Model XC2VP30-6FFG896C Brand XILINX

Device Logic Unit 30, 816

Device Logic Unit 30, 816

System programmability is

Lead Finish Tin/Silver/Copper

Maximum processing temperature 245

Maximum number of user I/Os 556

Mounting Surface Mount

MSL Level 4

Number of registers 27,392

Operating temperature 0 to 85°C

Number of needles 896

Product dimensions 31 x 31 x 2.8 mm

RAM bit 2 506 752 bit

Reprogrammable Support1

Screening Level Commercial

Speed class 6

Supplier Packaging FCBGA

Typical operating voltage 1.5000 V

A few days ago, Xilinx's new office address in Beijing settled in Pangu Daguan, and held a grand ceremony for entering the new site. At the ceremony, Mr. Tang Liren, Xilinx's Global Senior Vice President and Asia Pacific Executive President, once again emphasized Xilinx's commitment to the high-growth Chinese market. In order to continuously expand the company's influence in the Asia-Pacific region, Xilinx will open a China R&D center this time, and integrate local sales, marketing and application engineering into a unified office location. According to reports, the new site covers an area of 2,000 square meters and will provide strong support for local customers in Beijing, the entire Asia-Pacific region and even multinational customers.

The newly established R&D team in Beijing will be part of the Xilinx Programmable Platform Development Team, mainly responsible for the design of Xilinx software. The Programmable Platform Development Team is a global organization responsible for the development and delivery of Xilinx's flagship programmable platform.

The grand opening ceremony with the theme of "New Beginning, New Blueprint" was hosted by Mr. Tang Liren, with more than 100 customers, association leaders, professors, media and members of the Xilinx Ecosystem company network (including Xilinx University Program, distributors , IP providers, EDA, authorized training service providers, etc.) attended the ceremony.

Xilinx executives and guests brought wonderful keynote speeches, including Professor Meng Xianyuan of Tsinghua University, Hou Yibin, Vice President of Beijing University of Science and Technology, Shi Shi, Secretary General of TD Technology Forum, and Professor Luo Weixiong, Vice Chairman of China University Competition Expert Committee. At the same time, Xilinx's customers include Zhang Gang, Vice President of Beijing Digital Video Technology Co., Ltd., Dr. Chen Zhenyu, Vice President of R&D Department of Rigol, Gu Qiqiu, President of Greater China of Avnet Technology Co., Ltd., the global and local distributor of Xilinx, and Ketong. Group President Yuan Yi and others also expressed warm congratulations on Xilinx's relocation in Beijing and the establishment of its R&D center, and expressed strong confidence in achieving new growth based on the Xilinx innovation platform.

Mr. Tang Liren said: "We are very honored to invite so many old friends and colleagues to celebrate our new location in Beijing today. China's 12th Five-Year Plan is committed to building China into a global R&D hub to better meet the needs of China and the Global market demand. Xilinx is also committed to providing an important innovation platform for Chinese electronic system designers. To this end, we have launched a multi-year program to take full advantage of breakthrough technologies in the field of programmable system integration to accelerate the improvement of design Productivity. The perfect combination of Chinese talent and Xilinx technology and support will continue to deliver breakthrough products and technologies for years to come.”

28nm platform: Accelerating the transition to a "China-created" economy

Looking ahead to 2012 and beyond, the new 28nm programmable platform is expected to accelerate China's transformation from an early traditional "Made in China" to a vibrant "Created in China" economy. The positioning of Xilinx 7 series FPGAs and Zynq™-7000T EPP (Extensible Processing Platform) is precisely in line with the goal of being the core of engineering innovation and product differentiation for domestic and multinational companies, and can help them fully meet the needs of local and global markets. demand for electronic products.

The combined effect of long-term trends in economics, markets, and technology is driving demand for new families of devices, including: insatiable bandwidth demands from wider markets; ubiquitous connected computing needs; programmable technologies The imperative to drive widespread adoption of FPGAs minimizes upfront NRE costs and risks relative to traditional specialized devices.

In 2011, Xilinx actively invested in large, multi-year engineering design projects in the field of programmable system integration and accelerated design productivity, which can help engineers build better systems faster, including:

Technological innovation: Jointly launched a high-performance low-power (HPL) process with TSMC, making full use of the larger capacity advantages of smaller devices while reducing power consumption and cost. The world's first 28nm FPGAs were launched in March 2011. Compared with 40nm/45nm FPGAs, the power consumption and cost were reduced by half, and the system-level bandwidth was further improved.

3D Stacked Silicon Interconnection (SSI) technology: Actively enter the 3D-IC era based on TSV (Through Silicon Via) technology, and launched a large-capacity FPGA in October 2011. The Virtex-7 2000T has a capacity of up to 2 million logic cells, or about 20 million ASIC gates, achieving a new generation of high-density levels based on contemporary process technology. This means customers can replace 2 to 4 FPGAs with a single device, reduce total power consumption by 50 to 80 percent, and reduce bill of materials costs by 40 to 50 percent.

Scalable Processing Platform (EPP): A new family of systems-on-chips (SoCs), available in December 2011, that combine industry-standard ARM dual-core processing systems with Xilinx's 28nm programmable logic architecture to achieve higher System-level performance, flexibility and integration. For some applications, a single Zynq-7000 EPP device can replace the processor, DSP and FPGA.

Flexible Mixed Signal (AMS) Integration: Integrate programmable analog-to-digital converters with other analog functions to support a variety of AMS functions, from simple sensor monitoring to advanced data acquisition systems for industrial control. As a result, many designs can avoid a large number of discrete analog components, reducing bill-of-material costs by up to 50% for high-volume applications such as power conversion and motor control, while allowing the flexibility to customize the design implementation to fully meet system requirements.

Improve design productivity: Increase design productivity by 2 to 5 times relative to current methods through large-scale investments. Examples include easy IP portability, standards-based plug-and-play IP, next-generation RTL to Bits and advanced synthesis capabilities through a unified architecture.

Company: Yuhang Military Semiconductor Co., Ltd. website; http://www.yhjgic.com

Contact: Mr. Liu

Business Phone; 400-801-6772

Enterprise QQ;_ 2852760362

Tel: 0755-82557010

Welcome to inquire!

Address: Shenzhen Branch Office Room 2003, Bantian People's Government Sub-district Office, No. 5 Huancheng South Road, Longgang District, Shenzhen

Aerospace and military industry XILINX first-level agent spot distributor, price advantage original authentic!

Hello! Welcome to Yuhang Military Industry Group, Yuhang Military Industry is currently a well-known electronic component distributor in China, specializing in, Memory,

FPGA/CPLD diodes, optocouplers, single-chip microcomputers, processors, power chips, amplifiers, MOS tubes, and a series of original channels for superior products, the price exceeds that of peer agents!