SI2302CDS-T1-GE3 20V 710mW SOT-23-3 Power MOSFET

SI2302CDS-T1-GE3 Product Specifications

Standard package 3,000

FET Type MOSFET N-Channel, Metal Oxide

FET FeaturesLogic Level Gate

Drain-to-source voltage (VDSS) 20V

Current - Continuous Drain (Number) @ 25°C 2.6A

Rds (max) @ ID, VGS57 mOhm @ 3.6A, 4.5V

VGS(TH) (max) @Id850mV @250µA

Gate Charge (Qg) @ VGS5.5nC @ 4.5V

Input Capacitance (Ciss) @ Vds -

Power - 710mW max

Mounting Type Surface Mount

Bag/Box TO-236-3, SC-59, SOT-23-3

Supplier Device Package SOT-23-3 (TO-236)

Packaging Tape & Reel (TR)

Packaging 3SOT-23

Channel Mode Enhancement

Maximum drain-source voltage 20 V

Maximum continuous drain current 2.6 A

RDS - at 57@4.5V mOhm

Maximum gate-source voltage ±8 V

Typical turn-on delay time 8 ns

Typical rise time 7 ns

Typical turn-off delay time 30 ns

Operating temperature -55 to 150 °C

Install the Surface Mount

Standard Packaging Tape & Reel

Product TypeMOSFET

RoHSRoHS Compliant

Transistor Polarity N-Channel

Drain-source breakdown voltage 20 V

Source breakdown voltage +/- 8 V

Continuous drain current 2.6 A

Anti-Drain Source RDS(ON) 0.057 Ohms

Configure Single

Maximum operating temperature + 150 C

Installation style SMD/SMT

Package/Enclosure SOT-23-3

Package Reel

Fall Time 7 ns

Minimum Operating Temperature - 55 C

Power dissipation 710 mW

Rise time 7 ns

Factory packing quantity 3000

Part number alias SI2302CDS-GE3

Maximum gate-source voltage ±8

Packing width 1.4(Max)

PCB3

Maximum Power Dissipation 710

Maximum drain-source voltage 20

EU RoHS Directive Compliant

Maximum drain-source resistance 57@4.5V

Number of components per chip 1

Minimum operating temperature -55

Supplier Package SOT-23

Standard package name SOT-23

Maximum working temperature 150

Channel TypeN

Packing length 3.04(Max)

Number of pins 3

Packaging height 1.02(Max)

Maximum continuous drain current 2.6

Lead Shape Gull-wing

P(TOT) 0.71W

Match code SI2302CDS

Unit pack 3000

Standard lead time 15 weeks

MOQ 3000

Polarized N-CHANNEL

Lead-free DefinRoHS-conform

I (D) 2.6A

V(DS) 20V

R (on DS) 0.075Ohm

FET FeaturesLogic Level Gate

Mounting Type Surface Mount

Current - Continuous Drain (Id ) @ 25 °C 2.6A (Ta)

Vgs(th) (max) @Id850mV @250µA

Supplier Equipment Package SOT-23-3 (TO-236)

On-state Rds (max) @ Id, V GS57 mOhm @ 3.6A, 4.5V

FET Type MOSFET N-Channel, Metal Oxide

Power - 710mW max

Drain to source voltage (Vdss) 20V

Gate Charge (Qg) @ VGS5.5nC @ 4.5V

Package/Enclosure TO-236-3, SC-59, SOT-23-3

RoHS Directive Lead free / RoHS Compliant

Other namesSI2302CDS-T1-GE3CT

CategoryPower MOSFET

Dimensions 3.04 x 1.4 x 1.02mm

Height 1.02mm

Length 3.04mm

Maximum drain-source resistance 0.057 Ω

Maximum power dissipation 0.71 W

Packaging Type SOT-23

Typical Gate Charge @ VGS3.5 nC V @ 4.5

Width 1.4mm

RDS(ON) 57 mOhms

Drain current (max) 2.6 A

Frequency (Max) Not Required MHz

Gate-source voltage (max) ~8 V

Output power (max) Not Required W

Noise Figure Not Required dB

Drain-source on-resistance 0.057 ohm

Operating temperature range -55C to 150C

Polarity N

Type Power MOSFET

Number of components 1

Operating temperature classification Military

Drain efficiency Not Required %_Drain-source turn-on voltage 20 V

Power Gain Not Required dB

Arc hardeningNo

Continuous Drain Current Id: 2.9A

Drain Source Voltage Vds: 20V

On Resistance Rds(on): 57mohm

Rds(on) Test Voltage Vgs:8V

Threshold Voltage Vgs: 850mV

Power consumption: 710mW

Operating Temperature Min:-55°C

Operating Temperature Max: 150°C

Transistor Case Style: SOT-23

No. of Pins: 3

MSL:-

Current Id Max: 2.9A

Junction Temperature Tj Max: 150°C

Operating temperature range: -55°C to +150°C

Termination Type: SMD

Voltage Vds Type: 20V

Voltage Vgs Max:850mV

Voltage Vgs Rds on Measurement: 4.5V

Voltage Vgs th Max: 0.85V

Voltage Vgs th Min: 0.4V

AD8505ARJZ AD8532ARZ-REEL7 AD8534ARZ-REEL AD8541ARTZ-REEL7 AD8542ARZ-REEL7 AD8544ARUZ AD8544ARZ AD8613AUJZ AD8617ARZ-REEL7 AD8692ARZ-REEL7 AD8694ARZ-REEL7 ADA4505-1ARJZ

Since turning to a comprehensive data-centric innovation strategy, Intel is navigating faster. As an important pawn FPGA, Intel has also accelerated its new pace. Recently, Intel announced the shipment of the new Stratix 10 DX FPGA, and the Agilex series based on the 10nm process has been shipped to customers participating in the early use program and will be officially mass-produced next year.

Heterogeneous solutions address acceleration challenges

“As we all know, data has grown exponentially, and customers are looking to monetize that data, through new applications and speeding up existing applications, and leveraging this massive amount of data requires a heterogeneous approach Patrick Dorsey, vice president of Intel's Network and Custom Logic Division and general manager of FPGA and power product marketing, pointed out the advantages of heterogeneous computing in the data age, "This heterogeneous architecture includes CPU, GPU, AI chips and FPGAs. Only by addressing specific problems in a comprehensive and targeted manner can a complete solution be created.”

In heterogeneous platforms, FPGA is absolutely "indispensable". With the slowdown of Moore's Law and the development of big data, AI, 5G, autonomous driving, etc., unprecedented requirements for computing power and bandwidth have been put forward. At the same time, new algorithms and new frameworks are emerging one after another. To cope with this change, it is necessary to be flexible. FPGA. It is estimated that by 2022, the FPGA market will reach a scale of 7.5 billion US dollars, with a compound annual growth rate of 9%.

The two major indicators of the data center need to work together: that is, the network throughput must be increased, and the latency must be reduced. Patrick Dorsey said that as servers require more efficient computing to handle AI and other related loads, hardware accelerators including FPGAs, GPUs, etc. are widely used, but their effective performance depends largely on CPU, available system memory and Communication bandwidth and latency between accelerators.

As a result, after Intel included Altera in the bag four years ago, Intel, which can build an "all-round heterogeneous platform", has announced the establishment of the world's largest FPGA China Innovation Center in Chongqing, China, and has announced one of the FPGA portfolio families. The new product Stratix 10 DX leverages the "combination punch" of the Xeon processor Xeon + Stratix 10 DX to meet the acceleration challenge.

Xeon+FPGA combination brings high memory expansion capability

For this new combination, Patrick Dorsey analyzed that its biggest advantages are low latency, high bandwidth and memory expansion capabilities. Stratix 10 DX is not only Intel's first FPGA to support PCIe Gen4, but also provides key value by taking a hyperpath interconnect UPI with Xeon processors to rapidly expand memory, such as supporting 8 independent Optane DCs Persistent memory controller with a total capacity of up to 4TB.

Patrick Dorsey explained that whether the memory is DDR or Optane, by sharing memory between the Xeon processor and FPGA, there is no need to migrate or copy data during the sharing process, because data migration and copying will bring high costs, and at the same time It will also degrade system performance. From the new memory pyramid level, different types of memory include storage, persistent memory and normalized memory, Stratix 10 DX can improve the performance of high-level memory at the top, such as Optane and DRAM.

For the optimization of different application performance, Patrick Dorsey listed specific numbers: In edge computing applications, Stratix 10 DX has a 37% faster response speed than using PCIe only after having UPI. In network applications, due to the support of PCIe Gen4, the bandwidth is doubled compared to the previous generation of PCIe Gen3, making data processing faster, and also having Ethernet functions. In terms of data center, the total bandwidth can be increased by 2.6 times through Intel's heterogeneous Xeon+FPGA computing, coupled with the interconnection of PCIe Gen4 and UPI.

While Intel has announced its exit from the 5G baseband business, it remains focused on infrastructure. For official commercial 5G, Stratix 10 DX is also promising. Patrick Dorsey introduced: "Stratix 10 DX can be applied to 5G base stations, and its benefits are reflected in low latency, especially when 5G goes to the data center and is applied in vRAN, with Xeon processors, it can accelerate many network functions."

At present, the new FPGA is interconnected with the Xeon processor through UPI. Patrick Dorsey mentioned the integration of packaging in the future. Diversified FPGAs can allow customers to flexibly configure and optimize, and integrated packaging is not necessary.

Next-Generation Agilex Enables Many Innovations

The Stratix 10 DX FPGA that has been offered is just a fortitude. Intel's complete roadmap for FPGAs has surfaced. The Agilex FPGA series has also been shipped and will be mass-produced next year.

It is reported that Intel's Agilex FPGA series integrates almost all of Intel's current technology and innovation advantages, including architecture, packaging, process, development tools, and a fast way to reduce power consumption through eASIC technology.

Patrick Dorsey emphasized that Agilex uses Intel's 10nm process, which can match the industry's 7nm level. In addition, Agilex will support the next-generation UPI, an open standard interface based on CXL, and will also support the fifth-generation PCIe. Other innovations include the second-generation HyperFlex architecture and DSP innovation. He also emphasized that UPI can only be used with Xeon processors at present, and CXL will be public in the future and can be adapted to any processor. And the transition from UPI to CXL only needs to update the hardware interface and some software. The most important thing is that developers can already use UPI for application development, and customers can also seamlessly transfer and iterate to CLX.

Looking at the two giants in the FPGA field, they have made the same choice in the digital age, and Intel's heterogeneous platform is obviously an important bargaining chip. Patrick Dorsey finally pointed out that it is not enough to have only four architectures. In order to ensure that customers can make full use of the advantages of heterogeneity, Intel provides developers with product roadmaps and one-API unified application development interfaces, etc. End-to-end hardware deployment works closely with customers.

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Contact: Miss Yao

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Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen

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Company: Hong Kong Xinrui Electronics Co., Ltd.

Contact: Miss Yao

Mobile: 13725590222

Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen

Company website: www.xrdz-hk.com

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Hong Kong Xinrui Electronics Co., Ltd. is a professional supplier of integrated circuits and has many years of sales experience in the bank! With a large stock of stock, integrity-based, customer first, the quality of products for customers!

Due to the large number of company models, it is impossible to upload them one by one. If you can't find the product you want on the website, please contact the salesperson. Our company can provide electronic components distribution service.

Company: Hong Kong Xinrui Electronics Co., Ltd.

Contact: Miss Yao

Mobile: 13725590222

Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen

Company website: www.xrdz-hk.com The fastest shipping speed ever.