-
2022-09-24 21:37:18
XC7K325T-1FBG676C original channel
General information
Data Sheet 7 Series FPGA Overview;_
Kintex-7 FPGA CES Errata;_
Kintex-7 FPGAs CES9937 Errata;_
Kintex-7 FPGAs Datasheet;_
Standard Package 1
packing tray
Active Part Status
Category Integrated Circuit (IC)
Product Family Embedded - FPGA (Field Programmable Gate Array)
Series Kintex®-7
Specification
LAB/CLB number 25475
Logic elements/units 326080
Total RAM bits 16404480
I/O count 400
Voltage - Power 0.97V ~ 1.03V
Mounting Type Surface Mount Type
Operating temperature 0°C ~ 85°C (TJ)
Package/Case 676-BBGA, FCBGA
Vendor Device Package 676-FCBGA (27x27)
Beijing, China, August 22, 2019 -- Xilinx, Inc. (NASDAQ: XLNX), the global leader in adaptive and intelligent computing, today announced the world's largest-capacity FPGA – the Virtex UltraScale+ VU19P , thus further expanding its 16 nanometer (nm) Virtex? UltraScale+? product line. The VU19P has 35 billion transistors, the highest logic density and the largest number of I/Os on a single chip ever, to support the simulation and prototyping of the most advanced ASIC and SoC technologies in the future, and will also widely support test and measurement, computing, network , aerospace and defense related applications.
contact us
Switchboard: 400-801-6772
Tel: 86-0755-82557010
Fax: 86-0755-23890257
Enterprise QQ: 2852356918
E-mail: sales@yhjgic.com
SKYPE: sales@yhjgic.com
Address: 804-806, Han's Yunfeng Office Building, Banxuegang Avenue, Longgang District, Shenzhen