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Manufacturer: Xilinx

Product Category: FPGA - Field Programmable Gate Array

RoHS: Details

Product: Virtex-6

Number of logic elements: 314880

Number of input/output terminals: 600 I/O

Operating supply voltage: 1 V

Minimum operating temperature: 0 C

Maximum operating temperature: + 85 C

Installation style: SMD/SMT

Package/Case: FCBGA-1156

Data rate: 6.6 Gb/s

Series: XC6VSX315T

Trademark: Xilinx

Distributed RAM: 5090 kbit

Embedded Block RAM - EBR: 25344 kbit

Maximum operating frequency: 1600 MHz

Moisture Sensitivity: Yes

Number of Transceivers: 24 Transceiver

Product Type: FPGA - Field Programmable Gate Array

Factory Packing Quantity: 1

Subcategory: Programmable Logic ICs

Brand Name: Virtex

According to a report by Nikkei BP, TSMC's 28nm process classification can be roughly divided into: HP, HPM, HPL, and LP, etc., to meet the diverse needs of the market. When it came to 20nm, there were only The next process is available. In other words, from mobile devices to communication base stations, the process must be integrated into a variety of applications. The advantage of this approach is that it is easier to achieve the advantage of economies of scale. The popularity of 20nm technology is even faster. It may be faster than 28nm. Judging from TSMC's existing first-line customer base, it is not too difficult to achieve such a goal. However, based on the years of experience of Chairman Zhang Zhongmou, since both 20nm and 16nm FinFETs are predetermined process blueprints, it is necessary to improve their yields to ensure that the produced chips can meet the needs of customers.