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2022-09-24 21:37:18
XC7K410T-2FFG676I original channel
General information
Datasheet 7 Series FPGA Overview;_Kintex-7 FPGA CES Errata;_Kintex-7 FPGAs Datasheet;_Standard Package 1
packing tray
Active Part Status
Category Integrated Circuit (IC)
Product Family Embedded - FPGA (Field Programmable Gate Array)
Series Kintex®-7
Specification
LAB/CLB number 31775
Logic element/unit count 406720
Total RAM bits 29306880
I/O count 400
Voltage - Power 0.97V ~ 1.03V
Mounting Type Surface Mount Type
Operating temperature -40°C ~ 100°C (TJ)
Package/Case 676-BBGA, FCBGA
Vendor Device Package 676-FCBGA (27x27)
In the era of rapidly emerging big data and artificial intelligence, ACAP is ideal for accelerating a wide range of applications, including video transcoding, databases, data compression, search, AI inference, genomics, machine vision, computational storage, and network acceleration. Software and hardware developers will be able to design ACAP-based products for endpoint, edge and cloud applications. The first ACAP product line will be a product line code-named "Everest (Mount Everest)" developed using TSMC's 7-nanometer process technology, which will be tape-out by the end of this year.