Directive Lead free / RoHS Compliant

Other namesSI2303CDS-T1-GE3CT

CategoryPower MOSFET

Dimensions 3.04 x 1.4 x 1.02mm

Height 1.02mm

Length 3.04mm

Maximum drain-source resistance 0.19 Ω

Maximum power dissipation 1 W

Packaging Type SOT-23

Typical Gate Charge @ VGS2 nC V @ 4.5, 4 nC V @ 10

Typical Input Capacitance @ VDS155 pF V @ 15

Width 1.4mm

RDS(ON) 190 mOhms

Gate-source voltage (max)? 20 V

Drain-source on-resistance 0.19 ohm

Operating temperature range -55C to 150C

Polarity P

Type Power MOSFET

Number of components 1

Operating temperature classification Military

Drain-source turn-on voltage 30 V

Arc hardeningNo

Continuous Drain Current Id:-2.7A

Drain Source Voltage Vds:-30V

On Resistance Rds(on): 0.158ohm

Rds(on) Test Voltage Vgs:-10V

Threshold Voltage Vgs:-3V

Power consumption: 1W

Operating Temperature Min:-55°C

Operating Temperature Max: 150°C

Transistor Case Style: SOT-23

No. of Pins: 3

MSL:MSL 1 - Unlimited

Current Id Max: -1.9A

Operating temperature range: -55°C to +150°C

At the 2019 China IC Industry Development Seminar and the 22nd China IC Manufacturing Annual Conference, Zhou Weiping, Executive Vice President of Shanghai Hua Hong Grace Semiconductor Manufacturing Co., Ltd., introduced the layout of Hua Hong Group's manufacturing bases.

Since building the first 8-inch production line in mainland China in 1997, Hua Hong has set up seven factories. Huahong Plant 1, Huahong Plant 2, and Huahong Plant 3 are 8-inch production lines, with a total monthly production capacity of 175,000 pieces; Huahong Plant 5, Huahong Plant 6, and Huahong Plant 7 are 12-inch production lines, with a total monthly production capacity. It is 45,000 pieces, and the monthly production capacity is 70,000 pieces under construction.

In terms of process, the most advanced process of Hua Hong No. 1 Factory is 95nm, the latest process of Hua Hong No. 2 Factory is 0.18um, and the latest process of Hua Hong No. 3 Factory is 90nm; the 12-inch process guide line, the leading process research and development has entered 7-5nm; The process node of Hua Hong Factory 5 is 55-28nm, the process node of Hua Hong Factory 6 is 28-14nm, and the process node of Hua Hong Factory 7 is 90-55nm.

AD8505ARJZ AD8532ARZ-REEL7 AD8534ARZ-REEL AD8541ARTZ-REEL7 AD8542ARZ-REEL7 AD8544ARUZ AD8544ARZ AD8613AUJZ AD8617ARZ-REEL7 AD8692ARZ-REEL7 AD8694ARZ-REEL7 ADA4505-1ARJZ

Since the launch of AirPods, TWS earphones have been widely recognized by end consumers for their convenience, intelligence, and improvements in performance such as charging battery life, sound quality transmission, and connection speed, and market demand has shown an explosive growth trend.

According to Qualcomm's recently released "2019 Usage Status Survey Report" of audio technology, sound quality has become the primary purchasing driver for all consumer audio equipment categories for the fourth consecutive year, and the vast majority of respondents believe that the sound quality of wireless headphones has reached or exceeded. wired device.

Specifically in terms of shipments, according to Counterpoint data, the global TWS headset shipments in 2018 were 46 million pieces, and the shipments in the first quarter of 2019 were about 18 million pieces, a month-on-month increase of 40%; it is expected to ship by 2020. It will be 129 million pieces, with a compound annual growth rate of 67%.

The rise of the market, Qualcomm launched three high-end and low-end chips

At present, audio products are at a turning point in the overall transition from wired to wireless, and at the same time, they are rapidly evolving to the ultimate experience brought by true wireless products. ) etc. to meet changing user needs is critical.

As one of the mainstream manufacturers of TWS headset chips, Chris Havell, senior director of product marketing for Qualcomm's personal audio business, said that the true wireless headset market is rapidly rising, and the market will see significant changes in this trend from now to next year or in the next few years. ; At the same time, technologies such as left and right earphone synchronization must be integrated into the small space that can be inserted into the ear, which is a big challenge.

For Qualcomm, Chris Havell said, we are facing how to innovate to meet these needs. For a true wireless earbud product, we need to consider different aspects of the characteristics. First, a true wireless earbud needs to support voice assistants and active noise cancellation to eliminate background noise; at the same time, it needs to have the ability to support all-day battery life, and the left and right earbuds can be freely interchanged. In addition, TWS headphones also need to have high-resolution sound quality, and low latency to support smooth gaming or watching videos, and they also need a very robust connection that is not easy to disconnect.

Chris Havell emphasized that each different application scenario has different needs or purposes, as well as different types of technologies, and we need to integrate these technologies into TWS earbuds to meet these application scenarios. Qualcomm is helping consumers use audio products smoothly in different application scenarios, bringing diversified solutions to the market.

To this end, Qualcomm's top Bluetooth audio SoC QCC5100 series, mid-range QCC303X series, and entry-level QCC302X series products, based on the three different grades of SoCs provided by Qualcomm, can create a variety of TWS products at different price points.

"We will also assist customers in the process of putting these three SoC products on the market." Chris Havell said that in terms of product development and innovation for customers, we can provide reference designs and tools, which are used to quickly bring products to market. It also provides a complete set of software solutions to support customers to choose the required technologies and features, and create products that meet their own requirements, such as products with lower prices, products that support differentiated features such as support for active noise reduction and voice assistants, or surround sound-enabled in-ear products for the high-end market.

It is worth emphasizing that if the audio products and mobile terminals used by the user are equipped with Qualcomm chips, they can fully combine the technical strengths of the two, which can better complete the synchronization, bring the lowest delay and bring More robust connectivity.

Incorporated into the mid-to-high-end Snapdragon platform, TWS+ products will emerge

At present, Qualcomm is cooperating with many terminal companies around the world, and at the same time launching TWS headphones in the domestic market, including vivo. Not long ago, at the vivo new product launch conference, the new vivo TWS Earphone true wireless Bluetooth headset was launched, equipped with Qualcomm SoC QCC5100 series high-end chips.

Chris Havell said that Qualcomm had early contact with vivo on the QCC5100 series platform. We discussed their expectations for product design, and vivo also proposed some very creative ideas. Our latest QCC5126 flagship platform fits very well with vivo's design philosophy for their ideal product. On this new platform, we work very closely with vivo to jointly leverage the innovative features of the new platform. vivo is one of our very important customers on this platform.

However, Qualcomm has released the QCC3000 to 5000 series, and now the vivo TWS is the first true wireless headset that supports the TWS+ mode. In this regard, Chris Havell believes that from a technical point of view, TWS+ and standard TWS are not the same. TWS+ transmits an independent audio stream from the phone to each earbud, TWS transmits an audio stream to one earbud, and then relays it from one earbud to the other earbud. Therefore, from a technical point of view, these are two different solutions, which also require Qualcomm technical support at both ends of the audio transmission stream, that is, the mobile phone side and the earphone side. This new technology has many advantages. Especially better stability and lower latency.

In fact, TWS+ is different from the conventional connection technology. Qualcomm calls it dual connection, that is, the two links are directly output to the left and right earphones. Its advantage is that there is no distinction between the main and auxiliary headphones, and the left and right headphones can be seamlessly switched. From the perspective of connection technology, this is Qualcomm's leading technological advantage.

Chris Havell revealed that our innovation was realized during the launch of the QCC5100 series, and then we collaborated with colleagues in the mobile department to introduce the technology to mobile phone chips. The first to incorporate this technology is the Snapdragon 845 mobile platform. At present, the flagship Snapdragon 855, Snapdragon 845, high-end Snapdragon 730/730G, Snapdragon 712, Snapdragon 710, and mid-range Snapdragon 675, Snapdragon 670, and Snapdragon 665 support this technology.

As the most processor platform used by current mobile phone manufacturers, Qualcomm Snapdragon will have a more obvious effect on the application of Qualcomm TWS chips. The Qualcomm Snapdragon platform started with the earliest Snapdragon 845, and then the subsequent Snapdragon 710, Snapdragon 670, Snapdragon 675, Snapdragon 855, and Snapdragon 730/730G, all began to support TWS+ technology.

In Chris Havell's view, Qualcomm has expanded TWS+ technology to many mobile phone levels. In order to promote this new technology in the market, it also requires the technical capabilities of Qualcomm's cross-level chips. This is what we have in the past 18 months. direction of efforts.

At this stage, the application scenarios of TWS headsets are mainly used with smartphones. Although global smartphone shipments have declined since the beginning of this year, with the continuous advancement of global 5G network construction, 5G mobile phone shipments will grow rapidly and become an important driving force for boosting smartphone shipments. As more and more mobile phone platforms begin to support the TWS+ technology, more and more devices will emerge in the terminal, and earphones from different manufacturers can also use this advanced technology. The market for TWS earphones is expected to explode further.

Hong Kong Xinrui Electronics Co., Ltd., 18 years of professional component distributors (authorized and non-authorized brands), one-stop terminal manufacturer support: (quality assurance and integrity management) is the company's commitment to provide customers with brand original semiconductors, electronic components Terminal supporting market, focusing on ESD/TVS electrostatic protection diodes, LDO low-power voltage regulators, MOS tubes, battery charging and management power supplies, LEDs, optocouplers, resistors and capacitors, PCB solutions (wireless Bluetooth solutions, Bluetooth sports version solution one-stop, speakers, wireless power bank).

Main products: ESD electrostatic diodes, TVS diodes, battery charging and management power supplies, MOS tubes, LDO low-power voltage regulators.

Company: Hong Kong Xinrui Electronics Co., Ltd.

Contact: Miss Yao

Mobile: 13725590222

Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen

Company website: www.xrdz-hk.com

Hong Kong Xinrui Electronics Co., Ltd. part of the spot:

TLV70433DBVR、TP4101、TP5100、TP4056、RT9013-33PB、TPS73618DBVR、MIC5255-3.0YM5、CDSOT23-T36C、CDSOT23-24C、TL431CDBZR、TL431IDBZR、TLV1117CDCYR、LM317EMPX、NCP1117ST33T3G、NCP1117ST50T3G、PESD5V0V1BL、PESD5V0V1BSF、PESD2CAN、PESD5V0S1BA、PESD12VS2UT、PESD15VL2BT , PESD36VS2UT, PESD3V3L1BA, PESD24VL2BT, IP4220CZ6, IP4223CZ6, BCP56-16, BCP51-16, BSN20, uClamp0511T.TCT, SRV05-4.TCT, RCLAMP0531T.TCT, RCLAMP0502A.TCT, SD05C.TCT, SRAMP05.TCT 、ESD5Z2.5T1G、ESD5Z3.3T1G、CM1213A-01SO、CM1213A-04SO、NTR4501NT1G、NTR4502PT1G、NTR4170NT1G、NTR4171PT1G、RLST23A032C、RLST23A0122C、RLST23A052C、PRTR5V0U2X、GBLC03CI-LF-T7、GBLC03C-LF-T7、GBLC05CI-LF-T7 , GBLC05C-LF-T7, GBLC08CI-LF-T7, GBLC08C-LF-T7, GBLC12CI-LF-T7, GBLC12C-LF-T7, GBLC15CI-LF-T7, GBLC24CI-LF-T7, GBLC24C-LF-T7, PSD03C -LF-T7, PSD05-LF-T7, PSD05C-LF-T7, PSD08C-LF-T7, PSM712-LF-T7, AO3400, AO3400A, AO3401A, AO3402, TPSMB6.8CA-E3/52, TPSMB6.8A, TPSMB47A , TPSMB43A, TPSMB39A, TPSMB36A, TPSMB33A, TPSMB30A, STTH208, , IRLML2502TRPBF, TP4101, IRLML6401TRPBF, TLV70433DBVR, PESD5V0S1BB, PSM712-LF-T7, NTR4171PT1G, SGM2 036-3.3YUDH4G/TR, SGM2036-1.8YUDH4G/TR, DMN2046U-7, etc.

For more models, please inquire:

Hong Kong Xinrui Electronics Co., Ltd. is a professional supplier of integrated circuits and has many years of sales experience in the bank! With a large stock of stock, integrity-based, customer first, the quality of products for customers!

Due to the large number of company models, it is impossible to upload them one by one. If you can't find the product you want on the website, please contact the salesperson. Our company can provide electronic components distribution service.

Company: Hong Kong Xinrui Electronics Co., Ltd.

Contact: Miss Yao

Mobile: 13725590222

Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen

Company website: www.xrdz-hk.com

AOZ8808DI-05、AOZ1284PI、AOZ1280CI、AOT11N70、AON7934、AON7544、AON7534、AON7524、AON7520、AON7506、AON7423、AON7421、AON7418、AON7410、AON7409、AON7407、AON7405、AON7403、AON7401、AON7296、AON7264E、AON6522、AON6512、AON6508、 AON6504、AON6414AL、AON6262E、AON5820、AON2801、AOD603A、AOD516、AOD484、AOD482、AOD478、AOD444、AOD4185、AOD4184L、AOD4184A、AOD4132、AOD413A、AOD409、AOD417、AOD407、AOD403、AO8822、AO8810、AO3414、AO3402、AO4606、 AO4485、AO4453、AO4447AL、AO4443、AO4468、AO4435、AO4421、AO4419、AO4407AL、AO4406AL、AO4354、AO4292、AO4264E、AO3485、AO3481、AO3480、AO3423、AO3422、AO3416、AO3415AL、AO3415、AO3407A、AO3401A、AO3400A

Hong Kong Xinrui Electronics Co., Ltd. is a professional supplier of integrated circuits and has many years of sales experience in the bank! With a large stock of stock, integrity-based, customer first, the quality of products for customers!

Due to the large number of company models, it is impossible to upload them one by one. If you can't find the product you want on the website, please contact the salesperson. Our company can provide electronic components distribution service.

Company: Hong Kong Xinrui Electronics Co., Ltd.

Contact: Miss Yao

Mobile: 13725590222

Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen

Company website: www.xrdz-hk.com The fastest shipping speed ever.