PESD5V0S1BA 5.5V SOD-323 TVS original authentic

RohsLead free / RoHS Compliant

Standard package 3,000

Voltage - Reverse Isolation (typ) 5V

- Breakdown voltage 5.5V

Power (Watts) 130W

Polarization Bidirectional

Mounting Type Surface Mount

Bag/Box SC-76, SOD-323

Supplier Device Package SOD-323

Packaging Tape & Reel (TR)

Type TVS

Number of pins 2

Direction Type Bi-Directional

Number of components per chip 1

ESD protection voltage 30@Contact Disc/10@HBM kV

Maximum working voltage 5 V

Maximum leakage current 0.1 uA

Capacitance value 45 pF

Minimum operating temperature -65 °C

Maximum operating temperature 150 °C

Install the Surface Mount

Package Tape & Reel (TR)

Voltage - Clamp (Max) @ IPP14V

Mounting Type Surface Mount

Number of bidirectional channels 1

Supplier Equipment Package SOD-323

Voltage - Breakdown (min) 5.5V

Voltage - reverse isolation (standard value) 5V (Max)

Application ScopeGeneral Purpose

Operating temperature -65°C ~ 150°C

Capacitance @ Frequency 35pF @ 1MHz

Standard package 3,000

Power cord protectionNo

Power - Peak Pulse 130W

Current - Peak Pulse (10/1000µs) 12A (8/20µs)

Package/Enclosure SC-76, SOD-323

RoHS Directive Lead free / RoHS Compliant

Other name568-4053-1

Polarity Bidirectional

Clamping voltage 10 V

Product CategoryTVS Diodes - Transient Voltage Suppressors

Dimensions 1.35 (Max) mm W x 1.8 (Max) mm L

Factory packing quantity 3000

Series PESD5V0S1BA

Termination Type SMD/SMT

Channel 1 Channel

Working voltage 5 V

Capacitance 35 pF

Breakdown voltage 9.5 V

RoHSRoHS Compliant

Package/Enclosure SOD-323

Peak surge current 12 A

Part Number Alias PESD5V0S1BA T/R

Peak pulse power dissipation 130 W

Arc hardeningNo

Mounting style Surface Mount

The maximum operating temperature is Celsius. 150C

Operating temperature sensitivity. -65C

Product length (mm) 1.8 mm

Product thickness (mm) 1.35 mm

Product height (mm) 1.05 mm

Suppressor Type TVS

Configure Single

Leakage current 0.1uA

Working voltage 5V

Leakage current (max) 0.1uA

Operating temperature range -65C to 150C

Number of components 1

Operating temperature classification Military

Reverse breakdown voltage 5.5 V

Peak pulse current 12 A

Reverse off-state voltage 5 V

Test current (It) 1 mA

Working voltage (max) 5V

Diode Type: Bidirectional TVS

Clamping Voltage Vc Max:14V

Diode Case Style: SOD-323

No. of Pins: 2

SVHC: No SVHC (20-Jun-2013)

Alternate Case Style: SC-76

Breakdown Voltage Max:9.5V

Breakdown Voltage Min: 5.5V

Breakdown Voltage Range:5.5V to 9.5V

Breakover Voltage Min: 5.5V

Capacitance Cd @ Vr Max: 45pF

Capacitance Cd @ Vr Typ: 35pF

Clamping Voltage @ 8/20μs Max:14V

Diode Configuration: Bidirectional

On September 10, the China Semiconductor Materials Innovation and Development Conference was officially held in Beilun, Ningbo. Dr. Fei Lu, Executive Vice President of Shanghai Xinsheng Semiconductor, pointed out in his speech that there are currently 14 companies in China that have officially announced their involvement in the 300mm large silicon wafer industry, with a total of more than The current number of 300mm silicon wafer companies in the world. The planned total monthly production capacity of these companies is 6.92 million pieces, which is higher than the current world production capacity.

Fei Lu pointed out that in the 42 years from 1976 to 2018, it increased by 168 times, and global integrated circuit sales rose from US$2.9 billion to US$470.3 billion, with a compound annual growth rate of 12.8%. The two fastest growing stages are driven by computers and mobile phones, respectively.

Fei Lu said that silicon wafers still dominate the semiconductor material, and more than 90% of chips and sensors are based on semiconductor monocrystalline silicon. At present, the monthly production capacity of 300mm large silicon wafers is 6.5 million pieces, and as the number of Fabs increases, the production capacity of large silicon wafers will continue to grow.

Fei Lu further pointed out that the production technology of large silicon wafers includes crystal pulling, cutting, grinding, polishing and epitaxy. The steps seem simple, but there are many parameters that need to be considered, and process engineers must take these parameters into account every day. The core technology of silicon wafers is a process of challenging limits. Fei Lu said that this is mainly reflected in four aspects: crystal growth, surface cleaning, intra-chip flattening and metal/impurity elimination.

Regarding the status of domestic large silicon wafers, Fei Lu revealed that there are currently 14 companies officially announced to be involved in the 300mm large silicon wafer industry in China, and the total number exceeds the current number of 300mm silicon wafer companies in the world. The planned total monthly production capacity of these companies is 6.92 million pieces, which is higher than the current world production capacity.

These companies have different capitals, including large funds, state-owned assets, local government funds, national project funds, foreign capital, private enterprises and market capital. Fei Lu said that the production capacity planned by these companies is too high, and it may not be so easy to realize.

Finally, Fei Lu also introduced the current situation of Shanghai Xinsheng Semiconductor. As the first domestic large-scale silicon wafer mass production company, Xinsheng's existing monthly production capacity has reached 100,000 wafers, the existing production room can hold a monthly production capacity of 300,000 wafers, and the existing factory can build a monthly production capacity of 600,000 wafers. The land can reach a production capacity of 1 million pieces/month. Fei Lu said that Xinsheng will achieve the leap from "0" to "1" for 300mm domestic large silicon wafers, and continuously improve the depth and breadth of products to meet customer needs.

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Hong Kong Xinrui Electronics Co., Ltd. is a professional supplier of integrated circuits and has many years of sales experience in the bank! With a large stock of stock, integrity-based, customer first, the quality of products for customers!

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Company: Hong Kong Xinrui Electronics Co., Ltd.

Contact: Miss Yao

Mobile: 13725590222

Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen